Patents by Inventor Hironori Shimada
Hironori Shimada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240103200Abstract: A photochromic composition contains, in a predetermined combination: one or more photochromic compounds represented by General Formula 1; and one or more selected from the group consisting of a photochromic compound represented by General Formula A, a photochromic compound represented by General Formula B, and a photochromic compound represented by General Formula C.Type: ApplicationFiled: December 24, 2021Publication date: March 28, 2024Applicant: HOYA LENS THAILAND LTD.Inventors: Hironori KAWAKAMI, Kei KOBAYASHI, Aoi MATSUE, Takuya SHIMADA, Teruo YAMASHITA
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Patent number: 11935762Abstract: There is provided a technique that includes: a first processing module including a first process container in which at least one substrate is processed, a first utility system including a first supply system which supplies a first processing gas into the first process container and a surface of the first utility system is connected or arranged close to the first processing module; and a first vacuum pump arranged at the same level as a first exhaust port of the first process container. The first vacuum pump exhausts an inside of the first process container and includes a first intake port formed laterally at a position substantially facing the first exhaust port of the first process container. A first exhaust pipe configured to substantially linearly bring the first exhaust port into fluid communication with the first intake port and including a first valve installed in a flow path.Type: GrantFiled: August 16, 2022Date of Patent: March 19, 2024Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Daigi Kamimura, Tomoshi Taniyama, Kenji Shirako, Hironori Shimada, Akira Horii, Takayuki Nakada, Norihiro Yamashima
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Publication number: 20230332290Abstract: According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including a nozzle arranged along an inner wall surface of a process vessel and provided at least in a lower portion of the process vessel with a gap between the nozzle and the inner wall surface of the process vessel; a nozzle base supporting the nozzle and accommodating therein a flow path communicating with the nozzle; a support structure provided along the inner wall surface and joined to a first joint surface of the nozzle base that does not face the inner wall surface; and a tilt-adjusting structure for adjusting a tilt of the nozzle base at a position shifted toward a center of the process vessel and away from a center of gravity of a nozzle assembly comprising the nozzle and the nozzle base.Type: ApplicationFiled: June 19, 2023Publication date: October 19, 2023Applicant: Kokusai Electric CorporationInventors: Hironori SHIMADA, Mitsuro TANABE, Toru KAGAYA, Sadao HISAKADO, Hidekazu KANASUGI
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Publication number: 20230116953Abstract: According to the present disclosure, there is provided a technique capable of improving a strength of a substrate retainer. According to one aspect of the technique of the present disclosure, there is provided a substrate retainer including: annular structures arranged at predetermined intervals; support columns configured to support the annular structures and provided along outer edges of the plurality of annular structures, wherein a width of each of the support columns is smaller than a width of each of the annular structures; support structures extending from the support columns toward a radially inward direction and configured to support a substrate between two adjacent annular structures; and connecting structures welded to at least one of the support columns and to the annular structures so as to connect the at least one of the support columns with the annular structures.Type: ApplicationFiled: December 20, 2022Publication date: April 20, 2023Applicant: Kokusai Electric CorporationInventors: Atsushi HIRANO, Hironori Shimada
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Publication number: 20230112057Abstract: Described herein is a technique capable of suppressing a deviation in a thickness of a film formed on a substrate. According to one aspect of the technique of the present disclosure, a substrate processing apparatus includes a substrate retainer capable of supporting substrates; a cylindrical process chamber including a discharge part and supply holes; partition parts arranged in the circumferential direction to partition supply chambers communicating with the process chamber through the supply holes; nozzles provided with an ejection hole; and gas supply pipes. The supply chambers includes a first nozzle chamber and a second nozzle chamber, the process gas includes a source gas and an assist gas, the nozzles includes a first nozzle for the assist gas flows and a second nozzle disposed in the second nozzle chamber and through which the source gas flows, and the first nozzle is disposed adjacent to the second nozzle.Type: ApplicationFiled: December 15, 2022Publication date: April 13, 2023Inventors: Hironori SHIMADA, Daigi KAMIMURA
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Patent number: 11555246Abstract: Described herein is a technique capable of suppressing a deviation in a thickness of a film formed on a substrate. According to one aspect of the technique of the present disclosure, a substrate processing apparatus includes a substrate retainer capable of supporting substrates; a cylindrical process chamber including a discharge part and supply holes; partition parts arranged in the circumferential direction to partition supply chambers communicating with the process chamber through the supply holes; nozzles provided with an ejection hole; and gas supply pipes. The supply chambers includes a first nozzle chamber and a second nozzle chamber, the process gas includes a source gas and an assist gas, the nozzles includes a first nozzle for the assist gas flows and a second nozzle disposed in the second nozzle chamber and through which the source gas flows, and the first nozzle is disposed adjacent to the second nozzle.Type: GrantFiled: April 30, 2021Date of Patent: January 17, 2023Assignee: Kokusai Electric CorporationInventors: Hironori Shimada, Daigi Kamimura
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Publication number: 20220392783Abstract: There is provided a technique that includes: a first processing module including a first process container in which at least one substrate is processed, a first utility system including a first supply system which supplies a first processing gas into the first process container and a surface of the first utility system is connected or arranged close to the first processing module; and a first vacuum pump arranged at the same level as a first exhaust port of the first process container. The first vacuum pump exhausts an inside of the first process container and includes a first intake port formed laterally at a position substantially facing the first exhaust port of the first process container. A first exhaust pipe configured to substantially linearly bring the first exhaust port into fluid communication with the first intake port and including a first valve installed in a flow path.Type: ApplicationFiled: August 16, 2022Publication date: December 8, 2022Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Daigi KAMIMURA, Tomoshi TANIYAMA, Kenji SHIRAKO, Hironori SHIMADA, Akira HORII, Takayuki NAKADA, Norihiro YAMASHIMA
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Publication number: 20220310420Abstract: A cooling method is a method of cooling a processed substrate in a state of being held by a substrate holder, the method including: a first cooling step of cooling the substrate by supplying a gas toward the substrate holder disposed at a reference position; a stopping step of stopping supply of the gas; and a second cooling step of cooling the processed substrate held in a lower portion of the substrate holder.Type: ApplicationFiled: March 24, 2022Publication date: September 29, 2022Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Hironori SHIMADA, Daiki KAMIMURA, Tomoshi TANIYAMA, Tomoki MATSUNAGA, Yasunori EJIRI, Masakazu SAKATA, Mamoru Ohishi
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Patent number: 11450536Abstract: There is provided a technique that includes: a first processing module including a first process container in which at least one substrate is processed and a substrate loading port installed at a front side of the first processing module; a first utility system including a first supply system configured to supply a first processing gas into the first process container, a surface of the first utility system is connected or arranged close to a rear surface of the first processing module; and a first vacuum-exhauster arranged behind the first processing module and configured to exhaust an inside of the first process container, wherein the first vacuum-exhauster includes an outer side surface configured such that the outer side surface does not protrude more outward than an outer side surface of the first utility system.Type: GrantFiled: March 25, 2021Date of Patent: September 20, 2022Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Daigi Kamimura, Tomoshi Taniyama, Kenji Shirako, Hironori Shimada, Akira Horii, Takayuki Nakada, Norihiro Yamashima
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Publication number: 20220108900Abstract: There is provided a technique capable of shortening a temperature stabilization time in a process chamber by improving a heat insulation performance of a lower portion of the process chamber. A heat insulation structure is arranged in a vicinity of a furnace opening of a heat treatment furnace wherein a temperature gradient is formed at the vicinity of the furnace opening. The heat insulation structure includes a plurality of heat insulation plates with predetermined gaps therebetween. Each heat insulation plate includes a heat shield made of metal; and a seal made of quartz or ceramics and configured to cover a front surface and a rear surface of the heat shield. The heat shield is arranged in a vacuum cavity provided in the seal.Type: ApplicationFiled: December 16, 2021Publication date: April 7, 2022Inventors: Hironori SHIMADA, Tomoshi TANIYAMA
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Publication number: 20210305067Abstract: There is provided a technique that includes: a first processing module including a first process container in which at least one substrate is processed and a substrate loading port installed at a front side of the first processing module; a first utility system including a first supply system configured to supply a first processing gas into the first process container, a surface of the first utility system is connected or arranged close to a rear surface of the first processing module; and a first vacuum-exhauster arranged behind the first processing module and configured to exhaust an inside of the first process container, wherein the first vacuum-exhauster includes an outer side surface configured such that the outer side surface does not protrude more outward than an outer side surface of the first utility system.Type: ApplicationFiled: March 25, 2021Publication date: September 30, 2021Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Daigi KAMIMURA, Tomoshi TANIYAMA, Kenji SHIRAKO, Hironori SHIMADA, Akira HORII, Takayuki NAKADA, Norihiro YAMASHIMA
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Publication number: 20210246554Abstract: Described herein is a technique capable of suppressing a deviation in a thickness of a film formed on a substrate. According to one aspect of the technique of the present disclosure, a substrate processing apparatus includes a substrate retainer capable of supporting substrates; a cylindrical process chamber including a discharge part and supply holes; partition parts arranged in the circumferential direction to partition supply chambers communicating with the process chamber through the supply holes; nozzles provided with an ejection hole; and gas supply pipes. The supply chambers includes a first nozzle chamber and a second nozzle chamber, the process gas includes a source gas and an assist gas, the nozzles includes a first nozzle for the assist gas flows and a second nozzle disposed in the second nozzle chamber and through which the source gas flows, and the first nozzle is disposed adjacent to the second nozzle.Type: ApplicationFiled: April 30, 2021Publication date: August 12, 2021Inventors: Hironori SHIMADA, Daigi KAMIMURA
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Publication number: 20210207265Abstract: According to one aspect of the technique, there is provided a substrate processing apparatus including: a substrate retainer supporting substrates; a reaction tube accommodating the substrate retainer, including: a ceiling closing an upper end thereof; and an opening provided at a lower end thereof; a heater provided around the reaction tube and heating an inside of the reaction tube; a gas supplier supplying a process gas to the substrates; a gas discharger communicating with the inside of the reaction tube and exhausting an inner atmosphere of the reaction tube; and a break filter provided in middle of a gas flow path from the gas supplier to the gas discharger in the reaction tube, disposed more downstream than the substrates along the gas flow path and configured to receive heat from an exhaust gas, wherein an inert gas is supplied into the reaction tube through the break filter.Type: ApplicationFiled: March 18, 2021Publication date: July 8, 2021Inventors: Hironori SHIMADA, Tomoshi TANIYAMA
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Patent number: 11015248Abstract: Described herein is a technique capable of suppressing a deviation in a thickness of a film formed on a substrate. According to one aspect of the technique of the present disclosure, a substrate processing apparatus includes a substrate retainer capable of supporting substrates; a cylindrical process chamber including a discharge part and supply holes; partition parts arranged in the circumferential direction to partition supply chambers communicating with the process chamber through the supply holes; nozzles provided with an ejection hole; and gas supply pipes. The supply chambers includes a first nozzle chamber and a second nozzle chamber, the process gas includes a source gas and an assist gas, the nozzles includes a first nozzle for the assist gas flows and a second nozzle disposed in the second nozzle chamber and through which the source gas flows, and the first nozzle is disposed adjacent to the second nozzle.Type: GrantFiled: May 24, 2019Date of Patent: May 25, 2021Assignee: Kokusai Electric CorporationInventors: Hironori Shimada, Daigi Kamimura
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Publication number: 20210043485Abstract: There is provided a technique that includes: a substrate holder; a reaction tube accommodating the substrate holder; a furnace body surrounding the reaction tube; a gas supplier including inlets corresponding to substrates held in the reaction tube and supplying gases from the inlets in parallel to surfaces of the substrates; and a gas exhauster including an outlet facing lateral sides of the substrates and exhausting the gases flowing on the surfaces of the substrates, wherein the substrate holder includes: annular members each arranged concentrically with the rotation axis at a predetermined pitch on planes orthogonal to the rotation axis; columns each arranged along a circumscribed circle substantially coinciding with outer circumferences of the annular members, and holding the plurality of annular members; and supports supporting the substrates at positions between two adjacent annular members.Type: ApplicationFiled: August 7, 2020Publication date: February 11, 2021Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Shuhei Saido, Hironori Shimada, Tomoshi Taniyama, Daigi Kamimura, Takafumi Sasaki
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Publication number: 20190360098Abstract: Described herein is a technique capable of suppressing a deviation in a thickness of a film formed on a substrate. According to one aspect of the technique of the present disclosure, a substrate processing apparatus includes a substrate retainer capable of supporting substrates; a cylindrical process chamber including a discharge part and supply holes; partition parts arranged in the circumferential direction to partition supply chambers communicating with the process chamber through the supply holes; nozzles provided with an ejection hole; and gas supply pipes. The supply chambers includes a first nozzle chamber and a second nozzle chamber, the process gas includes a source gas and an assist gas, the nozzles includes a first nozzle for the assist gas flows and a second nozzle disposed in the second nozzle chamber and through which the source gas flows, and the first nozzle is disposed adjacent to the second nozzle.Type: ApplicationFiled: May 24, 2019Publication date: November 28, 2019Inventors: Hironori SHIMADA, Daigi KAMIMURA
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Patent number: 8477385Abstract: An image reading apparatus includes a casing, a light emitting section, a substrate, a support member, and a light guide. The light emitting section includes plural point light sources disposed in a row. The light emitting section is installed to a first face of the substrate. The support member is installed to the casing and supports a second face of the substrate at a projection portion where a position of the light emitting section is projected at the second face of the substrate. The light guide is installed to the casing adjacent to the light emitting section, and guides light from the light emitting section to a read-face.Type: GrantFiled: February 16, 2010Date of Patent: July 2, 2013Assignee: Fuji Xerox Co., Ltd.Inventors: Kaoru Takahashi, Hironori Shimada, Minoru Aoki, Masayuki Saito
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Patent number: D924953Type: GrantFiled: December 4, 2018Date of Patent: July 13, 2021Assignee: KOKUSAI ELECTRIC CORPORATIONInventor: Hironori Shimada
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Patent number: D939459Type: GrantFiled: December 10, 2019Date of Patent: December 28, 2021Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Hironori Shimada, Daigi Kamimura, Tomoshi Taniyama, Shuhei Saido, Takafumi Sasaki
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Patent number: D1017561Type: GrantFiled: September 21, 2021Date of Patent: March 12, 2024Assignee: KOKUSAI ELECTRIC CORPORATIONInventor: Hironori Shimada