Patents by Inventor Hiroki YUU
Hiroki YUU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420284Abstract: A method for manufacturing a light-emitting device includes: preparing a first structure comprising: a first substrate having a first surface and a second surface on a side opposite the first surface, a release layer disposed on the first surface, and one or more light-emitting elements fixed to the first surface of the first substrate via the release layer, the one or more light-emitting elements each having a third surface facing the release layer and a fourth surface on a side opposite the third surface, the fourth surface being larger than the third surface in a plan view, wherein: the release layer encloses the fourth surface in the plan view; preparing a second structure comprising a second substrate having an upper surface; and transferring the one or more light-emitting elements from the first substrate to the second substrate by removing the release layer.Type: ApplicationFiled: June 6, 2023Publication date: December 28, 2023Applicant: NICHIA CORPORATIONInventors: Kensuke YAMAOKA, Hiroki YUU
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Publication number: 20220384405Abstract: A method for manufacturing a light emitting device includes: preparing a first substrate having an upper surface comprising an element placement region; placing a light emitting element in the element placement region; disposing an uncured, sheet-like light-transmissive member on the light emitting element and bringing an outer edge of a lower surface of the light-transmissive member into contact with an outer upper surface of the element placement region of the first substrate by pressing the light-transmissive member; and disposing a first protrusion portion along an outer edge of an upper surface of the light-transmissive member so that the first protrusion portion extends over the upper surface of the first substrate and the upper surface of the light-transmissive member.Type: ApplicationFiled: May 26, 2022Publication date: December 1, 2022Applicant: NICHIA CORPORATIONInventor: Hiroki YUU
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Patent number: 11073654Abstract: Provided is a light emitting module, including: a light guide plate having a first main surface and a second main surface opposite to the first main surface; a plurality of light source members disposed on a second main surface side, each of the light source members including a light emitting element having a main light emitting surface, an electrode formation surface located opposite to the main light emitting surface, and a side surface between the main light emitting surface and the electrode formation surface, and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element; and a sealing member covering the plurality of light source members and the second main surface of the light guide plate.Type: GrantFiled: December 27, 2019Date of Patent: July 27, 2021Assignee: NICHIA CORPORATIONInventor: Hiroki Yuu
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Patent number: 10707389Abstract: A light emitting device includes a light emitting surface, a back surface arranged on an opposite side of the light emitting surface, a mounting surface arranged between the light emitting surface and the back surface, and includes a light emitting element, a light shielding member, first and second terminal coating films, and first and second electrically conductive members. The light emitting element has first and second electrodes arranged on the second main surface. The light shielding member covers the lateral surface of the light emitting element and does not cover the first main surface of the light emitting element. The first and second terminal coating films are electrically connected to the first and second electrodes respectively, and arranged continuously on the back surface and the mounting surface of the light emitting device. The first and second electrically conductive members are in contact with the first and second electrodes respectively.Type: GrantFiled: January 17, 2019Date of Patent: July 7, 2020Assignee: NICHIA CORPORATIONInventors: Takahiro Tani, Hiroki Yuu, Toshiaki Moriwaki
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Publication number: 20200209458Abstract: Provided is a light emitting module, including: a light guide plate having a first main surface and a second main surface opposite to the first main surface; a plurality of light source members disposed on a second main surface side, each of the light source members including a light emitting element having a main light emitting surface, an electrode formation surface located opposite to the main light emitting surface, and a side surface between the main light emitting surface and the electrode formation surface, and a wavelength conversion member covering the main light emitting surface and the side surface of the light emitting element; and a sealing member covering the plurality of light source members and the second main surface of the light guide plate.Type: ApplicationFiled: December 27, 2019Publication date: July 2, 2020Applicant: NICHIA CORPORATIONInventor: Hiroki YUU
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Patent number: 10497843Abstract: A light emitting device includes a light emitting element, a covering member and a metal layer. The light emitting element includes a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface. The covering member covers a side surface of the light emitting element. An outer surface of the covering member defines a recess. The metal layer is connected to the pair of electrodes. The metal layer is arranged in the recess.Type: GrantFiled: March 14, 2019Date of Patent: December 3, 2019Assignee: NICHIA CORPORATIONInventor: Hiroki Yuu
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Publication number: 20190214535Abstract: A light emitting device includes a light emitting element, a covering member and a metal layer. The light emitting element includes a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface. The covering member covers a side surface of the light emitting element. An outer surface of the covering member defines a recess. The metal layer is connected to the pair of electrodes. The metal layer is arranged in the recess.Type: ApplicationFiled: March 14, 2019Publication date: July 11, 2019Inventor: Hiroki YUU
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Publication number: 20190157528Abstract: A light emitting device includes a light emitting surface, a back surface arranged on an opposite side of the light emitting surface, a mounting surface arranged between the light emitting surface and the back surface, and includes a light emitting element, a light shielding member, first and second terminal coating films, and first and second electrically conductive members. The light emitting element has first and second electrodes arranged on the second main surface. The light shielding member covers the lateral surface of the light emitting element and does not cover the first main surface of the light emitting element. The first and second terminal coating films are electrically connected to the first and second electrodes respectively, and arranged continuously on the back surface and the mounting surface of the light emitting device. The first and second electrically conductive members are in contact with the first and second electrodes respectively.Type: ApplicationFiled: January 17, 2019Publication date: May 23, 2019Inventors: Takahiro TANI, Hiroki YUU, Toshiaki MORIWAKI
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Patent number: 10270016Abstract: A light emitting device includes a light emitting element, a covering member and a metal layer. The light emitting element includes a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface. The covering member covers a side surface of the light emitting element. The metal layer is connected to the pair of electrodes. The metal layer covers an outer surface of the covering member.Type: GrantFiled: July 9, 2018Date of Patent: April 23, 2019Assignee: NICHIA CORPORATIONInventor: Hiroki Yuu
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Patent number: 10224468Abstract: A method of manufacturing a light emitting device includes: arranging first and second light emitting elements, each having a pair of electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the electrodes facing upward; forming a light shielding member at least covering the electrodes of each of the first and second light emitting elements and a portion between the first and second light emitting elements; forming recesses by removing portions of the light shielding member so that at least a portion of each of the electrodes of the first and second light emitting elements are exposed from the light shielding member; and forming electrically conductive members in the recesses so that each of the electrically conductive members is in contact with a corresponding one of the electrodes of the first and second light emitting elements.Type: GrantFiled: January 30, 2018Date of Patent: March 5, 2019Assignee: NICHIA CORPORATIONInventors: Takahiro Tani, Hiroki Yuu, Toshiaki Moriwaki
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Publication number: 20180315904Abstract: A light emitting device includes a light emitting element, a covering member and a metal layer. The light emitting element includes a semiconductor layer having a main light emission surface and an electrode formation surface on an opposite side of the main light emission surface, and a pair of electrodes disposed on the electrode formation surface. The covering member covers a side surface of the light emitting element. The metal layer is connected to the pair of electrodes. The metal layer covers an outer surface of the covering member.Type: ApplicationFiled: July 9, 2018Publication date: November 1, 2018Inventor: Hiroki YUU
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Patent number: 10043956Abstract: A method for manufacturing a light emitting device includes: preparing an intermediate body including a plurality of light emitting elements spaced apart from each other, each of the light emitting elements having a pair of electrodes disposed on the same side, and a covering member covering side surfaces of the light emitting elements while a part of a surface of each of the electrodes is exposed from the covering member, the covering member having a recess between adjacent ones of the light emitting elements; forming a metal layer that continuously covers the surface of each of the electrodes of the light emitting elements and an inner surface of the recess of the covering member; and cutting the metal layer and the covering member at the inner surface of the recess.Type: GrantFiled: September 27, 2017Date of Patent: August 7, 2018Assignee: NICHIA CORPORATIONInventor: Hiroki Yuu
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Publication number: 20180175263Abstract: A method of manufacturing a light emitting device includes: arranging first and second light emitting elements, each having a pair of electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the electrodes facing upward; forming a light shielding member at least covering the electrodes of each of the first and second light emitting elements and a portion between the first and second light emitting elements; forming recesses by removing portions of the light shielding member so that at least a portion of each of the electrodes of the first and second light emitting elements are exposed from the light shielding member; and forming electrically conductive members in the recesses so that each of the electrically conductive members is in contact with a corresponding one of the electrodes of the first and second light emitting elements.Type: ApplicationFiled: January 30, 2018Publication date: June 21, 2018Inventors: Takahiro TANI, Hiroki YUU, Toshiaki MORIWAKI
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Publication number: 20180090648Abstract: A method for manufacturing a light emitting device includes: preparing an intermediate body including a plurality of light emitting elements spaced apart from each other, each of the light emitting elements having a pair of electrodes disposed on the same side, and a covering member covering side surfaces of the light emitting elements while a part of a surface of each of the electrodes is exposed from the covering member, the covering member having a recess between adjacent ones of the light emitting elements; forming a metal layer that continuously covers the surface of each of the electrodes of the light emitting elements and an inner surface of the recess of the covering member; and cutting the metal layer and the covering member at the inner surface of the recess.Type: ApplicationFiled: September 27, 2017Publication date: March 29, 2018Inventor: Hiroki YUU
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Patent number: 9917234Abstract: A method of manufacturing a light emitting device includes: arranging a first light emitting element and a second light emitting element, each having a pair of first and second electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the pair of electrodes facing upward; forming a pair of electrically conductive members each extending between one of the pair of electrodes of the first light emitting element and a corresponding one of the pair of electrodes of the second light emitting element; forming a light shielding member at least covering between the first and second light emitting elements; and cutting the pair of electrically conductive members and the light shielding member between the first and second light emitting elements, along a direction substantially perpendicular to the main light emitting surface of each of the first and second light emitting elements.Type: GrantFiled: July 25, 2016Date of Patent: March 13, 2018Assignee: Nichia CorporationInventors: Takahiro Tani, Hiroki Yuu, Toshiaki Moriwaki
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Publication number: 20170040512Abstract: A method of manufacturing a light emitting device includes: arranging a first light emitting element and a second light emitting element, each having a pair of first and second electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the pair of electrodes facing upward; forming a pair of electrically conductive members each extending between one of the pair of electrodes of the first light emitting element and a corresponding one of the pair of electrodes of the second light emitting element; forming a light shielding member at least covering between the first and second light emitting elements; and cutting the pair of electrically conductive members and the light shielding member between the first and second light emitting elements, along a direction substantially perpendicular to the main light emitting surface of each of the first and second light emitting elements.Type: ApplicationFiled: July 25, 2016Publication date: February 9, 2017Inventors: Takahiro TANI, Hiroki YUU, Toshiaki MORIWAKI