Abstract: In a multilayer ceramic capacitor, A>B is satisfied by an atomic concentration ratio B of Si to Cu in a first organic layer disposed on a first base electrode layer located on a first end surface, an atomic concentration ratio A of Si to Cu in the first organic layer disposed on the first base electrode layer located on a first principal surface and a second principal surface, and an atomic concentration ratio A of Si to Cu in the first organic layer located directly on the first principal surface and the second principal surface.

Abstract: A multilayer ceramic electronic component includes a first organic layer located on both principal surfaces and both side surfaces in contact with a first external electrode, and a second organic layer located on the both principal surfaces and the both side surfaces in contact with a second external electrode. The first organic layer includes an organic silicon compound and covers an end of a first base electrode layer of the first external electrode, and the second organic layer includes an organic silicon compound and covers an end of a second base electrode layer of the second external electrode. A first plating layer of the first external electrode includes an end in contact with the surface of the first organic layer, and a second plating layer of the second external electrode includes an end in contact with the surface of the second organic layer.

Abstract: A multilayer ceramic electronic component includes a first organic layer that covers from a first base electrode layer to at least a portion of a surface of a laminated body, a second organic layer that covers from a second base electrode layer to at least a portion of the surface of the laminated body, a first plating layer that includes a leading end in contact with the first organic layer and that has an atomic concentration ratio of Si to Cu of about 1% or more and about 5% or less between a Cu concentration and an Si concentration at the surface of the first organic layer, and a second plating layer that includes a leading end in contact with the second organic layer and that has an atomic concentration ratio of Si to Cu being about 1% or more and about 5% or less between a Cu concentration and an Si concentration at the surface of the second organic layer.

Abstract: A piezoelectric transformer that includes a piezoelectric body having driving portions and a power generating portion, an input electrode, and an output electrode. The driving portions and the power generating portion are arranged in the lengthwise direction of the piezoelectric body. The driving portions are disposed symmetrically relative to a plane that passes through a center of the piezoelectric body in the lengthwise direction and is orthogonal to the lengthwise direction, occupy no less than half of the regions in the piezoelectric body, and are include two or more adjacent polarized regions.

Abstract: Provided is a polishing composition that is produced at low cost and can impart high-grade mirror finishing to ceramic. The polishing composition includes abrasives, has a pH of 6.0 or more to 9.0 or less, and is used for polishing ceramic.

Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

Abstract: Provided is a composition for polishing a titanium alloy material, which enables polishing of a titanium alloy material at a high polishing speed and can provide a polished titanium alloy material having excellent surface smoothness and having a highly glossy surface after polishing. The composition for polishing a titanium alloy material is a composition that is intended for polishing a titanium alloy material and comprises a compound having a function of dissolving at least one metal element other than titanium, which exists at a content of more than 0.5% by mass with respect to the total mass of the titanium alloy material, at a higher degree of solubility than that of titanium; and abrasive grains.

Abstract: A distributed power supply system includes a controller configured to control a power factor of a power converter device (inverter) such that the power factor has a predetermined constant value if reverse power flow from the power converter device (inverter) to a utility power grid is observed. If the controller determines, based on reverse power flow information acquired by a reverse power flow information acquirer, that reverse power flow from the power converter device (inverter) to the utility power grid is not observed, the controller controls the power factor of the power converter device (inverter) such that the power factor has a value closer to unity than the predetermined constant value is.

Abstract: Provided is a polishing composition containing at least aluminum oxide abrasive grains and water, and having a pH of 8.5 or higher. The aluminum oxide abrasive grains have a specific surface area of 20 m2/g or less. It is preferable for the aluminum oxide abrasive grains to have an average secondary particle size of 0.1 ?m or more and 20 ?m or less. The polishing composition is used for polishing hard and brittle materials having a Vickers hardness of 1,500 Hv or higher, such as sapphire, silicon carbide, and gallium nitride.

Abstract: An auxiliary tunneling apparatus includes a reaction force receiver and first and second split components. In the excavation of a second tunnel by a boring machine, the reaction force receiver forms a replacement face of a side wall of the second tunnel on a first tunnel side where the first and second tunnels intersect each other, and a gripper of the boring machine pushes against the replacement face. The first and second split components are installed to push against the side wall of the first tunnel, support the reaction force receiver within the first tunnel, and move back and forth with respect to the side wall of the first tunnel.

Abstract: Provided is an article having a metal oxide coating employing a novel configuration exhibiting both color and metallic luster. The article having a metal oxide coating disclosed herein is provided with a base material including a metal material and a metal oxide coating including a metal oxide coated onto the surface of the base material. The metal oxide coating is formed by polishing the surface of the base material, using particles composed of the metal oxide.

Abstract: A polishing device includes a polishing member, a tool, and a contact mechanism. The polishing member includes a polishing surface that is shaped in conformance with the shape of an end of a workpiece. The tool functions as a shape-processing cutting tool or a surface modifying tool that has the same shape as the shape of the end. The shape-processing cutting tool processes the polishing surface of the polishing member to be shaped in conformance with the shape of the end. The surface modifying tool modifies the polishing surface to be shaped in conformance with the shape of the portion to be polished. The contact mechanism brings the tool into contact with the polishing surface of the polishing member.

Abstract: A polishing device includes a motor movement mechanism and a second motor that rotates a workpiece. The motor movement mechanism moves the workpiece in a direction tangential to a radially outer circumferential surface of a polishing member and moves the workpiece in a direction orthogonal to a rotational axis of the polishing member.

Abstract: This tunnel excavation method includes a step of excavating three first tunnels that are substantially parallel to each other in a first excavation step. Second tunnels are excavated that intersect the first tunnels in a second excavation step. A boring machine is used that performs excavation in a state in which a gripper pushes against the side wall of the tunnel.

Abstract: [Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.

Abstract: The present invention relates to a polishing method using a polishing tool provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to efficiently and uniformly polish the curved surface of the object. A polishing tool of the present invention is provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object. The polishing pad preferably has a Shore A hardness of 5 or greater. A polishing method of the present invention uses a polishing tool including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object and polish the curved surface of the object.

Abstract: A phosphor emitting DUV light includes particles of halogen-containing magnesium oxide, the particles satisfying 0.16°?FWHM (420)?0.20° wherein FWHM (420) is the full width at half maximum of a (420) diffraction peak present at a diffraction angle 2? equal to or more than 109.0° and equal to or less than 110.0° as measured by powder X-ray diffractometry using CuK? radiation.

Abstract: A polishing method includes a polishing process of polishing a surface to be polished of an object by relatively rotating a holding fixture and a polishing pad with the surface to be polished of the object held on the holding fixture being pressed against and placed in contact with the polishing pad, while supplying a polishing composition onto the polishing pad. During the polishing process, the object held on the holding fixture turns around with the surface to be polished of the object facing the polishing pad to change the orientation of the object.

Abstract: A polishing composition which is able to decrease a difference in polishing rate between the alloy material and the resin, and to polish both the alloy material and the resin at a high polishing rate when polishing a substrate which contains an alloy material and a resin on the surface and has a ratio of the alloy material area to the total polishing area in a specific range is provided. To provide the polishing composition used to polish a substrate which contains an alloy material and a resin on a surface thereof and has a ratio of an alloy material area to a total polishing area of from 60 to 95%, the polishing composition containing crystalline abrasive grains having a cumulative 50% particle size (D50) based on a volume-based particle size distribution of 5.0 ?m or more, an acid or a salt thereof and a water-soluble polymer.

Abstract: A piezoelectric transformer device is disclosed having a decreased thickness. In particular, a piezoelectric transformer device is disclosed that includes a piezoelectric transformer element in which first and second element electrodes are provided on first and second side surfaces of a piezoelectric transformer main body, respectively, and first and second flexible electrode members which are arranged at the lateral sides of the first and second side surfaces of the piezoelectric transformer main body, respectively, and are electrically and mechanically connected to the first and second element electrodes, respectively.