Abstract: In a power converter, electronic components constituting a power conversion circuit is provided. A capacitor module and a converter case are also provided in the power converter. Fastening members, which include a first fastening member and a second fastening member, are configured to fasten the capacitor module to the converter case. The first and second fastening members are mounted on the inner bottom surface of the converter case. At least one of the electronic components is mounted to the capacitor module and is arranged between the first fastening member and the second fastening member when viewed in a view direction perpendicular to an alignment direction of the first and second fastening members. The view direction is parallel to the inner bottom surface of the converter case.

Abstract: A power conversion apparatus includes an electric component, a housing, and a flow channel formation unit. The electric component configures at least a part of a power conversion circuit. The housing stores the electric component, and the electric component is fixed to the housing. The flow channel formation unit forms a refrigerant flow channel through which a refrigerant flows, and is thermally connected to the electric component. The flow channel formation unit is a member different from the housing, and an elastically deformable spacer is provided between the flow channel formation unit and the housing.

Abstract: An electric power conversion apparatus includes a semiconductor module, a control circuit board and a wireless communication unit. The semiconductor module has at least one semiconductor element built therein. The control circuit board is configured to control the semiconductor module. The wireless communication unit is configured to wirelessly communicate electrical signals between the semiconductor module and the control circuit board. The wireless communication unit includes a first communication device provided on the control circuit board so as to face the semiconductor module, and a second communication device provided on the semiconductor module so as to face the control circuit board. Moreover, there are no obstacles on a straight path between the first and second communication devices.

Abstract: A power conversion device includes a semiconductor stack, a reactor, and a capacitor. The semiconductor stack includes a plurality of semiconductor modules stacked on one another in a stacking direction. Each semiconductor module includes a semiconductor element. The reactor constitutes a boost circuit that boosts a direct-current voltage. The capacitor is electrically connected to the plurality of semiconductor modules. The semiconductor stack, the reactor, and the capacitor each include a coolant flow passage, and the reactor and the capacitor are located adjacent to each other.

Abstract: In a power converter, electronic components constituting a power conversion circuit is provided. A capacitor module and a converter case are also provided in the power converter. Fastening members, which include a first fastening member and a second fastening member, are configured to fasten the capacitor module to the converter case. The first and second fastening members are mounted on the inner bottom surface of the converter case. At least one of the electronic components is mounted to the capacitor module and is arranged between the first fastening member and the second fastening member when viewed in a view direction perpendicular to an alignment direction of the first and second fastening members. The view direction is parallel to the inner bottom surface of the converter case.

Abstract: A power conversion device includes a semiconductor stack, a reactor, and a capacitor. The semiconductor stack includes a plurality of semiconductor modules stacked on one another in a stacking direction. Each semiconductor module includes a semiconductor element. The reactor constitutes a boost circuit that boosts a direct-current voltage. The capacitor is electrically connected to the plurality of semiconductor modules. The semiconductor stack, the reactor, and the capacitor each include a coolant flow passage, and the reactor and the capacitor are located adjacent to each other.

Abstract: A power conversion apparatus includes an electric component, a housing, and a flow channel formation unit. The electric component configures at least a part of a power conversion circuit. The housing stores the electric component, and the electric component is fixed to the housing. The flow channel formation unit forms a refrigerant flow channel through which a refrigerant flows, and is thermally connected to the electric component. The flow channel formation unit is a member different from the housing, and an elastically deformable spacer is provided between the flow channel formation unit and the housing.

Abstract: A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.

Abstract: A power converter includes a stack of a plurality of semiconductor modules, each of which incorporates semiconductor elements, and a plurality of cooling conduits, though each of which a coolant flows to cool the semiconductor modules, at least one electronic component electrically connected to the semiconductor modules, and a cooling plate for cooling the at least one electronic component. The stack, the at least one electronic component, and the cooling plate are arranged in a stacking direction of the stack. The cooling plate is connected to the cooling conduits and has an intra-plate pathway formed therein thorough which the coolant flows in a direction perpendicular to the stacking direction. The cooling plate has a larger area than each cooling conduit when viewed from the stacking direction.

Abstract: A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.

Abstract: A power converter includes a stack of a plurality of semiconductor modules, each of which incorporates semiconductor elements, and a plurality of cooling conduits, though each of which a coolant flows to cool the semiconductor modules, at least one electronic component electrically connected to the semiconductor modules, and a cooling plate for cooling the at least one electronic component. The stack, the at least one electronic component, and the cooling plate are arranged in a stacking direction of the stack. The cooling plate is connected to the cooling conduits and has an intra-plate pathway formed therein thorough which the coolant flows in a direction perpendicular to the stacking direction. The cooling plate has a larger area than each cooling conduit when viewed from the stacking direction.

Abstract: An electric power converter includes a semiconductor module, an electronic component, a plurality of cooling tubes, a case, a main pressure member for pressing a stacked semiconductor section in a stacking direction, and a sub-pressure member for pressing a stacked component section in the stacking direction. The stacked semiconductor section and the stacked component section are stacked in line. A pressing force of the main pressure member is greater than a pressure pressing force of the sub-pressure member. The main pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section. A supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.

Abstract: An electric power converter includes a semiconductor module constituting a power conversion circuit, a capacitor electrically connected to the semiconductor module, and a cooling member for cooling the capacitor. The capacitor includes an element body provided with internal electrode, and a pair of end-face-electrodes provided on both end faces of the element body and connected to the internal electrode. The pair of end-face-electrodes are connected with a pair of bus bars, respectively, in a manner of surface contact. The capacitor is disposed in a state where one of the pair of end-face-electrodes is facing the cooling member. The end-face-electrode facing the cooling member is in contact with the cooling member via the bus bar.

Abstract: An electric power converter includes a semiconductor module, an electronic component, a plurality of cooling tubes, a case, a main pressure member for pressing a stacked semiconductor section in a stacking direction, and a sub-pressure member for pressing a stacked component section in the stacking direction. The stacked semiconductor section and the stacked component section are stacked in line. A pressing force of the main pressure member is greater than a pressure pressing force of the sub-pressure member. The main pressure member is disposed at an end portion of the stacked component section far from the stacked semiconductor section. A supporting portion that supports the stacked semiconductor section from the stacked component section side is disposed in the case so as to prevent the pressing force of the main pressure member from acting on the stacked component section.

Abstract: An electric power converter includes a semiconductor module constituting a power conversion circuit, a capacitor electrically connected to the semiconductor module, and a cooling member for cooling the capacitor. The capacitor includes an element body provided with internal electrode, and a pair of end-face-electrodes provided on both end faces of the element body and connected to the internal electrode. The pair of end-face-electrodes are connected with a pair of bus bars, respectively, in a manner of surface contact. The capacitor is disposed in a state where one of the pair of end-face-electrodes is facing the cooling member. The end-face-electrode facing the cooling member is in contact with the cooling member via the bus bar.

Abstract: An electric power converter has a semiconductor module that has a switching element therein, cooling pipes that contact with heat radiating surfaces of the semiconductor module and cool the semiconductor module, and a capacitor module formed by sealing a capacitor element therein by a potting material. A piled unit is formed by piling the semiconductor module and the cooling pipes. A direction in which the semiconductor module and the cooling pipes are piled is defined as a piling direction. The piled unit is sandwiched between the capacitor module disposed in a first end side in the piling direction of the piled unit and a pressing member disposed in a second end side in the piling direction of the piled unit. The first end of the piled unit is contacted to a potting surface that is a surface of the potting material in the capacitor module.

Abstract: A power converter including a plurality of semiconductor modules each having a body including semiconductor elements, where the body is provided with control terminals, a pair of input terminals, and at least two output terminals protruding from the body. The output terminals protruding from the bodies of the respective semiconductor modules are grouped into a plurality of output terminal groups each formed of three output terminals belonging to at least two different semiconductor modules. The power converter further includes a control circuit board electrically connected to the control terminals and configured to turn on and off the respective semiconductor elements of the respective semiconductor modules so as to convert a DC voltage applied to the pair of input terminals of each semiconductor module into a three-phase AC voltage to be outputted from each output terminal group.

Abstract: An electric power converter has a semiconductor module that has a switching element therein, cooling pipes that contact with heat radiating surfaces of the semiconductor module and cool the semiconductor module, and a capacitor module formed by sealing a capacitor element therein by a potting material. A piled unit is formed by piling the semiconductor module and the cooling pipes. A direction in which the semiconductor module and the cooling pipes are piled is defined as a piling direction. The piled unit is sandwiched between the capacitor module disposed in a first end side in the piling direction of the piled unit and a pressing member disposed in a second end side in the piling direction of the piled unit. The first end of the piled unit is contacted to a potting surface that is a surface of the potting material in the capacitor module.