Patents by Inventor Hiroo Sakamoto
Hiroo Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10837997Abstract: A failure prediction device is provided for predicting, using a structure having a high degree of design freedom, failure at a soldered joint due to vibration stress, and a circuit board using the same. The failure prediction device is disposed on a substrate having a mounting component that is fixed thereon through a solder joint. The failure prediction device is provided with a load amplifying portion that includes a pair of support leg portions each having one end to be fixed to the substrate or the mounting component, and a sacrificial fracture portion that is supported by the other ends of the pair of support leg portions, wherein the load amplifying portion transmits, to the sacrificial fracture portion via the pair of support leg portions, vibration that is applied to the substrate.Type: GrantFiled: October 20, 2017Date of Patent: November 17, 2020Assignee: Mitsubishi Electric CorporationInventors: Nobuaki Ando, Hiroo Sakamoto, Daisuke Echizenya
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Publication number: 20200049758Abstract: A failure prediction device is provided for predicting, using a structure having a high degree of design freedom, failure at a soldered joint due to vibration stress, and a circuit board using the same. The failure prediction device is disposed on a substrate having a mounting component that is fixed thereon through a solder joint. The failure prediction device is provided with a load amplifying portion that includes a pair of support leg portions each having one end to be fixed to the substrate or the mounting component, and a sacrificial fracture portion that is supported by the other ends of the pair of support leg portions, wherein the load amplifying portion transmits, to the sacrificial fracture portion via the pair of support leg portions, vibration that is applied to the substrate.Type: ApplicationFiled: October 20, 2017Publication date: February 13, 2020Inventors: Nobuaki ANDO, Hiroo SAKAMOTO, Daisuke ECHIZENYA
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Patent number: 9537443Abstract: To obtain a reinforcing frame capable of securing sufficient reinforcing strength and adhesive strength while suppressing a manufacturing cost by omitting a rim-like frame. A reinforcing frame is adhered to a rear surface, which is a non-light receiving surface of a solar battery panel, and includes a cylindrical portion that has a cylindrical shape along a longitudinal direction of the reinforcing frame and on which an adhesive surface for adhering to the solar battery panel is formed, and protruding portions that protrude from end portions along a longitudinal direction of the adhesive surface and that are substantially parallel to the adhesive surface.Type: GrantFiled: April 22, 2013Date of Patent: January 3, 2017Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Taisuke Sueda, Daisuke Echizenya, Hiroo Sakamoto, Atsushi Michimori
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Patent number: 9166075Abstract: A solar cell includes a silicon substrate, an aluminum electrode that collects electricity from the rear surface of the silicon substrate, and a silver electrode that extracts output from the aluminum electrode. The aluminum electrode includes an opening formed on the rear surface of the silicon substrate. On a side of the opening is formed a notch that recesses parallel to the direction in which principal stress acts in a plane of the silicon substrate. The silver electrode covers at least the opening and the notch of the aluminum electrode.Type: GrantFiled: June 27, 2006Date of Patent: October 20, 2015Assignee: Mitsubishi Electric CorporationInventors: Daisuke Echizenya, Hiroo Sakamoto, Shiro Takada, Hiroaki Morikawa, Hisashi Tominaga
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Publication number: 20150122311Abstract: A solar cell module includes a solar cell panel including a light receiving surface, a rail-like holding member joined to a rear surface on the opposite side of the light receiving surface in the solar cell panel, the holding member reinforcing and holding the solar cell panel, an assisting member fixed to an end in a longitudinal direction of the holding member within the holding member, the assisting member assisting the holding of the solar cell panel by the holding member, and a screw that fixes the assisting member to the holding member. The assisting member has a bent shape bent in a direction opposed to the light receiving surface from a portion erected to the light receiving surface side through an edge of the solar panel from a position on the rear surface side fixed to the holding member by the fixing member.Type: ApplicationFiled: June 20, 2013Publication date: May 7, 2015Applicant: Mitsubishi Electric CorporationInventors: Daisuke Echizenya, Tetsuo Funakura, Atsushi Michimori, Hiroo Sakamoto, Taisuke Sueda, Hirotoshi Yonezawa, Koji Shimasaki
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Publication number: 20150068589Abstract: To obtain a reinforcing frame capable of securing sufficient reinforcing strength and adhesive strength while suppressing a manufacturing cost by omitting a rim-like frame. A reinforcing frame is adhered to a rear surface, which is a non-light receiving surface of a solar battery panel, and includes a cylindrical portion that has a cylindrical shape along a longitudinal direction of the reinforcing frame and on which an adhesive surface for adhering to the solar battery panel is formed, and protruding portions that protrude from end portions along a longitudinal direction of the adhesive surface and that are substantially parallel to the adhesive surface.Type: ApplicationFiled: April 22, 2013Publication date: March 12, 2015Inventors: Taisuke Sueda, Daisuke Echizenya, Hiroo Sakamoto, Atsushi Michimori
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Publication number: 20140014165Abstract: Each of solar battery modules includes a rectangular solar battery panel, and a holding member extending from an inner side of the solar battery panel to opposite short sides thereof in a direction parallel to a long side of the solar battery panel. A mount includes rod-like members, to which a row of short-side groups in which sets of short sides of the solar battery panels adjacent to each other are arranged in a direction along the short sides is fitted via the holding members. The holding members are bonded to a rear surface of the solar battery panel. The long side is equal to or longer than 1.3 meters, and the short side is equal to or longer than 0.9 meter. The solar battery panel includes a glass substrate having a total plate thickness of equal to or smaller than 2.5 millimeters.Type: ApplicationFiled: April 20, 2012Publication date: January 16, 2014Applicant: Mitsubishi Electric CorporationInventors: Daisuke Echizenya, Norihiro Watanabe, Naoki Ito, Atsushi Michimori, Hiroo Sakamoto
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Patent number: 8347564Abstract: A solar cell module includes a plate-shaped solar panel including a plurality of solar cells arranged on same plane; a plate-shaped cell protection member that covers the plural solar cells that are arranged on the same plane; and a surface protection member that is bonded onto a top surface of the cell protection member; an outer frame that supports a circumference of the solar panel; and a brace having rigidity against bending and that supports a center area of a back surface of the solar panel in such a manner that both ends of the brace are joined to each of two opposed positions of the outer frame. An initial tension is provided to the brace.Type: GrantFiled: April 24, 2007Date of Patent: January 8, 2013Assignee: Mitsubishi Electric CorporationInventors: Daisuke Echizenya, Hiroo Sakamoto, Keiichiro Utsunomiya, Hiromichi Aoki
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Publication number: 20120250292Abstract: A display panel unit 150 includes a display panel 20, a circuit board 40, a flexible board 50 and a housing 60. The display panel 20 has a terminal at a peripheral portion thereof for supply of image signal and displays an image. The circuit board 40 is disposed along a side of the display panel 20, the side having the terminal. The flexible board 50 connects the terminal of the display panel 20 and the circuit board 40 and transmits image signal from the circuit board 40 to the display panel 20. The housing 60 holds the circuit board 40 and the display panel 20. The display panel 20 is fixed to the housing 60 at a center portion of the side along which the circuit board 40 is disposed.Type: ApplicationFiled: December 16, 2010Publication date: October 4, 2012Inventors: Atsushi Michimori, Eiji Niikura, Hiroo Sakamoto, Daisuke Katagiri, Tomoyuki Hayashi, Yoshiki Nagaoka
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Publication number: 20120091572Abstract: The semiconductor package includes a package wiring board having an element housing recessed portion on its top surface to house a semiconductor element; multiple side electrodes which are arranged on the outer side surface of the package wiring board and soldered to multiple motherboard electrodes arranged on a motherboard; a semiconductor element fixed onto the bottom surface of the element housing recessed portion; and an element electrode arranged on the bottom of the element housing recessed portion and electrically connected to the semiconductor element and the side electrodes. The package wiring board has a multilayered structure in which woven fabric and a resin adhesive layer are alternately laminated, and the resin adhesive layer is formed of a resin adhesive that contains inorganic filler particles.Type: ApplicationFiled: June 22, 2009Publication date: April 19, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tsuneo Hamaguchi, Ikio Sugiura, Hiroo Sakamoto, Masaki Iwata, Takashi Shirase, Takashi Okamuro
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Publication number: 20100218811Abstract: It is an object of the present invention to provide a solar cell with improved mechanical strength without increasing resistance between the electrodes. The solar cell (10) according to the present invention includes a silicon substrate (3), an aluminum electrode (1) that is a first electrode that collects electricity from the rear surface of the silicon substrate (3), and a silver electrode (2) that is a second electrode that takes out output from the aluminum electrode (1). The aluminum electrode (1) has an opening (1a) formed on rear surface of the silicon substrate (3) and a notch (1b) recesses in parallel to the direction in which principal stress acts from the opening (1a) in a plane of the silicon substrate (3), and the silver electrode (2) is formed to cover at least the opening (1a) and the notch (1b) of the aluminum electrode (1).Type: ApplicationFiled: June 27, 2006Publication date: September 2, 2010Applicant: Mitsubishi Electric CorporationInventors: Daisuke Echizenya, Hiroo Sakamoto, Shiro Takada, Hiroaki Morikawa, Hisashi Tominaga
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Publication number: 20100132761Abstract: A solar cell module includes a plate-shaped solar panel including a plurality of solar cells arranged on same plane; a plate-shaped cell protection member that covers the plural solar cells that are arranged on the same plane; and a surface protection member that is bonded onto a top surface of the cell protection member; an outer frame that supports a circumference of the solar panel; and a brace having rigidity against bending and that supports a center area of a back surface of the solar panel in such a manner that both ends of the brace are joined to each of two opposed positions of the outer frame. An initial tension is provided to the brace.Type: ApplicationFiled: April 24, 2007Publication date: June 3, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Daisuke Echizenya, Hiroo Sakamoto, Keiichiro Utsunomiya, Hiromichi Aoki
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Patent number: 7653098Abstract: A semiconductor laser chip is joined to an AlN sub-mount in a junction-down manner. The sub-mount is joined to a package. The AlN sub-mount is joined to a stem. The direction perpendicular to the irradiation direction of a laser beam emitted from the semiconductor laser chip is the direction of the width of the sub-mount. The thickness and the width of the AlN sub-mount are determined so that the product of the equivalent stress applied to the center of the surface of the semiconductor laser chip joined to the sub-mount and the stress in the direction of the width of the sub-mount does not exceed 70% of the maximum value of the product obtained by changing the thickness and the width of the AlN sub-mount.Type: GrantFiled: July 1, 2008Date of Patent: January 26, 2010Assignee: Mitsubishi Electric CorporationInventors: Tsutomu Yamaguchi, Yoshihisa Tashiro, Kenzo Mori, Hiroo Sakamoto, Takehiro Nishida
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Publication number: 20090135878Abstract: A semiconductor laser chip is joined to an AlN sub-mount in a junction-down manner. The sub-mount is joined to a package. The AlN sub-mount is joined to a stem. The direction perpendicular to the irradiation direction of a laser beam emitted from the semiconductor laser chip is the direction of the width of the sub-mount. The thickness and the width of the AlN sub-mount are determined so that the product of the equivalent stress applied to the center of the surface of the semiconductor laser chip joined to the sub-mount and the stress in the direction of the width of the sub-mount does not exceed 70% of the maximum value of the product obtained by changing the thickness and the width of the AlN sub-mount.Type: ApplicationFiled: July 1, 2008Publication date: May 28, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tsutomu Yamaguchi, Yoshihisa Tashiro, Kenzo Mori, Hiroo Sakamoto, Takehiro Nishida
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Patent number: 6657374Abstract: A cathode ray tube including a portion whose thickness becomes (2.78+0.0038×D)≦t1≦(3.7+0.0038×D)[mm] where D is a diagonal axis length [mm] between rectangular corner portions of an effective screen of a panel, and t1 is a thickness [mm] at positions which occupy 75% of a length of a body portion extending from a sealing surface of the body portion to a yoke portion along a tube axis direction.Type: GrantFiled: June 1, 2000Date of Patent: December 2, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kazushi Nagasawa, Tesshin Yazu, Hideya Ito, Takashi Sugahara, Hiroo Sakamoto, Shiro Takada, Junko Itoh, Masayuki Miyazaki
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Publication number: 20010031448Abstract: A method of technical education comprising an educational process of simulating behaviors of a flying object through a simulation program of flight functions based on basic equations of hydrodynamics, an educational process of designing the flying object and manufacturing the same, an educational process of confirming behaviors of the flying object through experimentation, and an educational process of optimizing the flying object to present targeted functions. Creative activities for obtaining an improved flying object can be performed during an educational process of experiencing effective and proper designing, manufacturing and test flying of a flying object as a teaching material. With this arrangement, the level of comprehension of hydrodynamics can be heightened from a level of passive comprehension to a level with which intellectual productive activities in the sense of creative activities can be achieved. A technical educational system and a flying object are also disclosed.Type: ApplicationFiled: June 19, 2001Publication date: October 18, 2001Applicant: Mitsubishi Denki Kabushiki KaishaInventors: Toshio Itoh, Katsuhisa Ootsuta, Masayuki Miyazaki, Hiroo Sakamoto, Shiro Tatsumi, Yoshikazu Ugai, Masaharu Sawatani
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Patent number: 5735629Abstract: The present invention relates to a band connection fitting which, in order to connect a band, is provided with a connector which is arranged at one end of the band, and which has a spring bar which is provided with press buttons which are pressable from both sides of the band in a crosswise direction; and a receiving member which is arranged on the other end of the band, and which has claws which engage the press buttons when in the normal state, and which release the engagement when the press buttons are pressed inward from both sides of the band in a crosswise direction. The band connection fitting of the present invention operates easily and with certainty, and has high durability.Type: GrantFiled: May 29, 1996Date of Patent: April 7, 1998Assignee: Seiko Kabushiki KaishaInventors: Hiroo Sakamoto, Toshihiro Takahashi