Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: A method for producing a foamed molded product includes: using a molding apparatus including a plasticizing cylinder having a high pressure kneading zone and a pressure reduction zone; and a screw; controlling a pressure of the pressure reduction zone to be a first pressure in a state that communication between the high pressure kneading zone and the pressure reduction zone is shut off, the first pressure being not less than an atmospheric pressure and not more than a maximum pressure of the high pressure kneading zone which is reached in a case that a molten resin is brought in contact and kneaded with a physical foaming agent; controlling back pressure of the screw to be a second pressure which is not less than the first pressure; and measuring a predetermined amount of the molten resin from which the gasified physical foaming agent has been separated.

Abstract: A kneading apparatus for a thermoplastic resin, includes: a plasticizing cylinder which has a high pressure kneading zone and a pressure reduction zone; a screw in the plasticizing cylinder; a downstream side seal mechanism which shuts off communication between the high pressure kneading zone and the pressure reduction zone; and a pressure reduction zone pressure adjusting mechanism which is connected to the pressure reduction zone and which controls a pressure of the pressure reduction zone so that the pressure is not less than an atmospheric pressure and the pressure is not more than a maximum pressure of the high pressure kneading zone that is achieved when kneading a molten resin with a pressurized fluid, when the downstream side seal mechanism shuts off the communication between the high pressure kneading zone and the pressure reduction zone.

Abstract: There is provided a method for producing a molded product of which surface is modified by a functional material using a molding machine such as a general-purpose injection molding machine or extrusion molding machine. The method for producing the molded product includes: mixing a block copolymer having a hydrophilic segment with the functional material; mixing the block copolymer, which has been mixed with the functional material, with a thermoplastic resin; and molding the thermoplastic resin in which the functional material and the block copolymer are mixed.

Abstract: A kneading apparatus for a thermoplastic resin, includes: a plasticizing cylinder which has a high pressure kneading zone and a pressure reduction zone; a screw in the plasticizing cylinder; a downstream side seal mechanism which shuts off communication between the high pressure kneading zone and the pressure reduction zone; and a pressure reduction zone pressure adjusting mechanism which is connected to the pressure reduction zone and which controls a pressure of the pressure reduction zone so that the pressure is not less than an atmospheric pressure and the pressure is not more than a maximum pressure of the high pressure kneading zone that is achieved when kneading a molten resin with a pressurized fluid, when the downstream side seal mechanism shuts off the communication between the high pressure kneading zone and the pressure reduction zone.

Abstract: A method for producing a foamed molded product includes: using a molding apparatus including a plasticizing cylinder having a high pressure kneading zone and a pressure reduction zone; and a screw; controlling a pressure of the pressure reduction zone to be a first pressure in a state that communication between the high pressure kneading zone and the pressure reduction zone is shut off, the first pressure being not less than an atmospheric pressure and not more than a maximum pressure of the high pressure kneading zone which is reached in a case that a molten resin is brought in contact and kneaded with a physical foaming agent; controlling back pressure of the screw to be a second pressure which is not less than the first pressure; and measuring a predetermined amount of the molten resin from which the gasified physical foaming agent has been separated.

Abstract: A kneading apparatus for a thermoplastic resin, includes: a plasticizing cylinder which has a high pressure kneading zone and a pressure reduction zone; a screw in the plasticizing cylinder; a downstream side seal mechanism which shuts off communication between the high pressure kneading zone and the pressure reduction zone; and a pressure reduction zone pressure adjusting mechanism which is connected to the pressure reduction zone and which controls a pressure of the pressure reduction zone so that the pressure is not less than an atmospheric pressure and the pressure is not more than a maximum pressure of the high pressure kneading zone that is achieved when kneading a molten resin with a pressurized fluid, when the downstream side seal mechanism shuts off the communication between the high pressure kneading zone and the pressure reduction zone.

Abstract: A kneading apparatus for a thermoplastic resin, includes: a plasticizing cylinder which has a high pressure kneading zone and a pressure reduction zone; a screw in the plasticizing cylinder; a downstream side seal mechanism which shuts off communication between the high pressure kneading zone and the pressure reduction zone; and a pressure reduction zone pressure adjusting mechanism which is connected to the pressure reduction zone and which controls a pressure of the pressure reduction zone so that the pressure is not less than an atmospheric pressure and the pressure is not more than a maximum pressure of the high pressure kneading zone that is achieved when kneading a molten resin with a pressurized fluid, when the downstream side seal mechanism shuts off the communication between the high pressure kneading zone and the pressure reduction zone.

Abstract: A kneading apparatus for a thermoplastic resin, includes: a plasticizing cylinder which has a high pressure kneading zone and a pressure reduction zone; a screw in the plasticizing cylinder; a downstream side seal mechanism which shuts off communication between the high pressure kneading zone and the pressure reduction zone; and a pressure reduction zone pressure adjusting mechanism which is connected to the pressure reduction zone and which controls a pressure of the pressure reduction zone so that the pressure is not less than an atmospheric pressure and the pressure is not more than a maximum pressure of the high pressure kneading zone that is achieved when kneading a molten resin with a pressurized fluid, when the downstream side seal mechanism shuts off the communication between the high pressure kneading zone and the pressure reduction zone.

Abstract: There is provided a method for producing a molded product of which surface is modified by a functional material using a molding machine such as a general-purpose injection molding machine or extrusion molding machine. The method for producing the molded product includes: mixing a block copolymer having a hydrophilic segment with the functional material; mixing the block copolymer, which has been mixed with the functional material, with a thermoplastic resin; and molding the thermoplastic resin in which the functional material and the block copolymer are mixed.

Abstract: A kneading apparatus for a thermoplastic resin, includes: a plasticizing cylinder which has a high pressure kneading zone and a pressure reduction zone; a screw in the plasticizing cylinder; a downstream side seal mechanism which shuts off communication between the high pressure kneading zone and the pressure reduction zone; and a pressure reduction zone pressure adjusting mechanism which is connected to the pressure reduction zone and which controls a pressure of the pressure reduction zone so that the pressure is not less than an atmospheric pressure and the pressure is not more than a maximum pressure of the high pressure kneading zone that is achieved when kneading a molten resin with a pressurized fluid, when the downstream side seal mechanism shuts off the communication between the high pressure kneading zone and the pressure reduction zone.

Abstract: The present invention provides a method for allowing a metal complex to stably penetrate into a polymer and immobilizing the metal complex in the polymer by a low temperature treatment, in a batch processing for a plating pre-treatment wherein the metal complex is allowed to penetrate into the polymer with the use of high-pressure carbon dioxide. In particular, the present invention provides a method for producing a composite material containing a resin molded product, characterized in that a reducing agent is brought into contact with the resin molded product so as to allow the reducing agent to penetrate into the resin molded product, and in that high-pressure carbon dioxide having an organic metal complex dissolved therein is brought into contact with the resin molded product into which said reducing agent has penetrated, so as to immobilize the organic metal complex in the resin molded product by the reducing agent.

Abstract: To provide a method for producing a polymer member having a plated film with excellent adhesion by subjecting a polymer member in which a catalyst component is dispersed by using pressurized carbon dioxide to electroless plating under ordinary pressure. A polymer member in which a catalyst component is dispersed is formed by using a pressurized fluid in which a catalyst component containing a metal which serves as a plating catalyst is dissolved in pressurized carbon dioxide; the polymer member in which the catalyst component is dispersed is immersed in an alcohol treatment liquid under ordinary pressure; and the polymer member, which has been subjected to the pretreatment with the alcohol treatment liquid, is immersed in an electroless plating solution containing an alcohol under ordinary pressure to form a plated film.

Abstract: A semiconductor chip housing tray that is used in a state of being stacked in a plurality of stages and houses a plurality of semiconductor chips, includes: a base plate; a plurality of upper surface protruding parts provided to an upper surface of the base plate and dividing the upper surface of the base plate into a plurality of first semiconductor chip housing areas; and a plurality of under surface protruding parts provided to an under surface of the base plate and dividing the under surface of the base plate into a plurality of second semiconductor chip housing areas. In the semiconductor chip housing tray, a margin width of the first semiconductor chip housing areas with respect to the semiconductor chips is smaller than a margin width of the second semiconductor chip housing areas with respect to the semiconductor chips.

Abstract: An information recording method allows optical information having a recording mark length smaller than a spot diameter of laser light to be recorded on an optical recording medium having a recording layer, at high density by laser light pulse application. The information recording method has: a power calibration step of determining a recording power for recording a signal having a predetermined signal length in the recording layer using the laser light; and a complementing step of complementing, based on the recording power determined in the power calibration step, a recording power for recording a signal having a signal length equal to or less than ½ of the spot diameter of the laser light in the recording layer using the laser light. In the information recording method, for example, an extremely small mark, such as a 2T signal, can be precisely formed.

Abstract: A semiconductor chip housing tray that is used in a state of being stacked in a plurality of stages and houses a plurality of semiconductor chips, includes: a base plate; a plurality of upper surface protruding parts provided to an upper surface of the base plate and dividing the upper surface of the base plate into a plurality of first semiconductor chip housing areas; and a plurality of under surface protruding parts provided to an under surface of the base plate and dividing the under surface of the base plate into a plurality of second semiconductor chip housing areas. In the semiconductor chip housing tray, a margin width of the first semiconductor chip housing areas with respect to the semiconductor chips is smaller than a margin width of the second semiconductor chip housing areas with respect to the semiconductor chips.

Abstract: An optical recording medium having two information sections (L0 and L1 layers) is provided by holding relationships: R1?R3+r R2?R4?r wherein R1, R2, R3, and R4 represent distances from the center of the medium at radial positions: R of an innermost circumferential track of a test area disposed on an inner circumferential side of the L1 layer; R of an outermost circumferential track of a test area disposed on an outer circumferential side of the L1 layer; R of an innermost circumferential guide groove of an information-recording area of the L0 layer; and R of an outermost circumferential guide groove of the information-recording area of the L0 layer respectively, and r represents a radius of a light beam on the L0 layer when the light beam is collected on the L1 layer.