Abstract: An object of the invention is to improve the reliability of a power semiconductor device. The power semiconductor device according to the invention includes a semiconductor element, a first terminal and a second terminal that transmit current to the semiconductor element, a first base and a second base that are disposed to face each other while interposing a part of the first terminal, a part of the second terminal, and the semiconductor element between the first base and the second base, and a sealing material that is provided in a space between the first base and the second base. The second terminal includes an intermediate portion formed in such a way that a distance from the first terminal increases along a direction away from the semiconductor element. The intermediate portion is provided between the first base and the second base and in the sealing material.

Abstract: A power semiconductor device includes a circuit body, first and second insulations, first and second bases, a case, and a distance regulation portion. The circuit body incudes a semiconductor element and a conductive portion. The first insulation and the second insulation oppose each other. The first base and second base also oppose each other. The case has a first opening portion covered with the first base and a second opening portion covered with the second base. The distance regulation portion has a first end that contacts the first base and a second end, that is opposite to the first end, and that contacts the second base. The distance regulation portion regulates a distance between the first base and the second base.

Abstract: An object of the invention is to improve the reliability of a power semiconductor device. The power semiconductor device according to the invention includes a semiconductor element, a first terminal and a second terminal that transmit current to the semiconductor element, a first base and a second base that are disposed to face each other while interposing a part of the first terminal, a part of the second terminal, and the semiconductor element between the first base and the second base, and a sealing material that is provided in a space between the first base and the second base. The second terminal includes an intermediate portion formed in such a way that a distance from the first terminal increases along a direction away from the semiconductor element. The intermediate portion is provided between the first base and the second base and in the sealing material.

Abstract: An object of the present invention is to provide a power semiconductor device enabling maintenance in reliability and improvement in productivity. According to the present invention, provided are: a circuit body including a semiconductor element and a conductive portion; a first insulation and a second insulation opposed to each other, the circuit body being interposed between the first insulation and the second insulation; a first base and a second base opposed to each other, the circuit body, the first insulation, and the second insulation being interposed between the first base and the second base; a case having a first opening portion covered with the first base and a second opening portion covered with the second base; and a distance regulation portion provided in space between the first base and the second base, the distance regulation portion regulating a distance between the first base and the second base in contact with the first base and the second base.

Abstract: An object of the present invention is to provide a semiconductor module that can improve the dissipation of heat from semiconductor elements toward a cooling body. A semiconductor module of the present invention includes a plurality of resin-molded semiconductor devices that are mounted on a single metal base and are electrically connected. The plurality of semiconductor devices each have a structure in which a metal heat dissipation plate, which is formed on a surface of an insulating substrate on the side opposite to a semiconductor-element-mount surface, is exposed from a resin mold, and the metal heat dissipation plate is embedded in each opening provided in the metal base, so that the rear surface of the metal heat dissipation plate becomes a plane to be disposed on a cooling body.

Abstract: An object of the present invention is to provide a semiconductor module that can improve the dissipation of heat from semiconductor elements toward a cooling body. A semiconductor module of the present invention includes a plurality of resin-molded semiconductor devices that are mounted on a single metal base and are electrically connected. The plurality of semiconductor devices each have a structure in which a metal heat dissipation plate, which is formed on a surface of an insulating substrate on the side opposite to a semiconductor-element-mount surface, is exposed from a resin mold, and the metal heat dissipation plate is embedded in each opening provided in the metal base, so that the rear surface of the metal heat dissipation plate becomes a plane to be disposed on a cooling body.

Abstract: A semiconductor device in which the lifetime of mounted components can be prolonged. A cooling system for controlling the temperature of a refrigerant through a heating section and a radiator is provided. The semiconductor device is connected to the cooling system and is cooled. A variation width (?T1) of temperature controlled by the cooling system through the heating section and the radiator is smaller than a temperature variation (?T2) of the refrigerant caused by variations in operating conditions of the semiconductor device (?T1??T2).

Abstract: A power semiconductor module has a silicon nitride insulated substrate, a metal circuit plate made of Cu or a Cu alloy, which is disposed on one surface of the silicon nitride insulated substrate, a semiconductor chip mounted on the metal circuit plate, and a heat dissipating plate made of Cu or a Cu alloy, which is disposed on the other surface of the silicon nitride insulated substrate; a carbon fiber-metal composite made of carbon fiber and Cu or a Cu alloy is provided between the silicon nitride insulated substrate and the metal circuit plate; the thermal conductivity of the carbon fiber-metal composite in a direction in which carbon fiber of the carbon fiber-metal composite is oriented is 400 W/m·k or more. Accordingly, a power semiconductor module that has a low thermal resistance between the semiconductor chip and a heat dissipating mechanism and also has improved cooling capacity is provided.

Abstract: A semiconductor device in which the lifetime of mounted components can be prolonged. A cooling system for controlling the temperature of a refrigerant through a heating section (1) and a radiator (2) is provided. The semiconductor device (100) is connected to the cooling system and is cooled. A variation width (?T1) of temperature controlled by the cooling system through the heating section (1) and the radiator (2) is larger than a temperature variation (?T2) of the refrigerant caused by variations in operating conditions of the semiconductor device (100) (?T1>?T2).