Patents by Inventor Hiroshi Ayukawa

Hiroshi Ayukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7993730
    Abstract: An electro-optical device includes: a display panel module having electronic parts provided therein; and an insulating tape that is adhered to the display panel module so as to cover the electronic parts. The insulating tape includes an adhesive portion and a non-adhesive portion. The non-adhesive portion is disposed at a position that covers a region in which the electronic parts are provided, and the adhesive portion is adhered to the display panel module in regions other than the region in which the electronic parts are provided.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: August 9, 2011
    Assignee: Sony Corporation
    Inventor: Hiroshi Ayukawa
  • Publication number: 20090061166
    Abstract: An electro-optical device includes: a display panel module having electronic parts provided therein; and an insulating tape that is adhered to the display panel module so as to cover the electronic parts. The insulating tape includes an adhesive portion and a non-adhesive portion. The non-adhesive portion is disposed at a position that covers a region in which the electronic parts are provided, and the adhesive portion is adhered to the display panel module in regions other than the region in which the electronic parts are provided.
    Type: Application
    Filed: August 27, 2008
    Publication date: March 5, 2009
    Applicant: Epson Imaging Devices Corporation
    Inventor: Hiroshi Ayukawa
  • Patent number: 6948612
    Abstract: To provide a coating composition of a soluble aromatic polyimide having good heat resistance and mechanical strength. As a soluble polyimide, a compound of the formula (I) in which R's represent independently from one another H, halogen, an alkyl group or an alkoxy group, or a substituted or unsubstituted phenyl group; A is a tetravalent aromatic group or a group of the formula (II) in which B is a covalent bond, a >C(R2)2 group, a carbonyl group, O, S, a >SO2, group, a >Si(CH3)2 group, a >Si(C2H5)2 group, a >NR3 group or a bifunctional ether group in which R2 is a hydrogen atom or —C(R4)3, R3 is H, an alkyl group or an aryl group, and R4 is H, F or Cl; Ar is an aromatic nucleus or a group of the formula (III) in which Ar and B are the same as defined above, and each p is an integer of 0 to 10; m is an integer of 1 to 10 is used. The polyimide has a weight average molecular weight of 150,000 to 1,000,000.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: September 27, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Mitsuaki Kobayashi, Hiroshi Ayukawa
  • Patent number: 6887525
    Abstract: To provide an insulating material that has low dielectric constant and low dielectric loss tangent, and is superior in its processability into thin film. An insulating material for use in high-frequency electronic parts comprising: a matrix component composed at polyimide, and fluorocarbon resin particles uniformly dispersed therein.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: May 3, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Mitsuaki Kobayashi, Hiroshi Ayukawa
  • Publication number: 20040063868
    Abstract: To provide an insulating material that has low dielectric constant and low loss tangent, and is superior in its processability into thin film. An insulating material for use in high-frequency electronic parts comprising: a matrix component composed of polyimide, and fluorocarbon resin particles uniformly dispersed therein.
    Type: Application
    Filed: December 26, 2002
    Publication date: April 1, 2004
    Inventors: Mitsuaki Kobayashi, Hiroshi Ayukawa
  • Publication number: 20040063899
    Abstract: To provide a coating composition of a soluble aromatic polyimide having good heat resistance and mechanical strength. As a soluble polyimide, a compound of the formula (I) in which R's represent independently from one another H, halogen, an alkyl group or an alkoxy group, or a substituted or unsubstituted phenyl group; A is a tetravalent aromatic group or a group of the formula (II) in which B is a covalent bond, a >C(R2)2 group, a carbonyl group, 0, S, a >SO2, group, a >Si (CH3)2 group, a >Si(C2H5)2 group, a >NR3 group or a bifunctional ether group in which R2 is a hydrogen atom or —C(R4)3, R3 is H, an alkyl group or an aryl group, and R4 is H, F or Cl; Ar is an aromatic nucleus or a group of the formula (III) in which Ar and B are the same as defined above, and each p is an integer of 0 to 10; m is an integer of 1 to 10 is used. The polyimide has a weight average molecular weight of 150,000 to 1,000,000.
    Type: Application
    Filed: May 29, 2003
    Publication date: April 1, 2004
    Inventors: Mitsuaki Kobayashi, Hiroshi Ayukawa
  • Publication number: 20020192445
    Abstract: Components for electronic displays containing a polyimide substrate and an electrical conductor are disclosed. The components are suitable for use in touch panel displays. The invention is also directed to electronic displays incorporating the components of the invention, and methods of making the display components. The combined polyimide substrate and electrical conductor are selected such that they have high internal radiation transmissivity, and typically have an effective radiation absorption coefficient of less than 0.02 per micron at wavelengths from 400 to 450 nm. In addition, the polyimide substrate permits processing of the display components at elevated temperatures, and usually has a glass transition temperature greater than 300° C.
    Type: Application
    Filed: May 3, 2001
    Publication date: December 19, 2002
    Inventors: Stephen A. Ezzell, Robert S. Moshrefzadeh, Elisa M. Cross, Bert T. Chien, Mitsuaki Kobayashi, Hiroshi Ayukawa
  • Patent number: 6417321
    Abstract: A thermally cured polyimide is provided, and in particular a crosslinked polyimide, comprising a fluorenyl diamine and comprising an aromatic ring having at least one C1-C10 branched or unbranched alkyl substituent, where the alkyl substituent includes a benzylic hydrogen. The present invention provides a crosslinked polyimide made by a process comprising the step of crosslinking a polyimide comprising diamines comprising pendent fluorenyl groups and comprising aromatic rings having at least one C1-C10 branched or unbranched alkyl substituent, the alkyl substituent including a benzylic hydrogen, by raising the temperature of said polyimide above its glass transition temperature.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: July 9, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Kazuhiko Minami, Hiroshi Ayukawa, Toshihiro Suwa, Mitsuaki Kobayashi, Bert T. Chien, Stephen A. Ezzell