Patents by Inventor Hironobu Ichihara

Hironobu Ichihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for heat-treating substrate having film-forming composition thereon
    Patent number: 6382964
    Abstract: Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: May 7, 2002
    Assignees: Noritake Co., Ltd., Kyushu Noritake Co., Ltd.
    Inventors: Susumu Sakamoto, Hiroshi Oshima, Hiroyuki Mori, Hironobu Ichihara, Yoji Sato
  • Process and apparatus for heat-treating substrate having film-forming composition thereon
    Publication number: 20010023055
    Abstract: Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.
    Type: Application
    Filed: May 22, 2001
    Publication date: September 20, 2001
    Applicant: Noritake Co., Ltd. and Kyushu Noritake Co., Ltd.
    Inventors: Susumu Sakamoto, Hiroshi Oshima, Hiroyuki Mori, Hironobu Ichihara, Yoji Sato
  • Process and apparatus for heat-treating substrate having film-forming composition thereon
    Patent number: 6261091
    Abstract: Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.
    Type: Grant
    Filed: October 25, 1999
    Date of Patent: July 17, 2001
    Assignees: Noritake Co., Ltd., Kyushu Noritake Co., Ltd.
    Inventors: Susumu Sakamoto, Hiroshi Oshima, Hiroyuki Mori, Hironobu Ichihara, Yoji Sato
  • Process for heat-treating substrate having film-forming composition thereon
    Patent number: 5980991
    Abstract: Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: November 9, 1999
    Assignees: Noritake Co., Ltd., Kyushu Noritake Co., Ltd.
    Inventors: Susumu Sakamoto, Hiroshi Oshima, Hiroyuki Mori, Hironobu Ichihara, Yoji Sato