Patents by Inventor Hiroshi Hoya

Hiroshi Hoya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8592674
    Abstract: Means for Solving the Problems The thermoplastic resin composition (X1) of the present invention comprises (A1), (B1), (C1), and optionally (D1) below: 1 to 90 wt % of an isotactic polypropylene (A1); 9 to 98 wt % of a propylene/ethylene/?-olefin copolymer (B1) containing 45 to 89 mol % of propylene-derived structural units, 10 to 25 mol % of ethylene-derived structural units, and optionally, 0 to 30 mol % of C4-C20 ?-olefin-derived structural units (a1); 1 to 80 wt % of a styrene-based elastomer (C1); and 0 to 70 wt % of an ethylene/?-olefin copolymer (D1) whose density is in the range of 0.850 to 0.910 g/cm3, wherein (A1)+(B1)+(C1)+(D1)=100 wt %.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: November 26, 2013
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroshi Hoya, Kiminori Noda, Norihide Inoue, Hiroshi Uehara, Eiji Shiba, Masayoshi Yamaguchi, Manabu Kawamoto, Akira Yamashita
  • Patent number: 8470449
    Abstract: It is an object of the present invention to provide a propylene-based polymer composition which is excellent in transparency and heat resistance (particularly, heat resistance at high heat deformation temperature) and is free from occurrence of stickiness even when it is used at a high temperature for a long period of time. The propylene-based polymer composition of the invention comprises (A) a propylene-based polymer (PP) satisfying the following requirements (1) and (2), in an amount of 1 to 99 parts by weight, and (B) a propylene/ethylene/?-olefin copolymer satisfying the following requirements (I) to (IV), in an amount of 99 to 1 part by weight, with the proviso that the total amount of the component (A) and the component (B) is 100 parts by weight; (1) the polymer (A) has a melting point (Tm), as measured by a differential scanning calorimeter (DSC), of not lower than 110° C. but not higher than 170° C.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: June 25, 2013
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroshi Hoya, Koji Matsunaga, Yoji Hayakawa, Kunihiko Mizumoto
  • Publication number: 20130017351
    Abstract: Means for solving the problems The thermoplastic resin composition (X1) of the present invention comprises (A1), (B1), (C1), and optionally (D1) below: 1 to 90 wt % of an isotactic polypropylene (A1); 9 to 98 wt % of a propylene/ethylene/?-olefin copolymer (B1) containing 45 to 89 mol % of propylene-derived structural units, 10 to 25 mol % of ethylene-derived structural units, and optionally, 0 to 30 mol % of C4-C20 ?-olefin-derived structural units (a1); 1 to 80 wt % of a styrene-based elastomer (C1); and 0 to 70 wt % of an ethylene/?-olefin copolymer (D1) whose density is in the range of 0.850 to 0.910 g/cm3, wherein (A1)+(B1)+(C1)+(D1)=100 wt %.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 17, 2013
    Inventors: Hiroshi HOYA, Kiminori Noda, Norihide Inoue, Hiroshi Uehara, Eiji Shiba, Masayoshi Yamaguchi, Manabu Kawamoto, Akira Yamashita
  • Publication number: 20130017379
    Abstract: Means for Solving the Problems The thermoplastic resin composition (X1) of the present invention comprises (A1), (B1), (C1), and optionally (D1) below: 1 to 90 wt % of an isotactic polypropylene (A1); 9 to 98 wt % of a propylene/ethylene/?-olefin copolymer (B1) containing 45 to 89 mol % of propylene-derived structural units, 10 to 25 mol % of ethylene-derived structural units, and optionally, 0 to 30 mol % of C4-C20?-olefin-derived structural units (a1); 1 to 80 wt % of a styrene-based elastomer (C1); and 0 to 70 wt % of an ethylene/?-olefin copolymer (D1) whose density is in the range of 0.850 to 0.910 g/cm3, wherein (A1)+(B1)+(C1)+(D1)=100 wt %.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 17, 2013
    Inventors: Hiroshi HOYA, Kiminori NODA, Norihide INOUE, Hiroshi UEHARA, Eiji SHIBA, Masayoshi YAMAGUCHI, Manabu KAWAMOTO, Akira YAMASHITA
  • Publication number: 20130011596
    Abstract: Means for Solving the Problems The thermoplastic resin composition (X1) of the present invention comprises (A1), (B1), (C1), and optionally (D1) below: 1 to 90 wt % of an isotactic polypropylene (A1); 9 to 98 wt % of a propylene/ethylene/?-olefin copolymer (B1) containing 45 to 89 mol % of propylene-derived structural units, 10 to 25 mol % of ethylene-derived structural units, and optionally, 0 to 30 mol % of C4-C20 ?-olefin-derived structural units (a1); 1 to 80 wt % of a styrene-based elastomer (C1); and 0 to 70 wt % of an ethylene/?-olefin copolymer (D1) whose density is in the range of 0.850 to 0.910 g/cm3, wherein (A1)+(B1)+(C1)+(D1)=100 wt %.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 10, 2013
    Inventors: Hiroshi HOYA, Kiminori Noda, Norihide Inoue, Hiroshi Uehara, Eiji Shiba, Masayoshi Yamaguchi, Manabu Kawamoto, Akira Yamashita
  • Publication number: 20130011649
    Abstract: Means for solving the problems The thermoplastic resin composition (X1) of the present invention comprises (A1), (B1), (C1), and optionally (D1) below: 1 to 90 wt % of an isotactic polypropylene (A1); 9 to 98 wt % of a propylene/ethylene/?-olefin copolymer (B1) containing 45 to 89 mol % of propylene-derived structural units, 10 to 25 mol % of ethylene-derived structural units, and optionally, 0 to 30 mol % of C4-C20 ?-olefin-derived structural units (a1); 1 to 80 wt % of a styrene-based elastomer (C1); and 0 to 70 wt % of an ethylene/?-olefin copolymer (D1) whose density is in the range of 0.850 to 0.910 g/cm3, wherein (A1)+(B1)+(C1)+(D1)=100 wt %.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 10, 2013
    Inventors: Hiroshi HOYA, Kiminori NODA, Norihide INOUE, Hiroshi UEHARA, Eiji SHIBA, Masayoshi YAMAGUCHI, Manabu KAWAMOTO, Akira YAMASHITA
  • Patent number: 8338697
    Abstract: The thermoplastic resin composition (X1) of the present invention comprises (A1), (B1), (C1), and optionally (D1) below: 1 to 90 wt % of an isotactic polypropylene (A1); 9 to 98 wt % of a propylene/ethylene/?-olefin copolymer (B1) containing 45 to 89 mol % of propylene-derived structural units, 10 to 25 mol % of ethylene-derived structural units, and optionally, 0 to 30 mol % of C4-C20 ?-olefin-derived structural units (a1); 1 to 80 wt % of a styrene-based elastomer (C1); and 0 to 70 wt % of an ethylene/?-olefin copolymer (D1) whose density is in the range of 0.850 to 0.910 g/cm3, wherein (A1)+(B1)+(C1)+(D1)=100 wt %.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: December 25, 2012
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroshi Hoya, Kiminori Noda, Norihide Inoue, Hiroshi Uehara, Eiji Shiba, Masayoshi Yamaguchi, Manabu Kawamoto, Akira Yamashita
  • Patent number: 8324321
    Abstract: The present invention provides a thermoplastic resin composition that gives a solar cell sealing sheet having, even without being crosslinked, good mechanical strength, solar cell sealability, transparency, and weatherability. The thermoplastic resin composition of the present invention comprises 1 to 95% by weight of a propylene-based polymer (A) and 5 to 99% by weight of a copolymer (B) with at least one •-olefin having 2 to 20 carbon atoms other than propylene, wherein (A) satisfies the following (i) and (ii), and (B) has a melting point below 80° C. or does not show a melting point as measured by a differential scanning calorimeter (DSC). (i) Melting point measured by a differential scanning calorimeter (DSC) method is in the range of 80 to 135° C. (ii) Endotherm attributable to crystal melting is not observed at 140° C. or more in the endothermic curve measured by a differential scanning calorimeter (DSC) method.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: December 4, 2012
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroshi Hoya, Kiminori Noda
  • Patent number: 8288479
    Abstract: Propylene-based polymers (A) are provided which, when used as pressure-sensitive adhesives to various adherends, show a desired initial adhesion and will not contaminate the adherends and which have excellent pellet handling properties. Pellets of the invention contain the propylene-based polymers (A). Pressure-sensitive adhesives of the invention contain the propylene-based polymers (A). The propylene-based polymer (A) includes 65 to 80 mol % of a structural unit derived from propylene, 5 to 10 mol % of a structural unit derived from ethylene and 15 to 25 mol % of a structural unit derived from a C4-20 ?-olefin (wherein these percentages are calculated based on 100 mol % of the total of the structural unit derived from propylene, the structural unit derived from ethylene and the structural unit derived from a C4-20 ?-olefin) and has a heat of crystal fusion of 5 to 45 (J/g) as measured by DSC. Compositions of the invention contain the propylene-based polymers (A).
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: October 16, 2012
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Ikuo Akai, Hiroshi Hoya, Yoji Hayakawa, Koji Matsunaga
  • Patent number: 8236131
    Abstract: [Problem] To provide a thermoplastic resin composition which is excellent in transparency and adhesion properties and hardly causes staining of an adherend after it is separated, a multilayer laminate using the composition, an article, and a method for protecting a surface of an article. [Means for solving problem] A thermoplastic resin composition (X) comprising the following components (A) to (C): (A) isotactic polypropylene containing not less than 90% by mol of propylene units, in an amount of 1 to 65% by weight, (B) a propylene copolymer which is a copolymer of propylene and at least one ?-olefin of 2 to 20 carbon atoms (excluding propylene) and whose melting point, as measured by DSC, is lower than 65° C.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: August 7, 2012
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroshi Hoya, Yoji Hayakawa, Koji Matsunaga
  • Publication number: 20120190601
    Abstract: It is an object to provide a lubricating oil composition having low-temperature properties and fuel efficiency at high temperatures which are superior to those of conventional lubricating oil compositions, and to provide a viscosity modifier for lubricating oils and an additive composition for lubricating oils which are used for obtaining said composition. The viscosity modifier for lubricating oils of the present invention comprises a propylene copolymer (A) which has a density of 875 kg/m3 or less and which comprises 60 mole % or more of structural unit derived from propylene.
    Type: Application
    Filed: September 28, 2009
    Publication date: July 26, 2012
    Inventors: Satoshi Ikeda, Nozomi Kamiya, Hiroshi Hoya, Jumpei Tanaka, Chor Huang
  • Patent number: 8211568
    Abstract: In a packaging material for electrochemical cell, a thermally adhesive resin layer is configured of a resin having a propylene based elastomer resin in a propylene based resin. This propylene based elastomer resin is a copolymer composed of a constitutional unit derived from propylene and a constitutional unit derived from an ?-olefin having from 2 to 20 carbon atoms; when the total sum of the constitutional unit derived from propylene and the constitutional unit derived from an ?-olefin is defined as 100% by mole, contains 50% by mole or more of the constitutional unit derived from propylene; and is satisfied with (a) a Shore A hardness (ASTM D2240) of from 65 to 90, (b) a melting point of from 130 to 170° C., (c) a density (ASTM D1505) of from 860 to 875 kg/m3 and (d) a glass transition temperature as measured by DSC of from ?25° C. to ?35° C.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: July 3, 2012
    Assignees: Dai Nippon Printing Co., Ltd., Mitsui Chemicals, Inc.
    Inventors: Takanori Yamashita, Masataka Okushita, Hirohisa Akita, Hiroshi Hoya
  • Publication number: 20120053298
    Abstract: The present invention provides a thermoplastic resin composition that gives a solar cell sealing sheet having, even without being crosslinked, good mechanical strength, solar cell sealability, transparency, and weatherability. The thermoplastic resin composition of the present invention comprises 1 to 95% by weight of a propylene-based polymer (A) and 5 to 99% by weight of a copolymer (B) with at least one •-olefin having 2 to 20 carbon atoms other than propylene, wherein (A) satisfies the following (i) and (ii), and (B) has a melting point below 80° C. or does not show a melting point as measured by a differential scanning calorimeter (DSC). (i) Melting point measured by a differential scanning calorimeter (DSC) method is in the range of 80 to 135° C. (ii) Endotherm attributable to crystal melting is not observed at 140° C. or more in the endothermic curve measured by a differential scanning calorimeter (DSC) method.
    Type: Application
    Filed: November 10, 2011
    Publication date: March 1, 2012
    Inventors: Hiroshi HOYA, Kiminori NODA
  • Patent number: 8101684
    Abstract: A material which is excellent in mechanical strength, solar cell sealing properties, transparency, etc., even in an uncrosslinked state and is used in producing a sheet for solar cell sealing. The thermoplastic resin composition for solar cell sealing comprises (A) 0-70 wt. % propylene polymer having a melting point of 100° C. or higher and (B) 30-100 wt. % propylene copolymer satisfying the following requirements (b). (b) The copolymer has an MFR (230° C., 2.16-kg load) in the range of 0.01-100 g/10 min and satisfies at least one of the following requirements (b-1) and (b-2): (b-1) the rr content is 60% or higher; and (b-2) the copolymer comprises 55-90 mol % structural units derived from propylene and 10-45 mol % structural units derived from a C2-20 ?-olefin (excluding propylene) and has an intrinsic viscosity [?] (dL/g) (measured in 135° C. decalin) satisfying a specific relationship with the MFR.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: January 24, 2012
    Assignee: Mitsui Chemicals, Inc.
    Inventor: Hiroshi Hoya
  • Publication number: 20110319548
    Abstract: The invention provides a thermoplastic elastomer composition that has an excellent balance between flexibility and heat resistance (creep resistance), shows little tackiness (stickiness) and is not deteriorated in design properties even when exposed to a high temperature. A thermoplastic elastomer composition (X) includes a propylene copolymer (A) satisfying all the requirements (A1) to (A3) described below, a crystalline polyolefin polymer (B) which is optional, and a styrene block copolymer (C). (A1) The Shore A hardness is in the range of 50 to 90. (A2) The copolymer gives a melting peak Tm in the range of 30 to 95° C., and the endothermic enthalpy ?H corresponding to the melting peak is in the range of 1.0 to 20 J/g. (A3) The molecular weight distribution Mw/Mn is in the range of 1.2 to 3.0.
    Type: Application
    Filed: March 11, 2010
    Publication date: December 29, 2011
    Inventors: Hiroshi Hoya, Yoji Hayakawa, Koji Matsunaga
  • Patent number: 8067499
    Abstract: The present invention provides a thermoplastic resin composition that gives a solar cell sealing sheet having, even without being crosslinked, good mechanical strength, solar cell sealability, transparency, and weatherability. The thermoplastic resin composition of the present invention comprises 1 to 95% by weight of a propylene-based polymer (A) and 5 to 99% by weight of a copolymer (B) with at least one •-olefin having 2 to 20 carbon atoms other than propylene, wherein (A) satisfies the following (i) and (ii), and (B) has a melting point below 80° C. or does not show a melting point as measured by a differential scanning calorimeter (DSC). (i) Melting point measured by a differential scanning calorimeter (DSC) method is in the range of 80 to 135° C. (ii) Endotherm attributable to crystal melting is not observed at 140° C. or more in the endothermic curve measured by a differential scanning calorimeter (DSC) method.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: November 29, 2011
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroshi Hoya, Kiminori Noda
  • Patent number: 8067502
    Abstract: The present invention provides a thermoplastic resin composition that gives a solar cell sealing sheet having, even without being crosslinked, good mechanical strength, solar cell sealability, transparency, and weatherability. The thermoplastic resin composition of the present invention comprises 1 to 95% by weight of a propylene-based polymer (A) and 5 to 99% by weight of a copolymer (B) with at least one ?-olefin having 2 to 20 carbon atoms other than propylene, wherein (A) satisfies the following (i) and (ii), and (B) has a melting point below 80° C. or does not show a melting point as measured by a differential scanning calorimeter (DSC). (i) Melting point measured by a differential scanning calorimeter (DSC) method is in the range of 80 to 135° C. (ii) Endotherm attributable to crystal melting is not observed at 140° C. or more in the endothermic curve measured by a differential scanning calorimeter (DSC) method.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: November 29, 2011
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroshi Hoya, Kiminori Noda
  • Patent number: 8003223
    Abstract: The present invention is directed to a heat-sealable propylene-based polymer composition comprising a propylene polymer composition including a propylene polymer component and propylene/ethylene random copolymer component; an ethylene/?-olefin random copolymer; and a soft propylene polymer composition. The present invention also provides a heat-sealable film using the composition and a packaging bag comprising the film. The heat-sealable film of the present invention has high heat-seal strength, with little decrease in heat-seal strength even after heat treatment. The heat-sealable film also has excellent blocking resistance, rigidity and low-temperature impact resistance.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: August 23, 2011
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Kazuhide Maruyama, Ichiro Takeishi, Norihide Inoue, Hiroshi Hoya
  • Publication number: 20110172348
    Abstract: It is an object of the present invention to provide adhesive compositions having excellent flexibility, rubber elasticity, mechanical properties, heat resistance and low-temperature properties. An adhesive composition of the invention includes 10 to 70 parts by weight of a soft polypropylene resin composition (X) which includes 40 to 98 wt % of a propylene copolymer (A) satisfying the following requirements (A1) to (A8) and 2 to 60 wt % of a crystalline isotactic polypropylene (B) satisfying the following requirements (B1) to (B3), and 30 to 90 parts by weight of a tackifier (C) (wherein the total of the component (X) and the component (C) is 100 parts by weight), wherein (A1) Shore A hardness: 20 to 90; (A2) the copolymer comprises a copolymer with C3 units at 51 to 90 mol %, C2 units at 7 to 24 mol % and C4-20 ?-olefin units at 3 to 25 mol %; (A3) Mw/Mn: 1.2 to 3.5; (A4) mm: 85 to 99.9%; (A5) value B: 0.8 to 1.3; (A6) 2,1-insertion ratio: less than 1%; (A7) Tg: ?10° C. to ?50° C.; (A8) MFR (230° C.): 0.
    Type: Application
    Filed: August 28, 2009
    Publication date: July 14, 2011
    Inventors: Hiroshi Hoya, Koji Matsunaga, Yoji Hayakawa, Hiroto Yasui, Shin Tokui
  • Publication number: 20110165416
    Abstract: [Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [?] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.
    Type: Application
    Filed: January 10, 2011
    Publication date: July 7, 2011
    Inventors: Kuniaki KAWABE, Masayoshi Sutou, Toshiyuki Itou, Mai Kurihara, Akinori Etoh, Shinichirou Asao, Kenji Sugimura, Hiroshi Hoya, Koji Matsunaga, Yoji Hayakawa, Kunihiko Mizumoto