Patents by Inventor Hironori Kawamoto
Hironori Kawamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240329065Abstract: Disclosed is a specimen measurement apparatus that includes: a measurement unit configured to measure a specimen by using a reagent; a reagent container storage portion configured to store a reagent container in which the reagent is stored; a cooling unit configured to cool the reagent container storage portion; and a holder slidably mounted to the reagent container storage portion in a state where the holder holds the cooling unit.Type: ApplicationFiled: March 25, 2024Publication date: October 3, 2024Applicant: SYSMEX CORPORATIONInventors: Yutaka KAWAMOTO, Hironori KATSUMI
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Patent number: 11820858Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.Type: GrantFiled: November 28, 2018Date of Patent: November 21, 2023Assignee: TEIJIN LIMITEDInventors: Akimichi Oda, Hiroaki Kuwahara, Hironori Kawamoto
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Publication number: 20230331906Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.Type: ApplicationFiled: June 16, 2023Publication date: October 19, 2023Applicant: TEIJIN LIMITEDInventors: Akimichi ODA, Hiroaki KUWAHARA, Hironori KAWAMOTO
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Patent number: 11746445Abstract: An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2): Lc/d?3??(1) TS×d×Lc>6.0×105??(2) wherein: Lc is an X-ray crystallite size (?), d is a filament diameter (?m), and TS is a strand tensile strength (MPa).Type: GrantFiled: September 13, 2022Date of Patent: September 5, 2023Assignees: TEIJIN LIMITED, Teijin Carbon Europe GmbHInventors: Shuhei Yoshida, Hidekazu Yoshikawa, Yosuke Nakamura, Hironori Kawamoto, Takaya Suzuki, Toru Kaneko
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Publication number: 20230087160Abstract: A manufacturing method and a manufacturing apparatus have high yields. The manufacturing method is a method for manufacturing a carbon fiber electrode substrate (3a) by feeding an oxidized fiber substrate (1a) through a carbonization furnace (102, 103) to carbonize the oxidized fiber substrate (1a). The method includes feeding, through the carbonization furnace (102, 103), a plurality of oxidized fiber substrates (1a) arranged in a thickness direction of the oxidized fiber substrates (1a).Type: ApplicationFiled: March 2, 2021Publication date: March 23, 2023Applicant: TEIJIN LIMITEDInventor: Hironori KAWAMOTO
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Patent number: 11560646Abstract: An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2): Lc/d?3??(1) TS×d×Lc>6.0×105??(2) wherein: Lc is an X-ray crystallite size (?), d is a filament diameter (?m), and TS is a strand tensile strength (MPa).Type: GrantFiled: November 22, 2018Date of Patent: January 24, 2023Assignees: TEIJIN LIMITED, Teijin Carbon Europe GmbHInventors: Shuhei Yoshida, Hidekazu Yoshikawa, Yosuke Nakamura, Hironori Kawamoto, Takaya Suzuki, Toru Kaneko
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Publication number: 20230017814Abstract: An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2): Lc/d?3??(1) TS×d×Lc>6.0×105??(2) wherein: Lc is an X-ray crystallite size (?), d is a filament diameter (?m), and TS is a strand tensile strength (MPa).Type: ApplicationFiled: September 13, 2022Publication date: January 19, 2023Applicants: Teijin Limited, Teijin Carbon Europe GmbHInventors: Shuhei YOSHIDA, Hidekazu Yoshikawa, Yosuke Nakamura, Hironori Kawamoto, Takaya Suzuki, Toru Kaneko
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Publication number: 20200407548Abstract: The present invention provides an epoxy resin composition including tetraglycidyl-3,4?-diaminodiphenyl ether, and a curing agent composed of an aromatic polyamine having a predetermined substituent in at least one ortho position with respect to an amino group, a predetermined aromatic epoxy resin having a glycidyl ether group, or an epoxy resin having a predetermined epoxy equivalent weight.Type: ApplicationFiled: March 14, 2019Publication date: December 31, 2020Applicant: TEIJIN LIMITEDInventors: Suguru OZAWA, Hironori KAWAMOTO, Takaya SUZUKI, Hiroaki KUWAHARA, Toru KANEKO
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Publication number: 20200385891Abstract: An object of the present invention is to provide a carbon fiber which exhibits excellent strength development rate when used in a composite material. The present invention that solves the problems is a carbon fiber which simultaneously satisfies the following formulae (1) and (2): Lc/d?3??(1) TS×d×Lc>6.0×105??(2) wherein: Lc is an X-ray crystallite size (?), d is a filament diameter (?m), and TS is a strand tensile strength (MPa).Type: ApplicationFiled: November 22, 2018Publication date: December 10, 2020Applicants: TEIJIN LIMITED, TEIJIN CARBON EUROPE GMBHInventors: Shuhei YOSHIDA, Hidekazu YOSHIKAWA, Yosuke NAKAMURA, Hironori KAWAMOTO, Takaya SUZUKI, Toru KANEKO
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Publication number: 20200291198Abstract: According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.Type: ApplicationFiled: November 28, 2018Publication date: September 17, 2020Applicant: TEIJIN LIMITEDInventors: Akimichi ODA, Hiroaki KUWAHARA, Hironori KAWAMOTO
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Patent number: 10544274Abstract: A prepreg includes conductive fibers impregnated with a matrix resin, the prepreg having a conductive region where a conductive material is dispersed in the resin. In the present invention, a resin layer composed of at least the matrix resin preferably is present on one or both surfaces of a conductive fiber layer composed of at least the conductive fibers, and the conductive region is present at least in the resin layer. In addition, the above-described conductive region preferably is present continuously in the thickness direction. The conductive region preferably is a conductive region where the conductive material is dispersed in the matrix resin, and the resin in the conductive region preferably forms a continuous phase with the matrix resin in other regions. A volume resistivity of the conductive region preferably is 1/1,000 or less of that of other regions of the matrix resin.Type: GrantFiled: July 24, 2015Date of Patent: January 28, 2020Assignee: Toho Tenax Co., Ltd.Inventors: Kazuma Kurokawa, Hironori Kawamoto, Yoshitaka Umemoto, Akio Nakaishi
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Publication number: 20180208729Abstract: A prepreg includes conductive fibers impregnated with a matrix resin, the prepreg having a conductive region where a conductive material is dispersed in the resin. In the present invention, a resin layer composed of at least the matrix resin preferably is present on one or both surfaces of a conductive fiber layer composed of at least the conductive fibers, and the conductive region is present at least in the resin layer. In addition, the above-described conductive region preferably is present continuously in the thickness direction. The conductive region preferably is a conductive region where the conductive material is dispersed in the matrix resin, and the resin in the conductive region preferably forms a continuous phase with the matrix resin in other regions. A volume resistivity of the conductive region preferably is 1/1,000 or less of that of other regions of the matrix resin.Type: ApplicationFiled: July 24, 2015Publication date: July 26, 2018Applicant: Toho Tenax Co., Ltd.Inventors: Kazuma KUROKAWA, Hironori KAWAMOTO, Yoshitaka UMEMOTO, Akio NAKAISHI
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Publication number: 20110218272Abstract: Provided are a thermosetting resin composition suitable for forming a composite material that has excellent mechanical characteristics, such as wet heat resistance and toughness, and also a prepreg using the same. The thermosetting resin composition includes at least a component [A] including thermoplastic resin particles and a thermosetting resin [B]. The component [A] includes a melt blend of at least the components [A-1] and [A-2] given below. In the particles, the component [A-1] and the component [A-2] may be in a non-compatibilized state or a compatibilized state.Type: ApplicationFiled: November 7, 2009Publication date: September 8, 2011Applicant: TOHO TENAX CO., LTD.Inventors: Hiroshi Numata, Hironori Kawamoto
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Publication number: 20110111663Abstract: Disclosed is an epoxy resin composition comprising at least component [A]: a glycidyl-amino-group-containing polyfunctional epoxy resin, component [B]: an epoxy resin other than the component [A], component [C]: a polyisocyanate compound, component [D]: an aromatic-amine-based curing agent, and component [E]: a thermoplastic resin, characterized in that the epoxy resin composition has an epoxy group concentration of 0.67 to 1.51 Eq/kg of the total amount of the components [A] to [D], and preferably that the component [E] is in a proportion of 10 to 50% by weight of the total epoxy resin composition. Use of a prepreg having the resin composition as a matrix resin makes it possible to obtain a composite material with excellent heat resistance and wet heat resistance together with high mechanical properties.Type: ApplicationFiled: June 6, 2009Publication date: May 12, 2011Applicant: TOHO TENAX CO., LTDInventors: Hironori Kawamoto, Toyoaki Ishiwata
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Publication number: 20100133344Abstract: A bar code scanner module is disclosed that may include a chassis housing an optical transmission system therein, the optical transmission system including a laser diode and a motor; a first circuit board coupled to the motor; and a second circuit board disposed within the chassis and in communication with the first circuit board. The module may further include a third circuit board disposed in proximity to the chassis and in communication with at least one of the first circuit board and the second circuit board.Type: ApplicationFiled: November 9, 2006Publication date: June 3, 2010Applicant: Optoelectronics Co., Ltd.Inventors: Masayoshi Yamanouchi, Hironori Kawamoto, Toshiyki Toyama
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Patent number: 7549587Abstract: A method and system for scanning objects using a scan engine having two modes are described. Under a first mode, the scan engine generates modulated pulses for determining the existence of objects containing symbols such as barcode and a scanning mirror is kept stationary. When it is determined that a triggering event should occur or the symbols exit, the scan engine is switched to a second mode in which light is continuously generated by a light source and used with the scanning mirror oscillating for standard scanning.Type: GrantFiled: November 9, 2005Date of Patent: June 23, 2009Assignee: Optoelectronics Co., Ltd.Inventor: Hironori Kawamoto
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Publication number: 20070102524Abstract: A method and system for scanning objects using a scan engine having two modes are described. Under a first mode, the scan engine generates modulated pulses for determining the existence of objects containing symbols such as barcode and a scanning mirror is kept stationary. When it is determined that a triggering event should occur or the symbols exit, the scan engine is switched to a second mode in which light is continuously generated by a light source and used with the scanning mirror oscillating for standard scanning.Type: ApplicationFiled: November 9, 2005Publication date: May 10, 2007Inventor: Hironori Kawamoto