Patents by Inventor Hiromi Kanda

Hiromi Kanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070059639
    Abstract: A positive resist composition comprises: (A) a resin capable of increasing its solubility in an alkali developer by action of an acid and not containing a silicon atom; (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, (C) a silicon atom-containing resin having at least one group selected from groups (X) to (Z), (X) an alkali-soluble group, (Y) a group capable of decomposing by action of an alkali developer to increase the solubility of resin (C) in an alkali developer, (Z) a group capable of decomposing by action of an acid to increase the solubility of resin (C) in an alkali developer; and (D) a solvent.
    Type: Application
    Filed: September 13, 2006
    Publication date: March 15, 2007
    Inventors: Hiromi Kanda, Shinichi Kanna, Haruki Inabe
  • Publication number: 20070042290
    Abstract: A positive resist composition for immersion exposure comprises: (A) a resin capable of increasing its solubility in an alkali developer by an action of an acid, and (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation, wherein the acid satisfies conditions of V?230 and V/S?0.93 taking van der Waals volume of the acid as V (?3), and van der Waals surface area of the acid as S (?2).
    Type: Application
    Filed: August 15, 2006
    Publication date: February 22, 2007
    Inventors: Haruki Inabe, Hiromi Kanda, Kunihiko Kodama
  • Publication number: 20060199100
    Abstract: A positive resist composition, which comprises a resin having a structure showing a basicity and capable of increasing the solubility in an alkali developer by the action of an acid, and a pattern-forming method using the same.
    Type: Application
    Filed: March 3, 2006
    Publication date: September 7, 2006
    Inventor: Hiromi Kanda
  • Publication number: 20060166136
    Abstract: A positive resist composition for immersion exposure comprising: (A) a resin having an alicyclic hydrocarbon structure, wherein the resin is capable of increasing a solubility of the resin (A) in an alkaline developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with one of an actinic ray and radiation, wherein the resin (A) includes a component having a molecular weight of 1,000 or less in an area ration of 20% or less to an entire area in a pattern area by gel permeation chromatography, and a pattern-forming method using the same.
    Type: Application
    Filed: January 20, 2006
    Publication date: July 27, 2006
    Inventor: Hiromi Kanda
  • Publication number: 20060078823
    Abstract: A positive resist composition comprising (A) resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and capable of decomposing by the action of an acid to increase the solubility in an alkaline developer, (B) a compound capable of generating an acid upon treatment with one of an actinic ray and radiation and (F) a specific surfactant containing a fluorine atom in an amount of from 30 to 60 mass %, and a pattern-forming method using the same.
    Type: Application
    Filed: October 7, 2005
    Publication date: April 13, 2006
    Inventors: Hiromi Kanda, Fumiyuki Nishiyama
  • Publication number: 20060036005
    Abstract: A protective film-forming composition capable of forming a protective film soluble in an alkali developer on a resist film, that is, a protective film which in the pattern formation by immersion exposure, protects the resist film from the immersion liquid, undergoes no swelling with the immersion liquid, is removable with an alkali developer used in the developing step and allows for formation of a good pattern, and an immersion exposure pattern forming method using the composition, are provided, which are a protective film-forming composition for immersion exposure, comprising a water-insoluble alkali-soluble resin having an acid value of 2.0 to 8.0 milli-equivalent/g; and a pattern forming method using the composition.
    Type: Application
    Filed: August 10, 2005
    Publication date: February 16, 2006
    Inventors: Hiromi Kanda, Shinichi Kanna, Haruki Inabe
  • Publication number: 20060008748
    Abstract: A protective film-forming composition for immersion exposure having a dissolution rate in an alkali developer of from 20 to 300 mm/sec in the time when the protective film-forming composition is made a dry film.
    Type: Application
    Filed: July 7, 2005
    Publication date: January 12, 2006
    Inventors: Haruki Inabe, Shinichi Kanna, Hiromi Kanda
  • Publication number: 20060008736
    Abstract: A positive type resist composition for use in liquid immersion exposure comprises: (A) a resin having a monocyclic or polycyclic cycloaliphatic hydrocarbon structure, the resin increasing its solubility in an alkali developer by an action of acid; (B) a compound generating acid upon irradiation with one of an actinic ray and a radiation; (C) an alkali soluble compound having an alkyl group of 5 or more carbon atoms; and (D) a solvent.
    Type: Application
    Filed: July 7, 2005
    Publication date: January 12, 2006
    Inventors: Hiromi Kanda, Haruki Inabe
  • Publication number: 20050277059
    Abstract: A protective film-forming composition for immersion exposure comprises a water-insoluble and alkali-soluble resin comprising a repeating unit derived from a monomer having an acid dissociation constant pKa of 8 or more.
    Type: Application
    Filed: June 14, 2005
    Publication date: December 15, 2005
    Inventor: Hiromi Kanda
  • Publication number: 20050255414
    Abstract: A pattern forming method includes (a) a step of forming a resist film on a substrate, (b) a pre-wet step of spreading a pre-wet solution on the resist film and after a fixed time, removing the pre-wet solution, and (c) a step of subjecting the resist film on the substrate to exposure through an immersion liquid.
    Type: Application
    Filed: May 16, 2005
    Publication date: November 17, 2005
    Inventors: Haruki Inabe, Shinichi Kanna, Hiromi Kanda
  • Publication number: 20050208419
    Abstract: A positive resist composition for immersion exposure comprises: (A) a resin containing at least one repeating unit having a fluorine atom and increasing a solubility of the resin in an alkali developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with one of an actinic ray and radiation.
    Type: Application
    Filed: March 11, 2005
    Publication date: September 22, 2005
    Inventors: Haruki Inabe, Shinichi Kanna, Hiromi Kanda
  • Publication number: 20050186505
    Abstract: A positive resist composition for immersion exposure which comprises (A) a resin which enhances its solubility in an alkaline developer by the action of an acid and (B) at least one compound which generates an acid upon irradiation with an actinic ray or a radiation, the compound being selected from the following (Ba) to (Bc): (Ba) a sulfonium salt compound having a specific alkyl or cycloalkyl residue in the cation part, (Bb) a sulfonium salt compound having a specific alkyl or cycloalkyl residue in the cation part, and (Bc) a sulfonium salt compound having a specific alkyl or cycloalkyl residue in the anion part; and a method of pattern formation with the composition.
    Type: Application
    Filed: February 18, 2005
    Publication date: August 25, 2005
    Inventors: Kunihiko Kodama, Hiromi Kanda
  • Patent number: 6020612
    Abstract: A semiconductor integrated circuit includes a gate extending in a first direction, a diffusion-layer region corresponding to the gate, and a plurality of backing wiring lines connected to the diffusion-layer region and extending in a first wiring layer in a second direction substantially perpendicular to the first direction. The semiconductor integrated circuit further includes connection wiring lines providing connections between the plurality of backing wiring lines and provided in a second wiring layer.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: February 1, 2000
    Assignee: Fujitsu Limited
    Inventors: Takahiro Sawamura, Toshiya Uchida, Hiromi Kanda