Patents by Inventor Hirokuni Beppu

Hirokuni Beppu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11581690
    Abstract: A robot apparatus includes a clamp mechanism; a transport mechanism; and a control unit. The clamp mechanism includes a first finger that has a first support surface and a housing portion and a second finger. The first support surface supports an aligned wire group that includes a plurality of wires, the housing portion includes a guide wall that is connected to the first support surface and regulates an amount of movement of the band member in a width direction. The second finger has a second support surface facing the first support surface and a facing portion being connected to the second support surface and facing the housing portion. The transport mechanism is capable of moving the clamp mechanism. The control unit controls a grip force of the clamp mechanism and a direction of movement of the clamp mechanism by the transport mechanism.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: February 14, 2023
    Assignee: SONY CORPORATION
    Inventors: Shinichi Takeyama, Hirokuni Beppu
  • Patent number: 11413765
    Abstract: A robotic device includes a first robotic device including a first articulated arm, a first clamping mechanism, and a blow-out portion. The first clamping mechanism includes a first clamping claw and a second clamping claw. The first clamping claw is attached to the first articulated arm, and has a first support surface. The second clamping claw has a second support surface to face the first support surface in a first axial direction orthogonal to the first support surface. The second clamping claw is movable in the first axial direction relative to the first clamping claw. The blow-out portion is provided to any one of the first clamping claw or the second clamping claw. The blow-out portion is capable of blowing out fluid in a second axial direction orthogonal to the first axial direction.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: August 16, 2022
    Assignee: SONY CORPORATION
    Inventors: Shinichi Takeyama, Hirokuni Beppu, Hideaki Masamura
  • Publication number: 20200376679
    Abstract: A robotic device according to an embodiment of the present technology includes a first robotic device including a first articulated arm, a first clamping mechanism, and a blow-out portion. The first clamping mechanism includes a first clamping claw and a second clamping claw. The first clamping claw is attached to the first articulated arm, and has a first support surface. The second clamping claw has a second support surface to face the first support surface in a first axial direction orthogonal to the first support surface, and is configured to be movable in the first axial direction relative to the first clamping claw. The blow-out portion is provided to any one of the first clamping claw and the second clamping claw, and is configured to be capable of blowing out fluid in a second axial direction orthogonal to the first axial direction.
    Type: Application
    Filed: March 14, 2018
    Publication date: December 3, 2020
    Inventors: Shinichi TAKEYAMA, Hirokuni BEPPU, Hideaki MASAMURA
  • Patent number: 10632617
    Abstract: An attachment apparatus according to an embodiment of the present technology includes a hand portion and a control unit. The hand portion includes a restriction portion that restricts a movement of a flat cable in a width direction and a holding portion that holds at least one of both surfaces of the flat cable. The control unit causes the flat cable to be held by a first holding force while restricting the movement in the width direction at a first position on the flat cable, causes the hand portion to move to a second position on the flat cable while maintaining the first holding force, and causes the flat cable to be held at the second position by a second holding force to attach the flat cable.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: April 28, 2020
    Assignee: SONY CORPORATION
    Inventors: Shinichi Takeyama, Takayuki Furubo, Hirokuni Beppu
  • Publication number: 20200067255
    Abstract: A robot apparatus according to the present technology includes: a clamp mechanism; a transport mechanism; and a control unit. The clamp mechanism includes a first finger and a second finger. The first finger has a first support surface and a housing portion, the first support surface being capable of supporting a wire group while the wire group is aligned, the wire group including a plurality of wires, one end of the wire group being fixed, the other end of the wire group including a terminal unit connectable to a connection portion, the housing portion including a guide wall that is connected to the first support surface and regulates an amount of movement of the band member in a width direction thereof. The second finger has a second support surface and a facing portion, the second support surface facing the first support surface, the facing portion being connected to the second support surface and facing the housing portion. The transport mechanism is configured to be capable of moving the clamp mechanism.
    Type: Application
    Filed: April 13, 2018
    Publication date: February 27, 2020
    Inventors: SHINICHI TAKEYAMA, HIROKUNI BEPPU
  • Publication number: 20180243907
    Abstract: An attachment apparatus according to an embodiment of the present technology includes a hand portion and a control unit. The hand portion includes a restriction portion that restricts a movement of a flat cable in a width direction and a holding portion that holds at least one of both surfaces of the flat cable. The control unit causes the flat cable to be held by a first holding force while restricting the movement in the width direction at a first position on the flat cable, causes the hand portion to move to a second position on the flat cable while maintaining the first holding force, and causes the flat cable to be held at the second position by a second holding force to attach the flat cable.
    Type: Application
    Filed: June 7, 2016
    Publication date: August 30, 2018
    Inventors: SHINICHI TAKEYAMA, TAKAYUKI FURUBO, HIROKUNI BEPPU
  • Patent number: 9056245
    Abstract: An electronic apparatus 1 includes a holder 50 arranged along the rear surface of a main board 20 and the front surface of a sub-board 30. The holder 50 includes a connector holder portion 51 that holds a connector 59 in a position offset in the thickness direction of the main board 20 and the sub-board 30 from a position on the rear surface of the main board 20 and a position on the front surface of the sub-board 30. The holder 50 includes a cable holder portion 52 that holds a cable 58. Consequently, it is possible to optimize the position of an electronic component such as a connector and prevent interference between a cable connected to the electronic component and other electronic components on a circuit board.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: June 16, 2015
    Assignees: SONY CORPORATION, SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Takayuki Furubo, Hirokuni Beppu
  • Publication number: 20130033829
    Abstract: An electronic apparatus 1 includes a holder 50 arranged along the rear surface of a main board 20 and the front surface of a sub-board 30. The holder 50 includes a connector holder portion 51 that holds a connector 59 in a position offset in the thickness direction of the main board 20 and the sub-board 30 from a position on the rear surface of the main board 20 and a position on the front surface of the sub-board 30. The holder 50 includes a cable holder portion 52 that holds a cable 58. Consequently, it is possible to optimize the position of an electronic component such as a connector and prevent interference between a cable connected to the electronic component and other electronic components on a circuit board.
    Type: Application
    Filed: July 27, 2012
    Publication date: February 7, 2013
    Applicant: SONY COMPUTER ENTERTAINMENT INC.
    Inventors: Takayuki Furubo, Hirokuni Beppu