Patents by Inventor Hiroshi Arii

Hiroshi Arii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Refrigeration apparatus having input operation modes
    Patent number: 11959677
    Abstract: A refrigeration apparatus includes: a refrigerant circuit through which refrigerant circulates; a controller to execute a plurality of refrigerant shortage sensing functions of sensing a shortage of an amount of the refrigerant; and an input device through which an operation mode to be set is input into the controller. The operation mode includes: a first mode in which energy-saving performance is emphasized; and a second mode in which the refrigeration apparatus is permitted to operate in a range in which reliability is ensured. In accordance with the operation mode set through the input device, the controller determines which one of sensing results obtained by the refrigerant shortage sensing functions is enabled and which one of sensing results obtained by the refrigerant shortage sensing functions is disabled. When a sensing result determined to be enabled shows a refrigerant shortage, the controller gives a notification about the refrigerant shortage.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: April 16, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takanori Yashiro, Hiroshi Sata, Yusuke Arii
  • Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
    Patent number: 4204246
    Abstract: In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.
    Type: Grant
    Filed: May 8, 1978
    Date of Patent: May 20, 1980
    Assignee: Sony Corporation
    Inventors: Hiroshi Arii, Hirohito Kawada, Takashi Yoshida, Chiaki Nonaka
  • Apparatus for cooling electrical components
    Patent number: 4120019
    Abstract: In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.
    Type: Grant
    Filed: February 7, 1977
    Date of Patent: October 10, 1978
    Assignee: Sony Corporation
    Inventors: Hiroshi Arii, Hirohito Kawada, Takashi Yoshida, Chiaki Nonaka