Patents by Inventor Hiroshi Kumakura

Hiroshi Kumakura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6301343
    Abstract: The present trunk line exchange system is capable of coping with the busy hour calls without falling into congestion by executing re-distribution of the number of communication lines to the busy region from the quite region, which results in yielding efficient utilization of the communication lines. The system is also capable of avoiding the congestion of the exchange system, since it is not necessary to conduct a series of operations such as recalls/alternative line processing.
    Type: Grant
    Filed: August 7, 1998
    Date of Patent: October 9, 2001
    Assignee: NEC Corporation
    Inventor: Hiroshi Kumakura
  • Patent number: 5726767
    Abstract: An automatic facsimile signal analyzing system includes a switch unit, a service trunk, a signal identification trunk, a facsimile communication determination unit, and a control unit. The signal identification trunk restores a facsimile control signal from a modulated and encoded facsimile signal on the set speech path and performs collection of communication state information and detection of a start of facsimile communication on the basis of the restored facsimile control signal. The facsimile communication determination unit permits an operation of the signal identification trunk when the classification result from the service trunk represents a type other than the voice signal and analyzes the communication state information from the signal identification trunk.
    Type: Grant
    Filed: June 30, 1995
    Date of Patent: March 10, 1998
    Assignees: Nec Corporation, Kokusai Denshin Denwa Co. Ltd.
    Inventors: Hiroshi Kumakura, Takashi Itani, Ken-ichi Nishimura, Hideki Amano, Masayoshi Sato
  • Patent number: 4677252
    Abstract: A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.
    Type: Grant
    Filed: November 18, 1986
    Date of Patent: June 30, 1987
    Assignee: Sony Corporation
    Inventors: Satoshi Takahashi, Akira Tsutsumi, Junji Suzuki, Hiroshi Kumakura, Takao Ito, Kenji Ohsawa, Yuji Ikegami, Muneyuki Haruki, Nobuyuki Yasuda, Masayuki Ohta