Patents by Inventor Hiromichi Takatsu

Hiromichi Takatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board, manufacturing method of circuit board, suspension substrate, suspension, device-mounted suspension, and hard disk drive
    Patent number: 8609992
    Abstract: The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.
    Type: Grant
    Filed: December 24, 2010
    Date of Patent: December 17, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Junichi Chiyonaga, Hiromichi Takatsu, Yoichi Miura, Yoichi Nagai
  • CIRCUIT BOARD, MANUFACTURING METHOD OF CIRCUIT BOARD, SUSPENSION SUBSTRATE, SUSPENSION, DEVICE-MOUNTED SUSPENSION, AND HARD DISK DRIVE
    Publication number: 20120241200
    Abstract: The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area.
    Type: Application
    Filed: December 24, 2010
    Publication date: September 27, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Junichi Chiyonaga, Hiromichi Takatsu, Yoichi Miura, Yoichi Nagai