Abstract: A method of fabricating a ceramic laminated electronic component including the steps of preparing a plurality of ceramic green sheets each having electrode pastes in a plurality of regions and having positioning marks printed in positions having a constant positional relationship to the electrode pastes, removing wrinkles in each of the ceramic green sheets to flatten the ceramic green sheet on a suction plate, and transferring the flattened ceramic green sheet to a laminating stage by a suction chuck, laminating the ceramic green sheet on the laminating stage on the basis of the above positioning marks, and preliminarily fixing the ceramic green sheets to each other in the case of the lamination in obtaining a mother ceramic laminated body for the ceramic laminated electronic component.

Abstract: A holder for holding a plurality of electronic component chips, each of which is provided with external terminal electrodes on both of longitudinal ends thereof, has a plurality of receiving portions defined by through holes for receiving respective ones of the electronic component chips one by one. An elastic member is formed on an inner peripheral surface defining each of the receiving portions, for elastically holding each of the electronic component chips. Each electronic component chip is received in each receiving portion to be longitudinally and crosswisely oriented toward a direction orthogonal to the axis of the receiving portion. This electronic component chip holder is advantageously employed to perform various operations such as measurement, marking, taping, magazinization and mounting of the electronic component chips.