Abstract: A semiconductor wafer having a plurality of interconnect layers, includes a plurality of chip-composing portions, a dicing region separating the chip-composing portions from each other, and a plurality of inter-chip interconnects formed in the dicing region and electrically connecting adjacent ones of the chip-composing portions, wherein each of the inter-chip interconnects has a width of an intermediate portion narrower than widths of connection end portions connected to the adjacent ones of the chip-composing portions.

Abstract: A semiconductor wafer having a plurality of interconnect layers, includes a plurality of chip-composing portions, a dicing region separating the chip-composing portions from each other, and a plurality of inter-chip interconnects formed in the dicing region and electrically connecting adjacent ones of the chip-composing portions, wherein each of the inter-chip interconnects has a width of an intermediate portion narrower than widths of connection end portions connected to the adjacent ones of the chip-composing portions.

Abstract: A method for manufacturing a semiconductor device includes forming a semiconductor wafer including a plurality of interconnect layers, the semiconductor wafer including: a plurality of chip-composing portions; a dicing region separating the chip-composing portions from each other; and a plurality of inter-chip interconnects formed in the dicing region and electrically connecting adjacent ones of the chip-composing portions; and forming semiconductor chips by dicing the dicing region so as to divide the chip-composing portions, wherein each of the inter-chip interconnects has a width of an intermediate portion narrower than widths of connection end portions connected to the adjacent ones of the chip-composing portions.

Abstract: A method for manufacturing a semiconductor device includes forming a semiconductor wafer including a plurality of interconnect layers, the semiconductor wafer including: a plurality of chip-composing portions; a dicing region separating the chip-composing portions from each other; and a plurality of inter-chip interconnects electrically connecting adjacent ones of the chip-composing portions and formed in one of the interconnect layers and in the dicing region; a dummy metal pattern comprising a plurality of dummy metals, the dummy metal pattern being formed in at least one of the interconnect layers over or below the inter-chip interconnects only in an area corresponded to a region where the inter-chip interconnects are arranged and corresponded to a region therearound; and forming semiconductor chips by dicing the dicing region so as to divide the chip-composing portions.

Abstract: A method for manufacturing a semiconductor device includes forming a semiconductor wafer including a plurality of interconnect layers, the semiconductor wafer including: a plurality of chip-composing portions; a dicing region separating the chip-composing portions from each other; and a plurality of inter-chip interconnects electrically connecting adjacent ones of the chip-composing portions and formed in one of the interconnect layers and in the dicing region; a dummy metal pattern comprising a plurality of dummy metals, the dummy metal pattern being formed in at least one of the interconnect layers over or below the inter-chip interconnects only in an area corresponded to a region where the inter-chip interconnects are arranged and corresponded to a region therearound; and forming semiconductor chips by dicing the dicing region so as to divide the chip-composing portions.

Abstract: A method for manufacturing a semiconductor device includes forming a semiconductor wafer including a plurality of interconnect layers, the semiconductor wafer including: a plurality of chip-composing portions; a dicing region separating the chip-composing portions from each other; and a plurality of inter-chip interconnects formed in the dicing region and electrically connecting adjacent ones of the chip-composing portions; and forming semiconductor chips by dicing the dicing region so as to divide the chip-composing portions, wherein each of the inter-chip interconnects has a width of an intermediate portion narrower than widths of connection end portions connected to the adjacent ones of the chip-composing portions.

Abstract: A semiconductor chip mounted on a lead frame is sealed in a synthetic resin package through a molding process, and pressure is applied to synthetic resin softened from granular. synthetic resin so as to evacuate the air from the synthetic resin before injecting the synthetic resin into cavities formed in a molding die, thereby preventing the synthetic resin package from void.

Abstract: A semiconductor chip mounted on a lead frame is sealed in a synthetic resin package through a molding process, and pressure is applied to synthetic resin softened from granular synthetic resin so as to evacuate the air from the synthetic resin before injecting the synthetic resin into cavities formed in a molding die, thereby preventing the synthetic resin package from void.

Abstract: Semiconductor chips are arranged on a panel in matrix, scaled in a piece of synthetic resin through a transfer molding, and the resultant structure is separated into dices through a cutting operation so that small semiconductor devices are economically produced.

Abstract: A metal mold for sealing a semiconductor device with a resin and including a shutter gate mechanism. The mold drives a shutter gate pin by using the ejection stroke of a conventional seal press, and therefore eliminates the need for an extra drive source. It follows that the mold can be implemented only if an existing facility is slightly modified, and it is lower in cost than conventional metal molds.

Abstract: A hydrogenated copolymer rubber which is a hydrogenation product of a random copolymer rubber consisting of:(A) 30-70 mole % of a unit derived from at least one monomer selected from the group consisting of alkyl acrylates and alkoxy-substituted alkyl acrylates,(B) 20-70 mole % of a unit derived from at least one conjugated diene, and(C) 0-10 mole % of a unit derived from at least one other ethylenically unsaturated compound copolymerizable with the components (A) and (B) [(A)+(B)+(C)=100 mole %] wherein at least 90% of the double bonds of the conjugated diene unit is hydrogenated; a crosslinkable rubber composition comprising said hydrogenated copolymer rubber and a crosslinking agent; and a thermoplastic polymer comprising said hydrogenated copolymer rubber and a thermoplastic resin. These rubbers and compositions are superior in low-temperature resistance, heat resistance, ozone resistance, mechanical strengths, compression set, impact resilience and oil resistance.

Abstract: A solid gelled fuel for producing a visible flame of various colors, which contains methyl alcohol as a primary ingredient in a solid gel with the addition of dibenzylidene sorbitol, cellulose ester and ethylene glycol, with a flame coloring compound being suspended in the solid.

Abstract: An acrylic rubber obtainable by copolymerizing a monomer mixture of:(A) 70 to 99.99% by weight of at least one compound selected from the group consisting of alkyl acrylates and alkoxyalkyl acrylates,(B) 0.01 to 10% by weight of at least one compound represented by the general formula: ##STR1## wherein R.sup.1 is a hydrogen atom or a methyl group; X is a hydrogen atom, --COOR.sup.6 (R.sup.6 is an alkyl group having 1-10 carbon atoms or an alkoxyalkyl group having 2-14 carbon atoms), or ##STR2## R.sup.2, R.sup.3 and R.sup.4 are independently hydrogen atoms or groups having 1-10 carbon atoms whose carbon atom adjacent to C.dbd.C has no hydrogen; R.sup.5 is a group having 1-10 carbon atoms whose carbon atom adjacent to C.dbd.C has no hydrogen; Y is ##STR3## or --O--; and n is 1 or 0, and (C) 0-20% by weight of at least one compound selected from the group consisting of other unsaturated compounds of the vinyl type, vinylidene type and vinylene type, in the presence of a radical polymerization initiator.

Abstract: In a sunroof structure having an opening provided in a roof panel of an automobile, a sunroof panel which can move between a first position for closing the opening and a second position for exposing the opening, a sunroof base panel supporting a mechanism for achieving the motion of the sunroof panel, and a water drain trough defined along a peripheral region of the opening, the water drain trough is defined by a trough member having a substantially U-shaped cross section extending along the peripheral region of the opening and resting upon an inner surface of an outer wall of the sunroof base panel and an outer surface of a guide rail for the sunroof panel. Preferably, the trough member consists of an extension of a seal member which is interposed between a lower surface of the roof panel and an upper most edge of the outer wall of the sunroof base panel. Thus, the trough member is not required to be rigid and the assembly work is simplified.