Patents by Inventor Hiroo Sakamoto

Hiroo Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10837997
    Abstract: A failure prediction device is provided for predicting, using a structure having a high degree of design freedom, failure at a soldered joint due to vibration stress, and a circuit board using the same. The failure prediction device is disposed on a substrate having a mounting component that is fixed thereon through a solder joint. The failure prediction device is provided with a load amplifying portion that includes a pair of support leg portions each having one end to be fixed to the substrate or the mounting component, and a sacrificial fracture portion that is supported by the other ends of the pair of support leg portions, wherein the load amplifying portion transmits, to the sacrificial fracture portion via the pair of support leg portions, vibration that is applied to the substrate.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: November 17, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Nobuaki Ando, Hiroo Sakamoto, Daisuke Echizenya
  • Publication number: 20200049758
    Abstract: A failure prediction device is provided for predicting, using a structure having a high degree of design freedom, failure at a soldered joint due to vibration stress, and a circuit board using the same. The failure prediction device is disposed on a substrate having a mounting component that is fixed thereon through a solder joint. The failure prediction device is provided with a load amplifying portion that includes a pair of support leg portions each having one end to be fixed to the substrate or the mounting component, and a sacrificial fracture portion that is supported by the other ends of the pair of support leg portions, wherein the load amplifying portion transmits, to the sacrificial fracture portion via the pair of support leg portions, vibration that is applied to the substrate.
    Type: Application
    Filed: October 20, 2017
    Publication date: February 13, 2020
    Inventors: Nobuaki ANDO, Hiroo SAKAMOTO, Daisuke ECHIZENYA
  • Patent number: 9537443
    Abstract: To obtain a reinforcing frame capable of securing sufficient reinforcing strength and adhesive strength while suppressing a manufacturing cost by omitting a rim-like frame. A reinforcing frame is adhered to a rear surface, which is a non-light receiving surface of a solar battery panel, and includes a cylindrical portion that has a cylindrical shape along a longitudinal direction of the reinforcing frame and on which an adhesive surface for adhering to the solar battery panel is formed, and protruding portions that protrude from end portions along a longitudinal direction of the adhesive surface and that are substantially parallel to the adhesive surface.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: January 3, 2017
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Taisuke Sueda, Daisuke Echizenya, Hiroo Sakamoto, Atsushi Michimori
  • Patent number: 9166075
    Abstract: A solar cell includes a silicon substrate, an aluminum electrode that collects electricity from the rear surface of the silicon substrate, and a silver electrode that extracts output from the aluminum electrode. The aluminum electrode includes an opening formed on the rear surface of the silicon substrate. On a side of the opening is formed a notch that recesses parallel to the direction in which principal stress acts in a plane of the silicon substrate. The silver electrode covers at least the opening and the notch of the aluminum electrode.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: October 20, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Daisuke Echizenya, Hiroo Sakamoto, Shiro Takada, Hiroaki Morikawa, Hisashi Tominaga
  • Publication number: 20150122311
    Abstract: A solar cell module includes a solar cell panel including a light receiving surface, a rail-like holding member joined to a rear surface on the opposite side of the light receiving surface in the solar cell panel, the holding member reinforcing and holding the solar cell panel, an assisting member fixed to an end in a longitudinal direction of the holding member within the holding member, the assisting member assisting the holding of the solar cell panel by the holding member, and a screw that fixes the assisting member to the holding member. The assisting member has a bent shape bent in a direction opposed to the light receiving surface from a portion erected to the light receiving surface side through an edge of the solar panel from a position on the rear surface side fixed to the holding member by the fixing member.
    Type: Application
    Filed: June 20, 2013
    Publication date: May 7, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Daisuke Echizenya, Tetsuo Funakura, Atsushi Michimori, Hiroo Sakamoto, Taisuke Sueda, Hirotoshi Yonezawa, Koji Shimasaki
  • Publication number: 20150068589
    Abstract: To obtain a reinforcing frame capable of securing sufficient reinforcing strength and adhesive strength while suppressing a manufacturing cost by omitting a rim-like frame. A reinforcing frame is adhered to a rear surface, which is a non-light receiving surface of a solar battery panel, and includes a cylindrical portion that has a cylindrical shape along a longitudinal direction of the reinforcing frame and on which an adhesive surface for adhering to the solar battery panel is formed, and protruding portions that protrude from end portions along a longitudinal direction of the adhesive surface and that are substantially parallel to the adhesive surface.
    Type: Application
    Filed: April 22, 2013
    Publication date: March 12, 2015
    Inventors: Taisuke Sueda, Daisuke Echizenya, Hiroo Sakamoto, Atsushi Michimori
  • Publication number: 20140014165
    Abstract: Each of solar battery modules includes a rectangular solar battery panel, and a holding member extending from an inner side of the solar battery panel to opposite short sides thereof in a direction parallel to a long side of the solar battery panel. A mount includes rod-like members, to which a row of short-side groups in which sets of short sides of the solar battery panels adjacent to each other are arranged in a direction along the short sides is fitted via the holding members. The holding members are bonded to a rear surface of the solar battery panel. The long side is equal to or longer than 1.3 meters, and the short side is equal to or longer than 0.9 meter. The solar battery panel includes a glass substrate having a total plate thickness of equal to or smaller than 2.5 millimeters.
    Type: Application
    Filed: April 20, 2012
    Publication date: January 16, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Daisuke Echizenya, Norihiro Watanabe, Naoki Ito, Atsushi Michimori, Hiroo Sakamoto
  • Patent number: 8347564
    Abstract: A solar cell module includes a plate-shaped solar panel including a plurality of solar cells arranged on same plane; a plate-shaped cell protection member that covers the plural solar cells that are arranged on the same plane; and a surface protection member that is bonded onto a top surface of the cell protection member; an outer frame that supports a circumference of the solar panel; and a brace having rigidity against bending and that supports a center area of a back surface of the solar panel in such a manner that both ends of the brace are joined to each of two opposed positions of the outer frame. An initial tension is provided to the brace.
    Type: Grant
    Filed: April 24, 2007
    Date of Patent: January 8, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Daisuke Echizenya, Hiroo Sakamoto, Keiichiro Utsunomiya, Hiromichi Aoki
  • Publication number: 20120250292
    Abstract: A display panel unit 150 includes a display panel 20, a circuit board 40, a flexible board 50 and a housing 60. The display panel 20 has a terminal at a peripheral portion thereof for supply of image signal and displays an image. The circuit board 40 is disposed along a side of the display panel 20, the side having the terminal. The flexible board 50 connects the terminal of the display panel 20 and the circuit board 40 and transmits image signal from the circuit board 40 to the display panel 20. The housing 60 holds the circuit board 40 and the display panel 20. The display panel 20 is fixed to the housing 60 at a center portion of the side along which the circuit board 40 is disposed.
    Type: Application
    Filed: December 16, 2010
    Publication date: October 4, 2012
    Inventors: Atsushi Michimori, Eiji Niikura, Hiroo Sakamoto, Daisuke Katagiri, Tomoyuki Hayashi, Yoshiki Nagaoka
  • Publication number: 20120091572
    Abstract: The semiconductor package includes a package wiring board having an element housing recessed portion on its top surface to house a semiconductor element; multiple side electrodes which are arranged on the outer side surface of the package wiring board and soldered to multiple motherboard electrodes arranged on a motherboard; a semiconductor element fixed onto the bottom surface of the element housing recessed portion; and an element electrode arranged on the bottom of the element housing recessed portion and electrically connected to the semiconductor element and the side electrodes. The package wiring board has a multilayered structure in which woven fabric and a resin adhesive layer are alternately laminated, and the resin adhesive layer is formed of a resin adhesive that contains inorganic filler particles.
    Type: Application
    Filed: June 22, 2009
    Publication date: April 19, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tsuneo Hamaguchi, Ikio Sugiura, Hiroo Sakamoto, Masaki Iwata, Takashi Shirase, Takashi Okamuro
  • Publication number: 20100218811
    Abstract: It is an object of the present invention to provide a solar cell with improved mechanical strength without increasing resistance between the electrodes. The solar cell (10) according to the present invention includes a silicon substrate (3), an aluminum electrode (1) that is a first electrode that collects electricity from the rear surface of the silicon substrate (3), and a silver electrode (2) that is a second electrode that takes out output from the aluminum electrode (1). The aluminum electrode (1) has an opening (1a) formed on rear surface of the silicon substrate (3) and a notch (1b) recesses in parallel to the direction in which principal stress acts from the opening (1a) in a plane of the silicon substrate (3), and the silver electrode (2) is formed to cover at least the opening (1a) and the notch (1b) of the aluminum electrode (1).
    Type: Application
    Filed: June 27, 2006
    Publication date: September 2, 2010
    Applicant: Mitsubishi Electric Corporation
    Inventors: Daisuke Echizenya, Hiroo Sakamoto, Shiro Takada, Hiroaki Morikawa, Hisashi Tominaga
  • Publication number: 20100132761
    Abstract: A solar cell module includes a plate-shaped solar panel including a plurality of solar cells arranged on same plane; a plate-shaped cell protection member that covers the plural solar cells that are arranged on the same plane; and a surface protection member that is bonded onto a top surface of the cell protection member; an outer frame that supports a circumference of the solar panel; and a brace having rigidity against bending and that supports a center area of a back surface of the solar panel in such a manner that both ends of the brace are joined to each of two opposed positions of the outer frame. An initial tension is provided to the brace.
    Type: Application
    Filed: April 24, 2007
    Publication date: June 3, 2010
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Daisuke Echizenya, Hiroo Sakamoto, Keiichiro Utsunomiya, Hiromichi Aoki
  • Patent number: 7653098
    Abstract: A semiconductor laser chip is joined to an AlN sub-mount in a junction-down manner. The sub-mount is joined to a package. The AlN sub-mount is joined to a stem. The direction perpendicular to the irradiation direction of a laser beam emitted from the semiconductor laser chip is the direction of the width of the sub-mount. The thickness and the width of the AlN sub-mount are determined so that the product of the equivalent stress applied to the center of the surface of the semiconductor laser chip joined to the sub-mount and the stress in the direction of the width of the sub-mount does not exceed 70% of the maximum value of the product obtained by changing the thickness and the width of the AlN sub-mount.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: January 26, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tsutomu Yamaguchi, Yoshihisa Tashiro, Kenzo Mori, Hiroo Sakamoto, Takehiro Nishida
  • Publication number: 20090135878
    Abstract: A semiconductor laser chip is joined to an AlN sub-mount in a junction-down manner. The sub-mount is joined to a package. The AlN sub-mount is joined to a stem. The direction perpendicular to the irradiation direction of a laser beam emitted from the semiconductor laser chip is the direction of the width of the sub-mount. The thickness and the width of the AlN sub-mount are determined so that the product of the equivalent stress applied to the center of the surface of the semiconductor laser chip joined to the sub-mount and the stress in the direction of the width of the sub-mount does not exceed 70% of the maximum value of the product obtained by changing the thickness and the width of the AlN sub-mount.
    Type: Application
    Filed: July 1, 2008
    Publication date: May 28, 2009
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tsutomu Yamaguchi, Yoshihisa Tashiro, Kenzo Mori, Hiroo Sakamoto, Takehiro Nishida
  • Patent number: 6657374
    Abstract: A cathode ray tube including a portion whose thickness becomes (2.78+0.0038×D)≦t1≦(3.7+0.0038×D)[mm] where D is a diagonal axis length [mm] between rectangular corner portions of an effective screen of a panel, and t1 is a thickness [mm] at positions which occupy 75% of a length of a body portion extending from a sealing surface of the body portion to a yoke portion along a tube axis direction.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: December 2, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kazushi Nagasawa, Tesshin Yazu, Hideya Ito, Takashi Sugahara, Hiroo Sakamoto, Shiro Takada, Junko Itoh, Masayuki Miyazaki
  • Publication number: 20010031448
    Abstract: A method of technical education comprising an educational process of simulating behaviors of a flying object through a simulation program of flight functions based on basic equations of hydrodynamics, an educational process of designing the flying object and manufacturing the same, an educational process of confirming behaviors of the flying object through experimentation, and an educational process of optimizing the flying object to present targeted functions. Creative activities for obtaining an improved flying object can be performed during an educational process of experiencing effective and proper designing, manufacturing and test flying of a flying object as a teaching material. With this arrangement, the level of comprehension of hydrodynamics can be heightened from a level of passive comprehension to a level with which intellectual productive activities in the sense of creative activities can be achieved. A technical educational system and a flying object are also disclosed.
    Type: Application
    Filed: June 19, 2001
    Publication date: October 18, 2001
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshio Itoh, Katsuhisa Ootsuta, Masayuki Miyazaki, Hiroo Sakamoto, Shiro Tatsumi, Yoshikazu Ugai, Masaharu Sawatani
  • Patent number: 5735629
    Abstract: The present invention relates to a band connection fitting which, in order to connect a band, is provided with a connector which is arranged at one end of the band, and which has a spring bar which is provided with press buttons which are pressable from both sides of the band in a crosswise direction; and a receiving member which is arranged on the other end of the band, and which has claws which engage the press buttons when in the normal state, and which release the engagement when the press buttons are pressed inward from both sides of the band in a crosswise direction. The band connection fitting of the present invention operates easily and with certainty, and has high durability.
    Type: Grant
    Filed: May 29, 1996
    Date of Patent: April 7, 1998
    Assignee: Seiko Kabushiki Kaisha
    Inventors: Hiroo Sakamoto, Toshihiro Takahashi