Patents by Inventor Hiroki Oshida

Hiroki Oshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hollow package and method for manufacturing same
    Patent number: 11955394
    Abstract: A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: April 9, 2024
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Tadashi Naito, Nao Honda, Yoshihiro Hakone, Hiroki Oshida, Mamoru Sunada
  • Hollow Package And Method For Manufacturing Same
    Publication number: 20220068737
    Abstract: A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.
    Type: Application
    Filed: December 13, 2019
    Publication date: March 3, 2022
    Inventors: Tadashi Naito, Nao Honda, Yoshihiro Hakone, Hiroki Oshida, Mamoru Sunada