Patents by Inventor Hironobu Kanesawa

Hironobu Kanesawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-contact IC card having an antenna coil formed by a plating method
    Patent number: 6412702
    Abstract: In a non-contact IC card comprising a flexible board having a principal surface and an electronic circuit part mounted on the principal surface of the flexible board, an antenna coil is formed on the principal surface of the flexible board by a plating method. The electronic circuit part includes at least one IC chip. The antenna coil is connected to the electronic circuit part.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: July 2, 2002
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Yoshihiro Ishikawa, Hironobu Kanesawa
  • Method for producing flexible board
    Patent number: 6027762
    Abstract: A method of producing a flexible board includes printing a circuit pattern on a base film, and providing a plating onto a surface of the circuit pattern.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: February 22, 2000
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Tsutomu Tomita, Hironobu Kanesawa, Takaaki Murata, Shingo Naito, Toshiki Hayasaka