Patents by Inventor Hiromi Kiyose
Hiromi Kiyose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11508588Abstract: A substrate treatment device according to an embodiment includes: a liquid treatment part configured to supply a liquid onto a substrate to form a liquid film remaining in a liquid state on the substrate; an imaging part configured to capture an image of a front surface of the substrate, on which the liquid film remaining in the liquid state is formed; a determination part configured to determine a quality of a formation state of the liquid film based on the captured image of the substrate; and a post-treatment part configured to treat the substrate on which the liquid film is formed, when the determination part determines that the formation state of the liquid film is good.Type: GrantFiled: May 10, 2018Date of Patent: November 22, 2022Assignee: TOKYO ELECTRON LIMITEDInventor: Hiromi Kiyose
-
Patent number: 11322371Abstract: A substrate processing apparatus includes a liquid film forming unit 16A configured to form a liquid film of a liquid for anti-drying on a substrate; a drying processing unit 16B configured to dry the substrate; and a transfer mechanism 17 configured to transfer the substrate from the liquid film forming unit into the drying processing unit. By a transfer time adjusting operation of adjusting a volatilization amount of the liquid during a transfer of the substrate by adjusting a transfer time during which the substrate is transferred from the liquid film forming unit into the drying processing unit or by an initial liquid film thickness adjusting operation of adjusting a thickness of the liquid film formed in the liquid film forming unit, the thickness of the liquid film when a drying processing is begun in the drying processing unit is controlled to fall within a target range.Type: GrantFiled: November 7, 2018Date of Patent: May 3, 2022Assignee: TOKYO ELECTRON LIMITEDInventor: Hiromi Kiyose
-
Patent number: 11201050Abstract: A substrate processing method capable of suppressing particles from remaining on a surface of a substrate is provided. In the substrate processing method, a liquid film of a protection liquid is formed on the surface of the substrate, and the substrate is dried by using a supercritical fluid so that the protection liquid is removed from the surface of the substrate. After the substrate is dried, the particles remaining on the surface of the substrate is removed.Type: GrantFiled: May 14, 2019Date of Patent: December 14, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Itaru Kanno, Hiromi Kiyose, Gentaro Goshi, Naohiko Hamamura, Takuro Masuzumi, Kenji Sekiguchi, Satoru Tanaka, Teruomi Minami
-
Patent number: 11133176Abstract: In a substrate processing method, as a liquid film forming process, a liquid film of a processing liquid covering a surface of a substrate W is formed by supplying the processing liquid onto the surface of the substrate W while rotating the substrate W at a first rotation number. After the liquid film forming process, as a supply stopping process, a rotation number of the substrate W is set to be of a value equal to or less than the first rotation number and a supply of the processing liquid onto the substrate W is stopped. After the supply stopping process, as a liquid amount adjusting process, a liquid amount of the processing liquid forming the liquid film is reduced by setting the rotation number of the substrate W to a rotation number larger than the first rotation number.Type: GrantFiled: August 8, 2018Date of Patent: September 28, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Kento Tsukano, Gentaro Goshi, Takuro Masuzumi, Hiromi Kiyose, Shogo Fukui
-
Patent number: 10950465Abstract: Disclosed is a method of cleaning a substrate processing apparatus in which a substrate having a surface wet by a liquid is brought into contact with a supercritical fluid so as to perform a drying process of drying the substrate. The method includes a cleaning gas filling process and an exhausting process. The cleaning gas filling process fills a cleaning gas containing isopropyl alcohol in the substrate processing apparatus. The exhausting process exhausts the cleaning gas from an inside of the substrate processing apparatus after the cleaning gas filling process.Type: GrantFiled: November 29, 2017Date of Patent: March 16, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Shotaro Kitayama, Gentaro Goshi, Hiroki Ohno, Keisuke Egashira, Yosuke Kawabuchi, Hiroshi Marumoto, Takuro Masuzumi, Kento Tsukano, Hiromi Kiyose
-
Patent number: 10619922Abstract: Provided is a substrate processing apparatus including a processing container configured to receive a substrate on which a dry preventing liquid is filled and perform a supercritical processing on the substrate; a fluid supply line connected to the processing container and configured to supply a processing fluid to the processing container; a fluid discharge line connected to the processing container and configured to discharge the processing fluid in the processing container; and a first circulation line connected to an upstream side and a downstream side of the processing container, and provided independently from the fluid supply line and the fluid discharge line to circulate the processing fluid in the processing container. The first circulation line is provided with a first reservoir tank that receives the processing fluid from the processing container and has a capacity larger than that of the processing container.Type: GrantFiled: February 24, 2017Date of Patent: April 14, 2020Assignee: Tokyo Electron LimitedInventors: Gentaro Goshi, Hiromi Kiyose, Satoshi Biwa
-
Publication number: 20200090958Abstract: A substrate treatment device according to an embodiment includes: a liquid treatment part configured to supply a liquid onto a substrate to form a liquid film remaining in a liquid state on the substrate; an imaging part configured to capture an image of a front surface of the substrate, on which the liquid film remaining in the liquid state is formed; a determination part configured to determine a quality of a formation state of the liquid film based on the captured image of the substrate; and a post-treatment part configured to treat the substrate on which the liquid film is formed, when the determination part determines that the formation state of the liquid film is good.Type: ApplicationFiled: May 10, 2018Publication date: March 19, 2020Inventor: Hiromi KIYOSE
-
Patent number: 10504718Abstract: During at least part of a time period for a pressure increasing step of increasing a pressure inside a processing container from a pressure lower than a critical pressure of a processing fluid to a pressure higher than the critical pressure, pressure increasing is performed by supplying the processing fluid into the processing container from a fluid supply source while discharging the processing fluid from the processing container at a controlled discharge flow rate. Particles attached to the surfaces of members inside the processing container travel upward by the supply of the processing fluid into the processing container from the fluid supply source. The particles are discharged along with the processing fluid from the processing container.Type: GrantFiled: November 16, 2017Date of Patent: December 10, 2019Assignee: Tokyo Electron LimitedInventors: Hiroki Ohno, Keisuke Egashira, Gentaro Goshi, Yosuke Kawabuchi, Shotaro Kitayama, Hiroshi Marumoto, Takuro Masuzumi, Kento Tsukano, Hiromi Kiyose
-
Publication number: 20190355574Abstract: A substrate processing method capable of suppressing particles from remaining on a surface of a substrate is provided. In the substrate processing method, a liquid film of a protection liquid is formed on the surface of the substrate, and the substrate is dried by using a supercritical fluid so that the protection liquid is removed from the surface of the substrate. After the substrate is dried, the particles remaining on the surface of the substrate is removed.Type: ApplicationFiled: May 14, 2019Publication date: November 21, 2019Inventors: Itaru Kanno, Hiromi Kiyose, Gentaro Goshi, Naohiko Hamamura, Takuro Masuzumi, Kenji Sekiguchi, Satoru Tanaka, Teruomi Minami
-
Patent number: 10395950Abstract: A substrate processing apparatus performs: a pressure raising process of raising a pressure within the processing container to a processing pressure higher than a critical pressure of the processing fluid, after the substrate is accommodated in the processing container; and a circulation process of supplying the processing fluid to the processing container and discharging the processing fluid from the processing container while keeping a pressure at which the processing fluid is maintained in the supercritical state, within the processing container. In the pressure raising process, the supply of the processing fluid from the second fluid supply unit is stopped and the processing fluid is supplied from the first fluid supply unit into the processing container until at least the pressure within the processing container reaches the critical pressure. In the circulation process, the processing fluid is supplied into the processing container from the second fluid supply unit.Type: GrantFiled: November 2, 2017Date of Patent: August 27, 2019Assignee: Tokyo Electron LimitedInventors: Gentaro Goshi, Keisuke Egashira, Yosuke Kawabuchi, Hiromi Kiyose, Takuro Masuzumi, Hiroki Ohno, Kento Tsukano, Hiroshi Marumoto, Shotaro Kitayama
-
Publication number: 20190139791Abstract: A substrate processing apparatus includes a liquid film forming unit 16A configured to form a liquid film of a liquid for anti-drying on a substrate; a drying processing unit 16B configured to dry the substrate; and a transfer mechanism 17 configured to transfer the substrate from the liquid film forming unit into the drying processing unit. By a transfer time adjusting operation of adjusting a volatilization amount of the liquid during a transfer of the substrate by adjusting a transfer time during which the substrate is transferred from the liquid film forming unit into the drying processing unit or by an initial liquid film thickness adjusting operation of adjusting a thickness of the liquid film formed in the liquid film forming unit, the thickness of the liquid film when a drying processing is begun in the drying processing unit is controlled to fall within a target range.Type: ApplicationFiled: November 7, 2018Publication date: May 9, 2019Inventor: Hiromi Kiyose
-
Patent number: 10226959Abstract: A substrate processing device, which processes by immersing the substrate in the processing liquid comprising a mixture of a chemical and a diluting liquid, is provided with: a processing tank (1) that retains the processing liquid; heating means (2, 3) that heat the processing liquid; a temperature detection means (4) that detects the temperature of the processing liquid; a temperature control means (5) that operates the aforementioned heating means (2, 3) in a manner so that the detected temperature approaches a set temperature; a replenishing means (6) that replenishes the diluting liquid in the processing liquid; a concentration detection means (7) that detects the concentration of the processing liquid by measuring the light absorption characteristics of the processing liquid; and a concentration control means (8) that operates the aforementioned replenishing means (6) in a manner so that the detected concentration approaches a set concentration.Type: GrantFiled: July 21, 2011Date of Patent: March 12, 2019Assignees: Kurashiki Boseki Kabushiki Kaisha, Chemical Art Technology, Inc.Inventors: Hiromi Kiyose, Satoru Hiraki, Hiroshi Watanabe
-
Publication number: 20190051519Abstract: In a substrate processing method, as a liquid film forming process, a liquid film of a processing liquid covering a surface of a substrate W is formed by supplying the processing liquid onto the surface of the substrate W while rotating the substrate W at a first rotation number. After the liquid film forming process, as a supply stopping process, a rotation number of the substrate W is set to be of a value equal to or less than the first rotation number and a supply of the processing liquid onto the substrate W is stopped. After the supply stopping process, as a liquid amount adjusting process, a liquid amount of the processing liquid forming the liquid film is reduced by setting the rotation number of the substrate W to a rotation number larger than the first rotation number.Type: ApplicationFiled: August 8, 2018Publication date: February 14, 2019Inventors: Kento Tsukano, Gentaro Goshi, Takuro Masuzumi, Hiromi Kiyose, Shogo Fukui
-
Patent number: 10153182Abstract: A substrate processing apparatus that performs processing by immersing a substrate into a processing liquid obtained by mixing phosphoric acid with a diluent includes a concentration sensing means for sensing the concentration of the processing liquid by measuring the absorbance characteristics of the processing liquid. The concentration sensing means includes a light-transmitting section that introduces the processing liquid into the inside to let the processing liquid pass therethrough, a light-emitting section that radiates light having a predetermined wavelength to the light-transmitting section, a light-receiving section that receives the light therefrom via the light-transmitting section, a first lens that condenses the light emitted from the light-emitting section to the light-transmitting section, a second lens that condenses the light that has passed through the light-transmitting section to the light-receiving section, and a cooling mechanism that cools at least one of these.Type: GrantFiled: August 29, 2012Date of Patent: December 11, 2018Assignees: Kurashiki Boseki Kabushiki Kaisha, Tokyo Electron LimitedInventors: Noboru Higashi, Satoru Hiraki, Hiromi Kiyose, Hideaki Sato, Hiroshi Komiya
-
Publication number: 20180254180Abstract: A substrate processing apparatus of an exemplary embodiment includes a liquid processing unit, a detection unit, and a post-processing unit. The liquid processing unit supplies a liquid to a substrate to form a liquid film on the substrate. The detection unit detects the amount of a liquid on the substrate to determine whether the amount of the liquid is acceptable or not. The post-processing unit processes the substrate having the liquid film formed thereon.Type: ApplicationFiled: March 1, 2018Publication date: September 6, 2018Inventors: Gentaro Goshi, Keisuke Egashira, Kento Tsukano, Hiroshi Marumoto, Takuro Masuzumi, Katsuhiro Ookawa, Hiromi Kiyose
-
Patent number: 10037901Abstract: A substrate liquid treatment apparatus includes: at least one processing unit that processes a substrate with a treatment liquid; a storage tank that stores the treatment liquid; a circulation line through which the treatment liquid discharged from the storage tank into the circulation line is returned to the storage tank; a branch supply line that is branched from the circulation line to supply the treatment liquid to the processing unit; a recovery line that returns to the storage tank the treatment liquid having been supplied to the substrate in the processing unit; a distribution line connecting the circulation line and the recovery line; and a shutoff valve, provided on the distribution line, that is opened when cleaning of the recovery line is performed.Type: GrantFiled: May 15, 2015Date of Patent: July 31, 2018Assignee: Tokyo Electron LimitedInventors: Kazuya Koyama, Hiromi Kiyose, Katsufumi Matsuki, Shuhei Takahashi, Hideki Nishimura, Takashi Uno, Hirotaka Maruyama
-
Publication number: 20180158699Abstract: Disclosed is a method of cleaning a substrate processing apparatus in which a substrate having a surface wet by a liquid is brought into contact with a supercritical fluid so as to perform a drying process of drying the substrate. The method includes a cleaning gas filling process and an exhausting process. The cleaning gas filling process fills a cleaning gas containing isopropyl alcohol in the substrate processing apparatus. The exhausting process exhausts the cleaning gas from an inside of the substrate processing apparatus after the cleaning gas filling process.Type: ApplicationFiled: November 29, 2017Publication date: June 7, 2018Inventors: Shotaro Kitayama, Gentaro Goshi, Hiroki Ohno, Keisuke Egashira, Yosuke Kawabuchi, Hiroshi Marumoto, Takuro Masuzumi, Kento Tsukano, Hiromi Kiyose
-
Publication number: 20180138035Abstract: During at least part of a time period for a pressure increasing step of increasing a pressure inside a processing container from a pressure lower than a critical pressure of a processing fluid to a pressure higher than the critical pressure, pressure increasing is performed by supplying the processing fluid into the processing container from a fluid supply source while discharging the processing fluid from the processing container at a controlled discharge flow rate. Particles attached to the surfaces of members inside the processing container travel upward by the supply of the processing fluid into the processing container from the fluid supply source. The particles are discharged along with the processing fluid from the processing container.Type: ApplicationFiled: November 16, 2017Publication date: May 17, 2018Inventors: Hiroki Ohno, Keisuke Egashira, Gentaro Goshi, Yosuke Kawabuchi, Shotaro Kitayama, Hiroshi Marumoto, Takuro Masuzumi, Kento Tsukano, Hiromi Kiyose
-
Publication number: 20180130675Abstract: A substrate processing apparatus performs: a pressure raising process of raising a pressure within the processing container to a processing pressure higher than a critical pressure of the processing fluid, after the substrate is accommodated in the processing container; and a circulation process of supplying the processing fluid to the processing container and discharging the processing fluid from the processing container while keeping a pressure at which the processing fluid is maintained in the supercritical state, within the processing container. In the pressure raising process, the supply of the processing fluid from the second fluid supply unit is stopped and the processing fluid is supplied from the first fluid supply unit into the processing container until at least the pressure within the processing container reaches the critical pressure. In the circulation process, the processing fluid is supplied into the processing container from the second fluid supply unit.Type: ApplicationFiled: November 2, 2017Publication date: May 10, 2018Inventors: Gentaro Goshi, Keisuke Egashira, Yosuke Kawabuchi, Hiromi Kiyose, Takuro Masuzumi, Hiroki Ohno, Kento Tsukano, Hiroshi Marumoto, Shotaro Kitayama
-
Patent number: 9953840Abstract: A substrate processing method according to the present disclosure includes: a liquid processing process of supplying a processing liquid to a substrate having a surface on which a pattern having a plurality of convex portions is formed; a drying process of removing the processing liquid existing on the surface of the substrate dry the substrate, and a separating process of separating a sticking portion between adjacent ones of the convex portions after the drying process.Type: GrantFiled: December 7, 2016Date of Patent: April 24, 2018Assignee: Tokyo Electron LimitedInventors: Hiroshi Marumoto, Hisashi Kawano, Hiromi Kiyose, Mitsunori Nakamori, Kazuyuki Mitsuoka