Abstract: Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Abstract: A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

Abstract: A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

Abstract: Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Abstract: An optical recording apparatus records information on a rewritable recording medium having a pre-recorded address guide by an external link method without performing complex calculations. Data is recorded on the rewritable optical recording medium on an individual block basis along the pre-recorded address guide, the block including a predetermined number of sectors each of which has a consecutively numbered sector address. A link part having a predetermined fixed length is recorded between adjacent blocks. The link part lacks an address so that the sector address shifts from an address indicated by the pre-recorded address guide by the length of said link part.

Abstract: An optical-disc recording device records information on and erases information from a re-recordable optical disc. The device is provided with means for, when overall erasing is performed on the optical disc, obtaining, from management information, a position of an area in which information has been recorded, performing an erasing operation on the area, and erasing the management information.

Abstract: Data is recorded on and data is reproduced from an optical disc in a multi-session recording system on optical disc on which re-recording of data is possible. Contents of a last session of the optical disc are rewritten from contents indicating that a subsequent session does not exist to contents indicating that a subsequent session exists.

Abstract: An optical disc recording and reproducing apparatus can record data, which is provided in a packet having a fixed length, on an optical disc without waiting for a long time for a completion of a formatting operation. The optical disc is formatted by a formatting process performed as a background process so that another process is acceptable after a start of the formatting process. The formatting process is performed so as to fill at least a predetermined part of a recording area of said optical disc by packets having a fixed length.

Abstract: An optical disc recording apparatus forms a plurality of tracks on the recording area of an erasable optical disc, divides each of the plurality of tracks into a plurality of packets, records data onto the packets and also has a rewriting means for rewriting data onto the plurality of packets if a recording error occurs during recording of the data. The optical disc recording apparatus allows efficient use of the recording area of an erasable optical disc.

Abstract: An optical disc recording apparatus which can record information, which is provided in a packet having a fixed length, on an optical disc on an individual user data block by using the fixed packet write method. A plurality of tracks having a plurality of packets are formed on a recording area of the optical disc. Each of the packets has the same number of user data blocks. Information is recorded at once on an individual packet basis. A buffer stores new recording information to be recorded on the optical disc. A controller controls a recording operation of the new recording information on the optical disc so that, when a recording area of the new recording information is totally included in a previously recorded packet, previously recorded information recorded in the previously recorded packet is read and stored in the buffer. The previously recorded information stored in the buffer is overwritten by the new recording information.

Abstract: There is provided an optical information recording method which can manage a number of recordings which can be performed on each of several partitions in a test area. The recording method uses an erasable recording medium on which information is recordable a plurality of times in the same area by a laser beam. The erasable recording medium includes a data area in which the information is recorded and a test area divided into a plurality of partitions each of which is provided for testing a recording power of the laser beam. In the method, the laser beam is projected onto one of the partitions so as to perform a test recording. The recording power of the laser beam is calibrated so as to adjust the recording power to an appropriate level before recording the information in the data area of the erasable recording medium. Then, the number of test recordings is recorded in a predetermined area of the erasable recording medium.

Abstract: An optical disc recording and reproducing apparatus can record data, which is provided in a packet having a fixed length, on an optical disc without waiting for a long time for a completion of a formatting operation. The optical disc is formatted by a formatting process performed as a background process so that another process is acceptable after a start of the formatting process. The formatting process is performed so as to fill at least a predetermined part of a recording area of said optical disc by packets having a fixed length.