Abstract: Disclosed are an apparatus having sliding parts and a compound for preventing diffusion or separation of a base oil; and a compound for preventing diffusion or separation of the base oil used for the apparatus: an electronic or electric appliance using a joul heat generating source, means for taking out joul heat to the outside by sliding with said heat generating source, and heat conducting compound intervenient between said heat taking out means and heat generating source; and the heat conducting compound used for the appliance.

Abstract: Object of the present invention is to provide an apparatus in which water, oil or grease are maintained on an ordinary using surface in a stable condition by preventing the water, the oil or the grease from moving to other surface than the ordinary using surface.The present invention relates to an apparatus using water, oil, or grease, especially, the apparatus in which surroundings of the surface maintaining the water, the oil, or the grease are reformed by fluorinated compound. In accordance with the present invention, seeping out of the water, the oil, or the grease are prevented, the water, the oil, or the grease are certainly held at the using surface, and stable performance is maintained for a long time.

Abstract: In a liquid cooling system comprising cold plates attached to their respective circuit modules, quick couplers are provided for connecting flexible hoses to these cold plates, a supply duct and a return duct to form strings of cold plates connected between the supply duct and the return duct. Valved quick couplers are used for the connection to the supply duct and the return duct, and valveless quick couplers are used for the connection to the cold plates. When a circuit module is to be serviced, a desired string of cold plates is disconnected from the supply duct and the return duct by disjoining the valved quick couplers for the connection thereto. The disconnected string of cold plates is drained of the coolant, and then the cold plate attached to the desired circuit module is disconnected from the hoses. Subsequently the desired circuit module and the cold plate attached thereto can be detached as one body from an associated connector.

Abstract: A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and the wiring board of the multi-chip module are clamped as one body by clamp member, and in which a heat-sink pushing member for pressing the heat sink against the module cap by a constant force is attached to the clamp members.