Abstract: A wiring member includes a wiring body and a pattern. The wiring body includes a plurality of wire-like transmission members and a base material. The plurality of wire-like transmission members are fixed to the base material in an aligned state, and the pattern is provided on the wiring body. The pattern makes a two-dimensional position of at least a part of a portion related to the base material recognizable in the wiring body.

Abstract: Provided is an information processing device which is capable of suppressing a deterioration in accuracy of detecting an anomaly and accuracy of analyzing the anomaly, while suppressing an increase in an amount of data to be stored. The information processing system includes anomaly detection unit that collects event data indicating a predetermined event detected in a process of a device to be monitored, determines whether a predetermined index value related to the event exceeds a preset first threshold, and instructs enhanced monitoring of the device to be monitored and the process related to the event when the index value exceeds the first threshold, and collection instruction unit that determines an additional event being an event to be additionally monitored when the enhanced monitoring is instructed, and instructs the device to be monitored, which is subjected to the enhanced monitoring, to monitor the determined additional event.

Abstract: An optical transmitter includes: a light emitting part that emits light; and a lens that condenses the light emitted from the light emitting part. Further, the optical transmitter includes a multimode optical fiber that is optically coupled to the lens at one end and on which the light that is condensed by the lens is incident. Furthermore, the coefficient of the correlation between the distribution of the intensity of the light in the light emitting part and the distribution of the intensity of return light to the light emitting part, when the light is emitted from the light emitting part, is set to 0.5 or less.

Abstract: A monitoring unit that serves as a tire pressure monitoring device includes an acquisition section, a calculation section and a determination section. The acquisition section acquires air pressure data of plural tires mounted at a vehicle. On the basis of the air pressure data, for each tire, the calculation section calculates a first representative value relating to air pressures of the tire in a first period, calculates a second representative value relating to air pressures of the tire in a second period that is longer than the first period, and calculates a decrease level of the first representative value relative to the second representative value. The determination section determines that air pressure is decreasing when the decrease level of one tire is equal to or more than a first threshold value and the decrease level of another tire, which is different from the one tire, is less than the first threshold value.

Abstract: An object of the present invention is to provide a silicon oligomer having a novel function that has not been achieved by a conventional condensation product of water and a tetraalkoxysilane. Provided are a silicon oligomer represented by the following formula (I) and a production method therefor: wherein R1 to R10 each independently is an alkyl group or a hydroxyalkyl group, each having 1 to 4 carbon atoms; X1 to X3 each independently is a group represented by the following formula (II); n is 0 or 1; and m is an integer of 1 to 3 when n is 0, and m is 1 when n is 1: wherein A is an alkylene group having 2 to 4 carbon atoms which may be branched, and 1 is an integer of 1 to 3.

Abstract: An object of the present invention is to provide a silicon oligomer having a novel function that has not been achieved by a conventional condensation product of water and a tetraalkoxysilane. Provided are a silicon oligomer represented by the following formula (I) and a production method therefor: wherein R1 to R10 each independently is an alkyl group or a hydroxyalkyl group, each having 1 to 4 carbon atoms; X1 to X3 each independently is a group represented by the following formula (II); n is 0 or 1; and m is an integer of 1 to 3 when n is 0, and m is 1 when n is 1: wherein A is an alkylene group having 2 to 4 carbon atoms which may be branched, and 1 is an integer of 1 to 3.

Abstract: Provided is a semiconductor device that can suppress a temperature increase in beam leads while reducing the number of wiring lines and can suppress an increase in manufacturing costs. The semiconductor device is provided with a power module including an upper arm and a lower arm each configured by connecting in parallel a plurality of power elements and a plurality of rectifying elements. Current to one arm flows through a plurality of separately wired beam leads. A portion of the power elements and a portion of the rectifying elements in one arm form a pair and are connected by a common beam lead.

Abstract: An optical-electric composite cable includes an optical fiber, an inner tubular cover enclosing the optical fiber, a plurality of electric wires arranged outside the inner tubular cover, a binding member collectively bundling the plurality of electric wires, and an outer tubular cover covering an outer periphery of the binding member. A gap exists between the binding member and the outer tubular cover.

Abstract: An optical wiring substrate includes an insulation layer including a resin, a first conductor layer formed on the insulation layer and including a metal, the first conductor layer including an inclined surface that is inclined relative to an optical axis of an optical fiber. The insulation layer further includes an end surface that faces a cladding of the optical fiber. The inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber.

Abstract: A photoelectric conversion module includes: a photoelectric conversion element and an IC chip mounted on a mounting surface of a substrate; and an electrode provided on a side surface of the substrate, electrically connected to the IC chip, and having a concave shape sunk deeper than other portions of the side surface of the substrate.

Abstract: A photoelectric composite wiring module includes a flexible first substrate including a conductive line and an optical fiber mounted thereon along a longitudinal direction thereof, a second substrate including a recessed portion formed thereon to receive the conductive line and the optical fiber that protrude from an end portion of the first substrate, and an optical device mounted on the second substrate and optically coupled to the optical fiber. The recessed portion includes an opening on a mounting surface side of the second substrate to mount the optical device.

Abstract: An optical transmission module includes a first member having a bottom portion, sidewalls and an opening, a second member joined to a sidewall end surface of the first member and sealing the opening, a light-emitting element mounted on an inner surface of the second member, an interconnection formed on the inner surface of the second member and extending inside and outside the first member across the sidewalls of the first member, and electrodes formed on outer surfaces of the sidewalls of the first member. The second member transmits therethrough light outputted from the light-emitting element. One end portion of the electrode is electrically connected to one end portion of the interconnection extending outside the first member. The other end of the electrode is soldered to an interconnection formed on a substrate surface on which the optical transmission module is mounted.

Abstract: An optoelectrical composite cable includes an optical fiber; a resin inner cylinder that accommodates the optical fiber; a plurality of electrical lines arranged outside the inner cylinder so as to cover a surrounding of the inner cylinder, and a tubular outer cylinder that collectively covers the plurality of electrical lines. The plurality of electrical lines include pairs of electrical lines, and the electrical lines constitute at least one of the pairs of electrical lines have a larger outer diameter than the other electrical lines and are arranged at opposing positions, with the inner cylinder being interposed therebetween.

Abstract: A connector includes a plurality of pins, a circuit substrate where an electronic component is mounted onto the mounting surface, a connection member for electrically connecting the plurality of pins and the circuit substrate , and a housing for accommodating the circuit substrate and the connection member. The connection member includes a connection substrate section including a first substrate surface to which one end part of the circuit substrate is connected, and a positioning section for positioning the plurality of pins relative to a second substrate surface of the connection substrate section provided on the opposite side of the first substrate surface. The plurality of pins penetrate through the positioning section and are thereby electrically connected in a state where one end surface of each of the plurality of pins faces the second substrate surface of the connection substrate section.

Abstract: An optical transmission module includes a first member having a bottom portion, sidewalls and an opening, a second member joined to a sidewall end surface of the first member and sealing the opening, a connector member attachable to and detachable from the second member, a light-emitting element mounted on an inner surface of the second member, an interconnection formed on the inner surface and extending inside and outside the first member across the sidewalls of the first member, and electrodes formed on outer surfaces of the sidewalls. The second member transmits therethrough light outputted from the light-emitting element. One end portion of the electrode is electrically connected to one end portion of the interconnection extending outside the first member. The other end of the electrode is soldered to an interconnection formed on a substrate surface on which the optical transmission module is mounted.

Abstract: A ferrule fixing member includes a fixing member configured to fix a ferrule to hold an optical fiber to a retaining member including a retaining hole to insert the ferrule, a locked portion configured to be locked to a locking portion formed on the retaining member and to be restricted from moving, with respect to the retaining member, in an insertion direction of the ferrule and in a direction orthogonal to the insertion direction, and a main body configured to elastically press the ferrule toward the bottom of the retaining hole by elastic deformation thereof.

Abstract: An object of the present invention is to provide a silicon oligomer having a novel function that has not been achieved by a conventional condensation product of water and a tetraalkoxysilane. Provided are a silicon oligomer represented by the following formula (I) and a production method therefor: wherein R1 to R10 each independently is an alkyl group or a hydroxyalkyl group, each having 1 to 4 carbon atoms; X1 to X3 each independently is a group represented by the following formula (II); n is 0 or 1; and m is an integer of 1 to 3 when n is 0, and m is 1 when n is 1: wherein A is an alkylene group having 2 to 4 carbon atoms which may be branched, and l is an integer of 1 to 3.

Abstract: An optical wiring substrate includes an insulation layer including a resin, a first conductor layer formed on the insulation layer and including a metal, the first conductor layer including an inclined surface that is inclined relative to an optical axis of an optical fiber. The insulation layer further includes an end surface that faces a cladding of the optical fiber. The inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber.

Abstract: A photoelectric conversion module includes a circuit board including a plurality of first board-side electrodes and a plurality of second board-side electrodes that are alternately arranged on a mounting surface of the circuit board in an array direction and each extend into strips in a direction orthogonal to the array direction, a photoelectric conversion array element mounted on the circuit board and including, on a surface facing the mounting surface, a plurality of light receiving/emitting portions, first element-side electrodes connected to the first board-side electrodes and second element-side electrodes connected to the second board-side electrodes, and an IC chip mounted on the circuit board. The circuit board further includes, on the mounting surface, a connecting portion for connecting the first board-side electrodes to each other and a first electrode land portion connected to the first board-side electrode or the connecting portion to contact with a first test electrode probe.

Abstract: Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.