Patents by Inventor Hiromitsu Watanabe
Hiromitsu Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942234Abstract: A coaxial cable is composed of a conductor, an insulator covering a periphery of the conductor, a shield layer covering a periphery of the insulator, and a sheath covering a periphery of the shield layer. The shield layer is configured to include a lateral winding shielding portion with a plurality of metal wires being helically wrapped around the periphery of the insulator, and a batch plating portion made of a hot-dip plating covering respective peripheries of the lateral winding shielding portion. The shield layer includes a joining portion where the metal wires adjacent to each other in a circumferential direction are joined with each other with the batch plating portion at a spaced portion where the adjacent metal wires are spaced apart from each other, and the non-joining portion where the metal wires adjacent to each other in the circumferential direction are not joined with each other with the batch plating portion at the spaced portion.Type: GrantFiled: August 24, 2021Date of Patent: March 26, 2024Assignee: PROTERIAL, LTD.Inventors: Detian Huang, Takanobu Watanabe, Hiromitsu Kuroda, Hideki Nonen
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Patent number: 11464782Abstract: Provided is a therapeutic or prophylactic agent for pain or interstitial cystitis comprising N-[2-(6,6-dimethyl-4,5,6,7-tetrahydro-H-indazol-3-yl)-1H-indol-6-yl]-N-methyl-(2S)-2-(morpholin-4-yl)propanamide or a pharmaceutically acceptable salt thereof.Type: GrantFiled: May 24, 2019Date of Patent: October 11, 2022Assignee: Japan Tobacco Inc.Inventors: Yoshifumi Ueda, Mutsuyoshi Matsushita, Yoshihiro Kitagawa, Akira Matsuo, Tatsuya Maekawa, Sotaro Takigawa, Hiromitsu Watanabe, Naoki Miyagawa, Yuji Hamada, Tetsuya Hondo
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Patent number: 11192216Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.Type: GrantFiled: February 15, 2018Date of Patent: December 7, 2021Assignee: EBARA CORPORATIONInventors: Hiromitsu Watanabe, Kuniaki Yamaguchi, Itsuki Kobata, Yutaka Wada
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Patent number: 11141832Abstract: A water discharge system for a substrate processing apparatus comprising a substrate processor that processes a substrate using liquid, includes: at least two water discharge lines capable of discharging the liquid used in the substrate processor; a switching device configured to switch a water discharge line to which the liquid used in the substrate processor is to be discharged among the at least two water discharge lines; a measurement device configured to generate water discharge information by measuring the liquid used in the substrate processor; and a control mechanism configured to control the switching device in accordance with the water discharge information.Type: GrantFiled: February 8, 2017Date of Patent: October 12, 2021Assignee: EBARA CORPORATIONInventor: Hiromitsu Watanabe
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Publication number: 20210205320Abstract: Provided is a therapeutic or prophylactic agent for pain or interstitial cystitis comprising N-[2-(6,6-dimethyl-4,5,6,7-tetrahydro-H-indazol-3-yl)-1H-indol-6-yl]-N-methyl-(2S)-2-(morpholin-4-yl)propanamide or a pharmaceutically acceptable salt thereof.Type: ApplicationFiled: May 24, 2019Publication date: July 8, 2021Inventors: Yoshifumi UEDA, Mutsuyoshi MATSUSHITA, Yoshihiro KITAGAWA, Akira MATSUO, Tatsuya MAEKAWA, Sotaro TAKIGAWA, Hiromitsu WATANABE, Naoki MIYAGAWA, Yuji Hamada, Tetsuya HONDO
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Publication number: 20180169831Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.Type: ApplicationFiled: February 15, 2018Publication date: June 21, 2018Inventors: Hiromitsu WATANABE, Kuniaki YAMAGUCHI, Itsuki KOBATA, Yutaka WADA
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Publication number: 20170229323Abstract: A water discharge system for a substrate processing apparatus comprising a substrate processor that processes a substrate using liquid, includes: at least two water discharge lines capable of discharging the liquid used in the substrate processor; a switching device configured to switch a water discharge line to which the liquid used in the substrate processor is to be discharged among the at least two water discharge lines; a measurement device configured to generate water discharge information by measuring the liquid used in the substrate processor; and a control mechanism configured to control the switching device in accordance with the water discharge information.Type: ApplicationFiled: February 8, 2017Publication date: August 10, 2017Inventor: Hiromitsu Watanabe
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Publication number: 20150140907Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.Type: ApplicationFiled: October 21, 2014Publication date: May 21, 2015Inventors: Hiromitsu WATANABE, Kuniaki YAMAGUCHI, Itsuki KOBATA, Yutaka WADA
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Publication number: 20120302636Abstract: Provided is a method of treating or preventing a disorder in a subject comprising administering twice per day a therapeutically effective amount of a compound of formula (I) or a pharmaceutically acceptable salt, solvate, or hydrate thereof, to a subject that has or is at risk of having a disorder selected from the group consisting of hyperlipidemia, arteriosclerosis, coronary artery diseases, metabolic syndrome, obesity, diabetes, prediabetes, and hypertension, whereupon the disorder is treated or prevented in the subject. The method optionally comprises administering a therapeutically effective amount of the compound of formula (I), or a pharmaceutically acceptable salt, solvate, or hydrate thereof, to the subject, in which the therapeutically effective amount is increased once or twice during the course of administration.Type: ApplicationFiled: December 16, 2011Publication date: November 29, 2012Inventors: Harutoshi KON, Yoshiro Masuda, Hiromitsu Watanabe
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Patent number: 7960188Abstract: A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.Type: GrantFiled: May 13, 2009Date of Patent: June 14, 2011Assignee: Ebara CorporationInventors: Shinrou Ohta, Mitsuo Tada, Noburu Shimizu, Yoichi Kobayashi, Taro Takahashi, Eisaku Hayashi, Hiromitsu Watanabe, Tatsuya Kohama, Itsuki Kobata
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Publication number: 20090286332Abstract: A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film, during the second polishing process and the third polishing process, monitoring a polishing state of the substrate with an eddy current sensor, and terminating the third polishing process when an output signal of the eddy current sensor reaches a predetermined threshold.Type: ApplicationFiled: May 13, 2009Publication date: November 19, 2009Inventors: Shinrou OHTA, Mitsuo Tada, Noburu Shimizu, Yoichi Kobayashi, Taro Takahashi, Eisaku Hayashi, Hiromitsu Watanabe, Tatsuya Kohama, Itsuki Kobata
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Patent number: 6041037Abstract: In an ATM virtual path switching node, upon being notified of a current virtual path by a virtual path monitoring unit, a link fault determination unit compares the number of faulty current virtual paths with a predetermined threshold value. When the number of faulty current virtual paths is equal to or larger than the threshold value, a link fault is determined, and a message communication unit transmits/receives a link fault notification signal to/from another ATM virtual path switching node. When the number of faulty current virtual paths is smaller than the threshold value, a current virtual path fault is determined, and the message communication unit transmits/receives a virtual path fault notification signal to/from another ATM virtual path switching node. The message communication unit transmits a switching control signal for designating switching from the current virtual path to a stand-by virtual path.Type: GrantFiled: August 18, 1997Date of Patent: March 21, 2000Assignee: NEC CorporationInventors: Makoto Nishio, Hiromitsu Watanabe
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Patent number: 6010973Abstract: A dielectric forming material for a plasma display panel enables to form a dielectric layer having a high dielectric strength and good transparency. The dielectric forming material is provided with a green sheet in form that comprises, as a component, glass powder having a 50% particle diameter D.sub.50 which is not more than 2.8 .mu.m. Preferably, the glass powder preferably may have the maximum particle diameter D.sub.MAX which is not more than 18 .mu.m. Desirably, the green sheet essentially may consist by weight of 60-80% the glass powder, 0-10% ceramic powder, 5-30% thermoplastic resin, and 0-10% plasticizer.Type: GrantFiled: July 28, 1998Date of Patent: January 4, 2000Assignee: Nippon Electric Glass, Co., Ltd.Inventors: Hiromitsu Watanabe, Hiroyuki Oshita, Masahiko Ohji, Kazuo Hadano
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Patent number: 5745225Abstract: An apparatus of for measuring roughness of a road surface such as convex, concave or inclination is to be mounted on the vehicle. The apparatus comprises a rotation driving member for generating rotation motion in vertical plane and for outputting a signal concerning its rotation angle. An inclinometer is provided to detect an inclined angle of the rotation driving member. A distance measuring member for measuring distance from road surface as being rotated by the rotation motion from said rotation driving member. A processing unit calculates a vertical distance and a horizontal distance between the apparatus and the road surface by means of the inclined angle detected by the inclinometer and the rotation angle detected by the rotation driving member.Type: GrantFiled: December 14, 1995Date of Patent: April 28, 1998Assignee: Tokimec, Inc.Inventors: Hiromitsu Watanabe, Noriyuki Takeuchi, Tetsuya Arimoto
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Patent number: 5584598Abstract: A concrete-floor finisher includes a plurality of rotary shafts (28) supported on a supporting plate (2) of a machine proper (1) so as to be tiltable in x and y directions and rotatable opposite to each other, and a plurality of blades (12a to 12d) radially arranged relative to a rotor (10) at the lower part of each of the rotary shafts and respectively held in place by a plurality of fitting members (13), and a rocking supporting unit (14) for the fitting member of each blade is composed of a fixed plate (15) attached to the upper surface of the blade, a holding member (16) attached to the vertical plate portion of the fixed plate, a bearing (18) pivotally supporting substantially the central portion of the holding member (16) by a supporting pin (17) extended in the tangential direction of the circle of rotation, and means for fitting a square cylindrical portion (19) of the bearing onto the forward end of the fitting member and removably fixing in place with a bolt (21) or the like, thus ensuring 20.Type: GrantFiled: October 24, 1995Date of Patent: December 17, 1996Assignee: Tokimec Inc.Inventors: Hiromitsu Watanabe, Noriyuki Takeuchi, Tetsuya Arimoto, Atsushi Yamashiro
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Patent number: 4811810Abstract: Two embodiments of three wheeled shaft driven vehicles embodying an improved construction for affixing the final drive assembly to the remaining portion of the vehicle. The attachment is accomplished in a way that facilitates alignment and servicing. In each embodiment, the final drive assembly is not provided with any suspension and is affixed directly to the frame. In one embodiment, a splined connection is employed for rotatably coupling the transmission output shaft with the final drive input shaft. In the other embodiment, a universal joint is used for this purpose.Type: GrantFiled: October 21, 1983Date of Patent: March 14, 1989Assignee: Yamaha Hatsudoki KabushikiInventor: Hiromitsu Watanabe
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Patent number: 4719984Abstract: An improved drive and braking arrangement for an off the road single rider multi-wheeled vehicle. The drive arrangement includes a shaft drive and the brake includes a brake disk that is fixed for rotation with the drive shaft. The brake disk is contained within a housing for its protection and the housing is made up of two pieces, one of which is affixed to a tube that contains the drive shaft and is affixed to the engine and the other of which is affixed to a tube that forms a portion of the final drive.Type: GrantFiled: November 19, 1986Date of Patent: January 19, 1988Assignee: Yamaha Hatsudoki Kabushiki KaishaInventor: Hiromitsu Watanabe
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Patent number: 4691799Abstract: A three wheeled shaft driven off the road vehicle having an improved driving arrangement. The driving arrangement includes an overload release coupling that is positioned between the driven gear and a drive shaft that drives the rear wheels so as to minimize the complexity of the transmission and to protect the engine and drive. A trailing arm rear suspension is emloyed that has widely spaced bearings for rotatably journaling the rear axle to minimize unit loadings. An arrangement is also disclosed for facilitating axial positioning of the driven gear on the output shaft without necessitating the use of shims.Type: GrantFiled: June 12, 1985Date of Patent: September 8, 1987Assignee: Yamaha Hatsudoki Kabushiki KaishaInventor: Hiromitsu Watanabe
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Patent number: 4582157Abstract: Several embodiments of improved three wheel vehicles particularly adapted for off the road use. In each embodiment, the rear wheels are suspended by a suspension system that includes a suspension element that has its line of action is disposed at a relatively shallow angle to the horizontal so as to provide a long suspension travel. A trailing arm assembly is provided in each embodiment for suspending the rear wheels. The trailing arm assembly includes a pair of spaced apart arm members that are pivotally supported by a frame at their forward end. The pivot points of the arm members on the frame are transversely spaced apart a distance substantially equal to the width of the vehicle so as to improve stability. In some embodiments, a shaft drive is incorporated that passes through one arm of the arm members. In some embodiments, the suspension element is offset from the longitudinal axis of the vehicle toward the side opposite that on which the shaft drive is located.Type: GrantFiled: January 4, 1983Date of Patent: April 15, 1986Assignee: Yamaha Hatsudoki Kabushiki KaishaInventor: Hiromitsu Watanabe
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Patent number: 4540061Abstract: A three wheeled shaft driven off the road vehicle having an improved driving arrangement. The driving arrangement includes an overload release coupling that is positioned between the driven gear and a drive shaft that drives the rear wheels so as to minimize the complexity of the transmission and to protect the engine and drive. A trailing arm rear suspension is employed that has widely spaced bearings for rotatably journaling the rear axle to minimize unit loadings. An arrangement is also disclosed for facilitating axial positioning of the driven gear on the output shaft without necessitating the use of shims.Type: GrantFiled: March 16, 1983Date of Patent: September 10, 1985Assignee: Yamaha Hatsudoki Kabushiki KaishaInventor: Hiromitsu Watanabe