Patents by Inventor Hiroo Ogawara

Hiroo Ogawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of polishing semiconductor wafer
    Patent number: 5191738
    Abstract: A method of polishing a semiconductor wafer, wherein the semiconductor wafer bonded to a plate is polished to a desired thickness by pressing the semiconductor wafer against a rotating turntable side, and at the same time, a thickness regulating member, whose surface layer is made of a material slower to polish than the semiconductor wafer, is arranged on the plane of the plate to control the thickness of the semiconductor wafer. The matrix of the thickness regulating member is made of silicon and the surface layer facing said turntable is a silicon oxide film.
    Type: Grant
    Filed: October 25, 1991
    Date of Patent: March 9, 1993
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Yasuaki Nakazato, Hiroo Ogawara