Patents by Inventor Hiromasa Nagase

Hiromasa Nagase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad, method for manufacturing the polishing pad
    Patent number: 8011999
    Abstract: A polishing pad with first plural concave portions regularly allocated with prescribed spacing or/and a groove formed on the surface of the polishing pad; and a second concave portion randomly allocated without corresponding to the first plural concave portions or/and the groove formed on the surface of the polishing pad.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: September 6, 2011
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Hiromasa Nagase, Akio Yokofuke, Hiroshi Misawa
  • POLISHING PAD, METHOD FOR MANUFACTURING THE POLISHING PAD, AND METHOD FOR POLISHING AN OBJECT
    Publication number: 20080009228
    Abstract: A polishing pad with first plural concave portions regularly allocated with prescribed spacing or/and a groove formed on the surface of the polishing pad; and a second concave portion randomly allocated without corresponding to the first plural concave portions or/and the groove formed on the surface of the polishing pad.
    Type: Application
    Filed: July 9, 2007
    Publication date: January 10, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Hiromasa Nagase, Akio Yokofuke, Hiroshi Misawa