Patents by Inventor Hiroko Asada

Hiroko Asada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer
    Patent number: 9133300
    Abstract: Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: September 15, 2015
    Assignees: TOYO BOSEKI KABUSHIKI KAISHA, NIPPON MEKTRON, LTD.
    Inventors: Takeshi Ito, Shintaro Nanbara, Hiroko Asada, Yuto Tanikawa, Hideaki Tanaka, Yoichi Kenmotsu
  • RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER
    Publication number: 20130020118
    Abstract: Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.
    Type: Application
    Filed: April 12, 2011
    Publication date: January 24, 2013
    Inventors: Takeshi Ito, Shintaro Nanbara, Hiroko Asada, Yuto Tanikawa, Hideaki Tanaka, Yoichi Kenmotsu