Patents by Inventor Hiroki SHOUNAI
Hiroki SHOUNAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240187029Abstract: A radio-frequency module includes a module substrate having major surfaces that are opposite to each other, a plurality of electronic components disposed at the major surface and at the major surface, and a plurality of post electrodes that are disposed at the major surface and that include a power supply terminal. The plurality of electronic components includes an integrated circuit that is disposed at the major surface and that includes a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor that is disposed at the major surface and that is coupled between the path connecting the power supply terminal to the control circuit and ground. The power supply terminal is disposed closer to the capacitor than any other post electrodes; and/or the capacitor is disposed closer to the power supply terminal than any other electronic component disposed at the major surface.Type: ApplicationFiled: February 15, 2024Publication date: June 6, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Yukiya YAMAGUCHI, Hiroki SHOUNAI, Atsushi HORITA
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Publication number: 20240187033Abstract: A radio frequency module includes a module substrate including a first main surface facing a second main surface, and a power amplifier including first and second power amplification devices and an output transformer, which includes a primary coil and a secondary coil, and a capacitor connected to the output transformer. One end of the primary coil is connected to the first amplification device. Another end of the primary coil is connected to the second amplification device. One end of the secondary coil is connected to an output terminal. The output transformer is disposed in or on the module substrate and is disposed closer to one of the first and second main surfaces than the other. The capacitor is disposed in or on the other of the first and second main surfaces and is disposed to overlap the output transformer when the module substrate is viewed in a plan view.Type: ApplicationFiled: February 15, 2024Publication date: June 6, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Hiroki SHOUNAI, Yukiya YAMAGUCHI, Atsushi HORITA, Hiroyuki YAMAMOTO, Yukiko MATSUDA
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Publication number: 20240178204Abstract: A radio-frequency module includes a module substrate including a first major surface opposite to a second major surface, a plurality of electronic components disposed at the first major surface and at the second major surface, and a power supply terminal disposed at the second major surface. The plurality of electronic components include an integrated circuit disposed at the second major surface and including a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor disposed at the second major surface and coupled between a path connecting the power supply terminal to the control circuit and ground. The integrated circuit is disposed closer to the capacitor than any other electronic component disposed at the second major surface and/or the capacitor is disposed closer to the integrated circuit than any other electronic component disposed at the second major surface.Type: ApplicationFiled: February 7, 2024Publication date: May 30, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Yukiya YAMAGUCHI, Atsushi HORITA, Hiroki SHOUNAI
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Publication number: 20240162923Abstract: A radio frequency circuit includes power amplifiers, a transformer, a filter having a band A as a pass band, a filter having a band B as a pass band, a filter having a band C as a pass band, matching circuits connected to one end of an output side coil, and matching circuits connected to the other end of the output side coil. The matching circuit includes a capacitor disposed at a first path, a switch connected to the first path and a ground, a switch and an inductor connected in series, and the matching circuit includes a capacitor disposed at a second path, and a switch and an inductor connected in series, and the matching circuit includes a switch connected to a third path and the ground.Type: ApplicationFiled: January 22, 2024Publication date: May 16, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Kenji TAHARA, Hiroki SHOUNAI, Kae YAMAMOTO, Ryo WAKABAYASHI
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Patent number: 11916529Abstract: A matching circuit performs output impedance matching for an amplifier that amplifies an input signal and outputs an amplified signal. The matching circuit includes a low pass filter and a high pass filter. The ground of the low pass filter and the ground of the high pass filter are isolated from each other.Type: GrantFiled: October 11, 2017Date of Patent: February 27, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yusuke Tanaka, Hiroki Shounai
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Publication number: 20220278703Abstract: An output matching circuit includes a plurality of inductor parts and is connected to an output pad electrode of a power amplifier. In a radio frequency module, a second principal surface of a first wiring board and a third principal surface of a second wiring board are on opposite sides of the radio frequency module. An external connection terminal is arranged on a fourth principal surface of the second wiring board. The power amplifier is arranged on a first principal surface) of the first wiring board. In theon output matching circuit, at least part of a first inductor part, which is the inductor part L1 closest to the output pad electrode of the plurality of inductor parts, is arranged on the first principal surface of the first wiring board.Type: ApplicationFiled: April 5, 2022Publication date: September 1, 2022Applicant: Murata Manufacturing Co., Ltd.Inventor: Hiroki SHOUNAI
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Patent number: 10560059Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.Type: GrantFiled: December 7, 2018Date of Patent: February 11, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hiroki Shounai, Yoshiki Kogushi
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Publication number: 20190109567Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.Type: ApplicationFiled: December 7, 2018Publication date: April 11, 2019Inventors: Hiroki SHOUNAI, Yoshiki KOGUSHI
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Patent number: 10181822Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.Type: GrantFiled: April 20, 2018Date of Patent: January 15, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hiroki Shounai, Yoshiki Kogushi
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Publication number: 20180241355Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.Type: ApplicationFiled: April 20, 2018Publication date: August 23, 2018Inventors: Hiroki Shounai, Yoshiki Kogushi
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Patent number: 9979357Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.Type: GrantFiled: May 4, 2017Date of Patent: May 22, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hiroki Shounai, Yoshiki Kogushi
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Publication number: 20180102754Abstract: A matching circuit performs output impedance matching for an amplifier that amplifies an input signal and outputs an amplified signal. The matching circuit includes a low pass filter and a high pass filter. The ground of the low pass filter and the ground of the high pass filter are isolated from each other.Type: ApplicationFiled: October 11, 2017Publication date: April 12, 2018Inventors: Yusuke TANAKA, Hiroki SHOUNAI
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Publication number: 20170338775Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.Type: ApplicationFiled: May 4, 2017Publication date: November 23, 2017Inventors: Hiroki SHOUNAI, Yoshiki KOGUSHI