Patents by Inventor Hiromi Kanaki

Hiromi Kanaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component placement machine having camera units with vertically overlaid apertures
    Patent number: 7191511
    Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: March 20, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiko Noda, Hitoshi Mukojima, Yasuhiro Narikiyo, Toshiro Hirakawa, Hiromi Kanaki, Akira Nishimura, Osamu Uchida, Takatoshi Ishikawa
  • Electronic component placement method
    Patent number: 7007377
    Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: March 7, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiko Noda, Hitoshi Mukojima, Yasuhiro Narikiyo, Toshiro Hirakawa, Hiromi Kanaki, Akira Nishimura, Osamu Uchida, Takatoshi Ishikawa
  • Electronic component placement machine and electronic component placement method
    Publication number: 20050132567
    Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
    Type: Application
    Filed: January 12, 2005
    Publication date: June 23, 2005
    Inventors: Kazuhiko Noda, Hitoshi Mukojima, Yasuhiro Narikiyo, Toshiro Hirakawa, Hiromi Kanaki, Akira Nishimura, Osamu Uchida, Takatoshi Ishikawa
  • Electronic component placement machine and electronic component placement method
    Publication number: 20040163243
    Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
    Type: Application
    Filed: February 20, 2004
    Publication date: August 26, 2004
    Inventors: Kazuhiko Noda, Hitoshi Mukojima, Yasuhiro Narikiyo, Toshiro Hirakawa, Hiromi Kanaki, Akira Nishimura, Osamu Uchida, Takatoshi Ishikawa