Patents by Inventor Hironobu Yamasaki

Hironobu Yamasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11295935
    Abstract: The electromagnet device of the present invention comprises: a yoke having an annular groove in a front surface thereof; an annular coil provided in the groove; and an epoxy resin provided on an outer surface of the coil configured to secure the coil to the yoke, wherein there is a clearance between an outer circumferential surface of the groove in the yoke and the epoxy resin provided on an radially outer side of the coil.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: April 5, 2022
    Assignee: EBARA CORPORATION
    Inventors: Tomonori Ohashi, Toshimitsu Barada, Hironobu Yamasaki, Misako Kudo, Ichiju Sato
  • Publication number: 20180114678
    Abstract: The electromagnet device of the present invention comprises: a yoke having an annular groove in a front surface thereof; an annular coil provided in the groove; and an epoxy resin provided on an outer surface of the coil configured to secure the coil to the yoke, wherein there is a clearance between an outer circumferential surface of the groove in the yoke and the epoxy resin provided on an radially outer side of the coil.
    Type: Application
    Filed: May 9, 2016
    Publication date: April 26, 2018
    Inventors: Tomonori OHASHI, Toshimitsu BARADA, Hironobu YAMASAKI, Misako KUDO, Ichiju SATO
  • Publication number: 20150293951
    Abstract: A control method is executed by a computer that classifies given data into a group according to a property amount of a given type among property amounts of various types that the given data has and that stores the given data to a storage device. The control method includes writing to the storage device and for each group, information that indicates distribution positions of the property amounts in the classified given data; calculating based on the written information, information that indicates a proximity of the distribution positions of the property amounts between the groups; and classifying data of the same type as the given data into a group, according to a property amount of a different type from the given type among the various types of property amounts, when the calculated information satisfies a given condition, and storing the data to the storage device.
    Type: Application
    Filed: June 26, 2015
    Publication date: October 15, 2015
    Inventor: Hironobu Yamasaki
  • Patent number: 7714572
    Abstract: A method of detecting a characteristic (such as thickness) of first and second films formed on a substrate includes supplying a sensor coil with a first alternating current having a first frequency when detecting the first film, and a second alternating current having a second frequency when detecting the second film. An eddy current is thereby generated in the first film or the second film. An impedance across the sensor coil is measured, and the characteristic of any one of the first film and the second film is detected based on the impedance.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: May 11, 2010
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Hironobu Yamasaki, Yasunari Suto
  • Publication number: 20070048145
    Abstract: A vacuum evacuation device 2 of the invention comprises a vacuum pump 4,5 for exhausting a gas G2 in a process chamber 21 into which a process gas G1 is introduced and in which a process reaction is performed, to form a vacuum in said process chamber 21; and a control means 6 for performing a first control that regulates the rotational speed of said vacuum pump 4,5 such that a pressure condition in said process chamber 21 reaches a pressure condition suitable for said process reaction during said process reaction, wherein said control means 6 calculates a specified rotational speed for said vacuum pump 4,5 based on process information related to said process reaction, and performs a second control that brings said vacuum pump 4,5 to said specified rotational speed before said first control. The vacuum evacuation device 2 is capable of bringing the pressure in a process chamber 21 to the target pressure in a short period without a vacuum pump 4,5 being overloaded, regardless of the process reaction condition.
    Type: Application
    Filed: August 10, 2006
    Publication date: March 1, 2007
    Inventors: Katsutoshi Ishii, Ken Nakao, Takanobu Asano, Kota Umezawa, Hiroaki Ogamino, Tadashi Urata, Katsuaki Usui, Masafumi Inoue, Shinichi Sekiguchi, Hironobu Yamasaki
  • Publication number: 20060214657
    Abstract: An eddy current sensor and a method for detecting the thickness of a film formed on a substrate. The eddy current sensor, which is capable of stable operation, is operable to accurately detect a polishing endpoint. The eddy current sensor detects the thickness of a conductive film from a change in an eddy current loss generated in the conductive film. The eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and an active element unit connected to the sensor coil for oscillating a variable frequency corresponding to the eddy current loss. The sensor coil and active element unit are integrated to form the eddy current sensor. Alternatively, the eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and a detector for detecting a change in the thickness of the conductive film from a change in a resistance component in an impedance formed by the sensor coil and conductive film.
    Type: Application
    Filed: May 30, 2006
    Publication date: September 28, 2006
    Inventors: Mitsuo Tada, Hironobu Yamasaki, Yasunari Suto
  • Patent number: 7078894
    Abstract: An eddy current sensor and a method for detecting the thickness of a film formed on a substrate. The eddy current sensor, which is capable of stable operation, is operable to accurately detect a polishing endpoint. The eddy current sensor detects the thickness of a conductive film from a change in an eddy current loss generated in the conductive film. The eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and an active element unit connected to the sensor coil for oscillating a variable frequency corresponding to the eddy current loss. The sensor coil and active element unit are integrated to form the eddy current sensor. Alternatively, the eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and a detector for detecting a change in the thickness of the conductive film from a change in a resistance component in an impedance formed by the sensor coil and conductive film.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: July 18, 2006
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Hironobu Yamasaki, Yasunari Suto
  • Patent number: 7046001
    Abstract: A frequency measuring device capable of accurately detecting an end point of polishing a semiconductor wafer by obtaining a frequency measurement result highly accurately in a short period of time. A device FC, which measures the frequency of a measured signal comprises a counting section including a plurality of n-nary counters, a time reference circuit which outputs a time reference signal for every predetermined time interval, and a plurality of gate circuits whose outputs are connected to the inputs of the n-nary counters. The gate circuits receive the measured signal at a first input and receive the time reference signal at the predetermined time intervals at a second input. With this structure, the counting section supplies the frequency measured result of the measured signal every predetermined time interval.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: May 16, 2006
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Hironobu Yamasaki, Yasunari Suto
  • Publication number: 20040032256
    Abstract: An eddy current sensor and a method for detecting the thickness of a film formed on a substrate. The eddy current sensor, which is capable of stable operation, is operable to accurately detect a polishing endpoint. The eddy current sensor detects the thickness of a conductive film from a change in an eddy current loss generated in the conductive film. The eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and an active element unit connected to the sensor coil for oscillating a variable frequency corresponding to the eddy current loss. The sensor coil and active element unit are integrated to form the eddy current sensor. Alternatively, the eddy current sensor comprises a sensor coil for generating an eddy current in the conductive film, and a detector for detecting a change in the thickness of the conductive film from a change in a resistance component in an impedance formed by the sensor coil and conductive film.
    Type: Application
    Filed: August 13, 2003
    Publication date: February 19, 2004
    Inventors: Mitsuo Tada, Hironobu Yamasaki, Yasunari Suto
  • Publication number: 20020047705
    Abstract: Disclosed is a frequency measuring device capable of accurately detecting an end point of polishing a semiconductor wafer by obtaining a frequency measurement result highly accurately in a short period of time. A device FC for measuring the frequency of a measured signal. Vin comprises a counting section including a number i (i2) of n-nary counters 1−i, a time reference circuit 13 which outputs a time reference signal T, whose duration is t, every time interval p, and a number I of gate circuits G1 to Gi whose outputs are connected to the inputs of the n-nary counters 1-i. The gate circuits receive the measured signal Vin at a first input and receive the time reference signal T at time intervals p at a second input. With this structure, the counting section supplies the frequency measured result of the measured signal Vin every time interval p.
    Type: Application
    Filed: October 19, 2001
    Publication date: April 25, 2002
    Inventors: Mitsuo Tada, Hironobu Yamasaki, Yasunari Suto
  • Patent number: 5757148
    Abstract: A motor having windings normally energizable by electric power from an AC power supply is stopped in case of an emergency such as a failure of the AC power supply. The motor has a rotor rotatably supported by magnetic bearings out of contact therewith. The windings of the motor are normally energized by a motor driver with the electric power from the AC power supply. When the AC power supply fails, a battery power supply supplies electric power to the windings of the motor to brake the rotor and also to the magnetic bearings to continuously operate the magnetic bearings. A switching controller which includes timers and logic circuit elements controls times to supply the electric power from the battery power supply to the windings of the motor and the magnetic bearings. The switching controller has timers for controlling the times.
    Type: Grant
    Filed: March 11, 1997
    Date of Patent: May 26, 1998
    Assignee: Ebara Corporation
    Inventors: Hiroyuki Shinozaki, Hironobu Yamasaki, Kazunari Nasa