Patents by Inventor Hironori Hayakawa
Hironori Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240102552Abstract: A continuously variable transmission includes: a first pulley and a second pulley each including a fixed pulley and a movable pulley; and an endless member wound around the first pulley and the second pulley, wherein the continuously variable transmission continuously changes a speed ratio by controlling a thrust of the movable pulley with a hydraulic pressure, the thrust of the movable pulley is made smaller as a rotation speed of the first pulley decreases, and when the rotation speed of the first pulley is lower than a predetermined rotation speed, the thrust of the movable pulley in a case where the speed ratio is on a Low side of the predetermined speed ratio is not made smaller than the thrust of the movable pulley in a case where the speed ratio is on a High side of the predetermined speed ratio.Type: ApplicationFiled: February 7, 2022Publication date: March 28, 2024Applicants: JATCO Ltd, NISSAN MOTOR CO., LTD.Inventors: Shou OKUTANI, Masahiro KUSUDA, Tomohiro UTAGAWA, Hironori MIYAISHI, Seiichirou TAKAHASHI, Yusuke NAKANO, Hiromu SOYA, Jumpei HAYAKAWA, Makoto OGURI
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Patent number: 10845066Abstract: A heat source unit of a refrigerating apparatus includes a heat exchanger, a blower, an electronic component controlling driving of an actuator, a casing having a vent, and first and second partitioning plates. The heat exchanger has first, second, third and fourth side face parts. The first partitioning plate is disposed between the first and fourth side face parts. An interior of the casing has a first space surrounded by the first to fourth side face parts and the first partitioning plate, and a second space partitioned from the first space by the first partitioning plate. The second space is divided by the second partitioning plate into a third space and a fourth space situated below the third space and exposed externally from the casing. The electrical component is disposed in the third space. The second partitioning plate has a first ventilation opening communicating between the third and fourth spaces.Type: GrantFiled: March 27, 2014Date of Patent: November 24, 2020Assignee: Daikin Industries, Ltd.Inventor: Hironori Hayakawa
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Patent number: 10777709Abstract: Provided is a substrate with transparent electrode, which is capable of achieving both acceleration of crystallization dining a heat treatment and suppression of crystallization under a normal temperature environment. In the substrate with transparent electrode, a transparent electrode thin-film formed of a transparent conductive oxide is formed on a film substrate. An underlayer that contains a metal oxide as a main component is formed between the film substrate and the transparent electrode thin-film. The underlayer and the transparent electrode thin-film are in contact with each other. The transparent electrode thin-film is amorphous, and the base layer is dielectric and crystalline.Type: GrantFiled: March 6, 2019Date of Patent: September 15, 2020Assignee: KANEKA CORPORATIONInventors: Takashi Kuchiyama, Hironori Hayakawa, Hiroaki Ueda, Yuji Motohara, Kenji Yamamoto
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Patent number: 10662521Abstract: A substrate with a transparent electrode which includes an amorphous transparent electrode layer on a transparent film substrate. When a bias voltage of 0.1 V is applied to the amorphous transparent electrode layer, the layer has continuous regions where a current value at a voltage-applied surface is 50 nA or more. Each of the continuous regions has an area of 100 nm2 or more and the number of the continuous regions is 50/?m2 or more. In one embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. With respect to the substrate with a transparent electrode according to the present invention, the transparent electrode layer may be crystallized in a short period of time.Type: GrantFiled: January 25, 2018Date of Patent: May 26, 2020Assignee: KANEKA CORPORATIONInventors: Hironori Hayakawa, Takashi Kuchiyama, Kenji Yamamoto
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Publication number: 20190207060Abstract: Provided is a substrate with transparent electrode, which is capable of achieving both acceleration of crystallization dining a heat treatment and suppression of crystallization under a normal temperature environment. In the substrate with transparent electrode, a transparent electrode thin-film formed of a transparent conductive oxide is formed on a film substrate. An underlayer that contains a metal oxide as a main component is formed between the film substrate and the transparent electrode thin-film. The underlayer and the transparent electrode thin-film are in contact with each other. The transparent electrode thin-film is amorphous, and the base layer is dielectric and crystalline.Type: ApplicationFiled: March 6, 2019Publication date: July 4, 2019Inventors: Takashi Kuchiyama, Hironori Hayakawa, Hiroaki Ueda, Yuji Motohara, Kenji Yamamoto
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Patent number: 10270010Abstract: Provided is a substrate with transparent electrode, which is capable of achieving both acceleration of crystallization during a heat treatment and suppression of crystallization under a normal temperature environment. In the substrate with transparent electrode, a transparent electrode thin-film formed of a transparent conductive oxide is formed on a film substrate. An underlayer that contains a metal oxide as a main component is formed between the film substrate and the transparent electrode thin-film. The underlayer and the transparent electrode thin-film are in contact with each other. The transparent electrode thin-film is amorphous, and the base layer is dielectric and crystalline.Type: GrantFiled: January 19, 2015Date of Patent: April 23, 2019Assignee: KANEKA CORPORATIONInventors: Takashi Kuchiyama, Hironori Hayakawa, Hiroaki Ueda, Yuji Motohara, Kenji Yamamoto
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Patent number: 10173393Abstract: A transparent electrode-equipped substrate includes a metal oxide transparent electrode layer on a transparent substrate. The average maximum curvature Ssc of the surface of the transparent electrode layer is preferably 5.4×10?4 nm?1 or less. For example, if the transparent electrode layer is subjected to a surface treatment by low discharge-power sputtering after deposition, the Ssc of the transparent electrode layer can be reduced. This transparent electrode-equipped substrate excels in close adhesion between the transparent electrode layer and a lead-out wiring line disposed on the transparent electrode layer. The transparent electrode layer is obtained by, for example, performing a transparent electrode deposition step of through the application of a first discharge power and then performing a surface treatment step through the application of a second discharge power.Type: GrantFiled: March 18, 2016Date of Patent: January 8, 2019Assignee: KANEKA CORPORATIONInventors: Hironori Hayakawa, Shinya Omoto, Takashi Kuchiyama
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Patent number: 10138541Abstract: A resin substrate with a transparent electrode having a low resistance, and a manufacturing method thereof including: a deposition step wherein a transparent electrode layer of indium tin oxide is formed on a transparent film substrate by a sputtering method, and a crystallization step wherein the transparent electrode layer is crystallized. In the deposition step, a sputtering deposition is performed using a sputtering target containing indium oxide and tin oxide, while a sputtering gas containing argon and oxygen is introduced into a chamber. It is preferable that an effective exhaust rate S, calculated from a rate Q of the sputtering gas introduced into the chamber and a pressure P in the chamber by a formula S (L/second)=1.688×Q (sccm)/P (Pa), is 1,200-5,000 (L/second). It is also preferable that a resistivity of the transparent electrode layer is less than 3×10?4 ?cm.Type: GrantFiled: August 23, 2013Date of Patent: November 27, 2018Assignee: Kaneka CorporationInventors: Hironori Hayakawa, Takashi Kuchiyama, Hiroaki Ueda
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Publication number: 20180194105Abstract: A transparent electrode-equipped substrate includes a metal oxide transparent electrode layer on a transparent substrate. The average maximum curvature Ssc of the surface of the transparent electrode layer is preferably 5.4×10?4 nm?1 or less. For example, if the transparent electrode layer is subjected to a surface treatment by low discharge-power sputtering after deposition, the Ssc of the transparent electrode layer can be reduced. This transparent electrode-equipped substrate excels in close adhesion between the transparent electrode layer and a lead-out wiring line disposed on the transparent electrode layer. The transparent electrode layer is obtained by, for example, performing a transparent electrode deposition step of through the application of a first discharge power and then performing a surface treatment step through the application of a second discharge power.Type: ApplicationFiled: March 18, 2016Publication date: July 12, 2018Inventors: Hironori HAYAKAWA, Shinya OMOTO, Takashi KUCHIYAMA
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Publication number: 20180187300Abstract: A substrate with a transparent electrode which includes an amorphous transparent electrode layer on a transparent film substrate. When a bias voltage of 0.1 V is applied to the amorphous transparent electrode layer, the layer has continuous regions where a current value at a voltage-applied surface is 50 nA or more. Each of the continuous regions has an area of 100 nm2 or more and the number of the continuous regions is 50/?m2 or more. In one embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. In another embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. With respect to the substrate with a transparent electrode according to the present invention, the transparent electrode layer may be crystallized in a short period of time.Type: ApplicationFiled: January 25, 2018Publication date: July 5, 2018Inventors: Hironori Hayakawa, Takashi Kuchiyama, Kenji Yamamoto
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Patent number: 9903015Abstract: A substrate with a transparent electrode which includes an amorphous transparent electrode layer on a transparent film substrate. When a bias voltage of 0.1 V is applied to the amorphous transparent electrode layer, the layer has continuous regions where a current value at a voltage-applied surface is 50 nA or more. Each of the continuous regions has an area of 100 nm2 or more and the number of the continuous regions is 50/?m2 or more. In one embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. In another embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. With respect to the substrate with a transparent electrode according to the present invention, the transparent electrode layer may be crystallized in a short period of time.Type: GrantFiled: December 18, 2013Date of Patent: February 27, 2018Assignee: KANEKA CORPORATIONInventors: Hironori Hayakawa, Takashi Kuchiyama, Kenji Yamamoto
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Patent number: 9657386Abstract: A transparent electroconductive film includes a transparent electrode layer on a transparent film substrate. The transparent electrode layer is formed of an amorphous indium tin composite oxide and has a tin oxide content of 3 to 12% by mass and a thickness of 15 to 30 nm. In an analysis range of the transparent electrode layer, a bond energy ESn of tin 3d5/2 and a bond energy EIn of indium 3d5/2 as determined by X-ray photoelectron spectroscopy measurement satisfy the following requirements: a minimum point of a bond energy difference between the bond energies ESn and EIn is present closer to the surface of the transparent electrode layer than a maximum point of the bond energy difference ESn?EIn; and a difference Emax?Emin between the maximum value Emax and the minimum value Emin of the bond energy difference is 0.1 eV or more.Type: GrantFiled: February 3, 2015Date of Patent: May 23, 2017Assignee: KANEKA CORPORATIONInventors: Hironori Hayakawa, Takashi Kuchiyama
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Publication number: 20170081754Abstract: A transparent electroconductive film includes transparent electrode layer on a transparent film substrate. The transparent electrode layer is formed of an amorphous indium tin composite oxide and has a tin oxide content of 3 to 12% by mass and a thickness of 15 to 30 nm. In an analysis range of the transparent electrode layer, a bond energy ESn of tin 3d5/2 and a bond energy EIn of indium 3d5/2 as determined by X-ray photoelectron spectroscopy measurement satisfy the following requirements: a minimum point of a bond energy difference between the bond energies ESn and EIn is present closer to the surface of the transparent electrode layer than a maximum point of the bond energy difference ESn-EIn; and a difference Emax-Emin between the maximum value Emax and the minimum value Emin of the bond energy difference is 0.1 eV or more.Type: ApplicationFiled: February 3, 2015Publication date: March 23, 2017Inventors: Hironori Hayakawa, Takashi Kuchiyama
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Patent number: 9549462Abstract: Provided is a transparent conductive film including a transparent electrode layer composed of a patterned thin metal wire on at least one surface of a transparent film substrate. The line width of the wire is 5 ?m or less. The wire includes a first metal layer and a second metal layer that is in contact with the first metal layer, in this order from a transparent film substrate side. Both of the first and second metal layers contain copper in an amount of 90% by weight or more. The total film thickness of the first and second metal layers is 150 to 1000 nm. The diffraction angle 2? of the (111) plane of the second metal layer is less than 43.400° as measured using a CuK? ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.Type: GrantFiled: March 3, 2014Date of Patent: January 17, 2017Assignee: KANEKA CORPORATIONInventors: Tooru Irie, Takahisa Fujimoto, Takashi Kuchiyama, Hironori Hayakawa, Shinya Omoto, Kenji Yamamoto
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Publication number: 20160351752Abstract: Provided is a substrate with transparent electrode, which is capable of achieving both acceleration of crystallization during a heat treatment and suppression of crystallization under a normal temperature environment. In the substrate with transparent electrode, a transparent electrode thin-film formed of a transparent conductive oxide is formed on a film substrate. An underlayer that contains a metal oxide as a main component is formed between the film substrate and the transparent electrode thin-film. The underlayer and the transparent electrode thin-film are in contact with each other. The transparent electrode thin-film is amorphous, and the base layer is dielectric and crystalline.Type: ApplicationFiled: January 19, 2015Publication date: December 1, 2016Applicant: KANEKA CORPORATIONInventors: Takashi Kuchiyama, Hironori Hayakawa, Hiroaki Ueda, Yuji Motohara, Kenji Yamamoto
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Patent number: 9353968Abstract: A heat source unit of a refrigerating apparatus includes a heat exchanger, a blower, an electrical component, a rectifying member, and a casing. The casing houses the heat exchanger, blower, electrical component, and rectifying member. The casing has a vent that vents air upward. The electrical component controls driving of an actuator, and includes a heat-generating part and a heat sink. The heat sink is installed on the heat-generating part, and has a heat-radiating fin. The rectifying member extends along a vertical direction, and covers the heat-radiating fin, and rectifies flow of air. An air inlet is formed on a lower part, and an air outlet on an upper part of the rectifying member. A first air flow path is formed inside the rectifying member. An air flow generated by the blower passes through the first air flow path. The heat-radiating fin is positioned in the first air flow path.Type: GrantFiled: March 27, 2014Date of Patent: May 31, 2016Assignee: Daikin Industries, Ltd.Inventor: Hironori Hayakawa
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Publication number: 20160044778Abstract: Provided is a transparent conductive film including a transparent electrode layer composed of a patterned thin metal wire on at least one surface of a transparent film substrate. The line width of the wire is 5 ?m or less. The wire includes a first metal layer and a second metal layer that is in contact with the first metal layer, in this order from a transparent film substrate side. Both of the first and second metal layers contain copper in an amount of 90% by weight or more. The total film thickness of the first and second metal layers is 150 to 1000 nm. The diffraction angle 2? of the (111) plane of the second metal layer is less than 43.400° as measured using a CuK? ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.Type: ApplicationFiled: March 3, 2014Publication date: February 11, 2016Inventors: Tooru Irie, Takahisa Fujimoto, Takashi Kuchiyama, Hironori Hayakawa, Shinya Omoto, Kenji Yamamoto
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Publication number: 20150345009Abstract: A substrate with a transparent electrode which includes an amorphous transparent electrode layer on a transparent film substrate. When a bias voltage of 0.1 V is applied to the amorphous transparent electrode layer, the layer has continuous regions where a current value at a voltage-applied surface is 50 nA or more. Each of the continuous regions has an area of 100 nm2 or more and the number of the continuous regions is 50/?m2 or more. In one embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. In another embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. With respect to the substrate with a transparent electrode according to the present invention, the transparent electrode layer may be crystallized in a short period of time.Type: ApplicationFiled: December 18, 2013Publication date: December 3, 2015Inventors: Hironori Hayakawa, Takashi Kuchiyama, Kenji Yamamoto
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Publication number: 20150276279Abstract: A heat source unit of a refrigerating apparatus includes a heat exchanger, a blower, an electronic component controlling driving of an actuator, a casing having a vent, and first and second partitioning plates. The heat exchanger has first, second, third and fourth side face parts. The first partitioning plate is disposed between the first and fourth side face parts. An interior of the casing has a first space surrounded by the first to fourth side face parts and the first partitioning plate, and a second space partitioned from the first space by the first partitioning plate. The second space is divided by the second partitioning plate into a third space and a fourth space situated below the third space and exposed externally from the casing. The electrical component is disposed in the third space. The second partitioning plate has a first ventilation opening communicating between the third and fourth spaces.Type: ApplicationFiled: March 27, 2014Publication date: October 1, 2015Applicant: DAIKIN INDUSTRIES, LTD.Inventor: Hironori HAYAKAWA
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Publication number: 20150276263Abstract: A heat source unit of a refrigerating apparatus includes a heat exchanger, a blower, an electrical component, a rectifying member, and a casing. The casing houses the heat exchanger, blower, electrical component, and rectifying member. The casing has a vent that vents air upward. The electrical component controls driving of an actuator, and includes a heat-generating part and a heat sink. The heat sink is installed on the heat-generating part, and has a heat-radiating fin. The rectifying member extends along a vertical direction, and covers the heat-radiating fin, and rectifies flow of air. An air inlet is formed on a lower part, and an air outlet on an upper part of the rectifying member. A first air flow path is formed inside the rectifying member. An air flow generated by the blower passes through the first air flow path. The heat-radiating fin is positioned in the first air flow path.Type: ApplicationFiled: March 27, 2014Publication date: October 1, 2015Applicant: DAIKIN INDUSTRIES, LTD.Inventor: Hironori HAYAKAWA