Abstract: A life estimation apparatus for a pressure accumulator estimates the life of the pressure accumulator based on an AE signal for the pressure accumulator. The life estimation apparatus includes: an AE sensor that is provided at the pressure accumulator and detects the AE signal; and an estimation unit that sets a point of time at which the AE sensor detects a damage AE signal that is generated from the pressure accumulator because of damage of a material during use of the pressure accumulator, as a minimum initial flaw generation time point that is a point of time at which a minimum initial flaw of the pressure accumulator that is detected by a non-destructive inspection method is generated in shipping of the pressure accumulator.

Abstract: An image capturing apparatus includes a plurality of pixels, a first amplifier capable of amplifying a signal of each pixel using a plurality of different gains, a second amplifier capable of amplifying the signal of each pixel using a plurality of different gains, with a method different from a method used by the first amplifier; and a control unit that performs control so as to execute one of first processing and second processing based on a shooting mode of the image capturing apparatus, a setting at the time of shooting, or a state of a subject, the first processing causing the first amplifier to amplify the signal of each pixel using a plurality of different gains, the second processing causing the second amplifier to amplify the signal of each pixel using a plurality of different gains.

Abstract: A steel pipe for high-pressure hydrogen, the steel pipe having a chemical composition containing, by mass %, C: 0.05% to 0.60%, Si: 0.001% to 2.0%, Mn: 0.01% to 5.0%, P: 0.030% or less, S: 0.010% or less, N: 0.010% or less, Al: 0.0001% to 1.00%, 0: 0.010% or less, H: 0.00010% or less, and a balance of Fe and incidental impurities and a metallic microstructure including, in terms of area fraction, 3% or less (including 0%) of retained austenite, in which the number of inclusions having an aspect ratio of 2.0 or more and a length of 10 ?m or more is 15/100 mm2 or less.

Abstract: A composition containing a compound represented by the following Formula (1): [in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain]; and a compound represented by the following Formula (2): [in the Formula (2), R21 and R22 each independently represent a hydrogen atom or a monovalent organic group, and R21 and R22 may be bonded to each other to form a ring; and R23 represents a hydrogen atom or a methyl group].

Abstract: A composition containing a compound represented by the following Formula (1): [in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain]; and a compound represented by the following Formula (2): [in the Formula (2), R21 and R22 each independently represent a hydrogen atom or a methyl group; and R23 represents a divalent group having a poly(meth)acrylate chain].

Abstract: A charger includes a power regulator that regulates power supplied from a power supply and outputs the power to a power storage device, a current detector that detects a battery current supplied to the power storage device, a voltage detector that detects a battery voltage, a controller that performs feedback control over the power regulator based on the battery current and the battery voltage, a feedback signal generator that generates, based on the battery current and the battery voltage, a power feedback signal usable for constant current control and constant voltage control, and a feedback calculator that generates, based on a difference between a command value and the power feedback signal, a control signal to control the power regulator.

Abstract: A high-frequency module includes a mounting substrate, a filter, and a common inductor. The mounting substrate includes a first main surface and a second main surface facing each other. The filter includes series arm resonators and parallel arm resonators, and is disposed on the first main surface. The mounting substrate includes a ground terminal on the second main surface. A first end of the common inductor is connected to all of the parallel arm resonators. A second end of the common inductor is connected to the ground terminal.

Abstract: A radio-frequency circuit includes a first switch, a first filter, a second filter, a third filter, and a fourth filter. The first switch is capable of selectively connecting a first selection terminal or a second selection terminal to a first common terminal. The first filter and the second filter are connected to the first selection terminal. The third filter and the fourth filter are connected to the second selection terminal. The first filter and the third filter are band pass filters. The second filter is a band elimination filter. A pass band of the first filter and a rejection band of the second filter overlap each other. The pass band of the first filter and a pass band of the third filter overlap each other.

Abstract: A synchronization system for synchronizing phases of alternating currents supplied from a plurality of power supply devices includes a master unit that outputs a synchronization signal having a predetermined period. Each power supply device includes: a power supply circuit that supplies an alternating current to a power feeding line; and a power supply control unit that receives the synchronization signal and controls the power supply circuit. The power supply control unit calculates an adjusted phase by delaying a phase of the received synchronization signal by an amount corresponding to a prescribed delay time and advancing the delayed phase by an amount corresponding to a time required to transmit the synchronization signal from the master unit to the power supply control unit, and controls the power supply circuit in such as manner as to synchronize the phase of the alternating current with the adjusted phase.

Abstract: A multiplexer includes a first matching circuit having one end connected to a common terminal; a first filter that has one end connected to the other end of the first matching circuit and the other end connected to a first terminal; a second matching circuit having one end connected to the common terminal; a second filter that has one end connected to the other end of the second matching circuit and the other end connected to a second terminal; and a third filter that has one end connected to the common terminal and the other end connected to a third terminal. The first matching circuit includes a first inductor connected on a first signal path in the first matching circuit. The second matching circuit includes a second inductor connected between a second signal path in the second matching circuit and ground.

Abstract: In a radio-frequency module, a hybrid filter includes an acoustic wave filter including at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor. A plurality of outer electrodes of the acoustic wave filter includes a first input and output electrode connected to a first signal terminal, a second input and output electrode connected to a second signal terminal, and a ground electrode connected to a ground terminal. The inductor is disposed on a first major surface of a mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate. When viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and ground electrode.

Abstract: A first filter is a hybrid filter including an acoustic wave filter, a plurality of first inductors, and a plurality of first capacitors. A high frequency module further includes a metal electrode layer covering at least part of a resin layer and at least part of an outer peripheral surface of a mounting substrate. Among a plurality of inductors including the plurality of first inductors of the first filter and a plurality of second inductors of a second filter, at least one inductor (the second inductor) is a circuit element including a conductor pattern portion formed in the mounting substrate. The shortest distance between the outer peripheral surface of the mounting substrate and a signal terminal (a third signal terminal) connected to the circuit element is longer than the shortest distance between the outer peripheral surface of the mounting substrate and the circuit element.

Abstract: A filter circuit that secures the steepness from a pass range to an attenuation range while maintaining a wide-band transmission characteristic and a filter device including this filter circuit are formed. A filter circuit includes a first filter and a second filter. The first filter is a filter including an LC circuit in which a first frequency band is a pass band and a frequency band not higher than the first frequency band is an attenuation band. The second filter is a filter that attenuates a second frequency band within the first frequency band by using an attenuation pole produced by a resonance or an antiresonance of an acoustic wave resonator. Further, the first filter is placed closer to an antenna terminal than the second filter.

Abstract: A capacitor that includes a substrate, a lower electrode on the substrate, a dielectric film on the lower electrode, an upper electrode on a part of the dielectric film, a protective layer that covers the lower electrode and the upper electrode, and an external electrode that penetrates the protective layer. The external electrode is formed only in a region defined by a periphery of the upper electrode in a plan view of the capacitor viewed from an upper surface thereof towards the substrate.

Abstract: A plurality of capacitors and a holding body constructed to hold the plurality of capacitors. Each of the plurality of capacitors includes a semiconductor substrate, a first electrode layer, a dielectric layer, a second electrode layer, and an outer electrode. Among a first capacitor and a second capacitor of the plurality of capacitors, the second capacitor has a shape different from a shape of the first capacitor in at least one of the first electrode layer, the second electrode layer, and the outer electrode.

Abstract: A filter includes a first input/output electrode and the second input/output electrode, and is arranged on a first main surface of a mounting substrate. The mounting substrate includes a first land electrode, a second land electrode, a ground terminal, and a plurality of via conductors. The first land electrode is connected to the first input/output electrode. The second land electrode is connected to the second input/output electrode. The ground terminal is located closer to a second main surface side than the first main surface in a thickness direction of the mounting substrate. The plurality of via conductors is arranged between the first main surface and the second main surface, and is connected to the ground terminal. The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view from the thickness direction of the mounting substrate.

Abstract: A semiconductor device is provided that includes a substrate 10 with first and second opposing main surfaces, a circuit layer disposed on the first main surface, and a first resin body on a surface of the circuit layer opposite from the substrate. The circuit layer includes first and second electrode layers on a side of the semiconductor substrate, a dielectric layer disposed between the electrode layers, a first outer electrode electrically connected to the first electrode layer and extended to the surface of the circuit layer, and a second outer electrode electrically connected to the second electrode layer and extended to the surface of the circuit layer. The first resin body is between the first and second outer electrodes in a plan view, and in sectional view, a tip end of the first resin body is positioned higher than tip ends of the first and second outer electrodes.

Abstract: A multiplexer includes filters and low pass filters. A second frequency band and a third frequency band are partially different. A first frequency band does not overlap the second frequency band and the third frequency band. One end of the filter is connected to a common terminal and the other end is connected to an input/output terminal. The low pass filter is connected in one end to the common terminal and in the other end to one end of the filter. The other end of the filter is connected to one end of the low pass filter. The other end of the low pass filter is connected to the input/output terminal. One end of the filter is connected to a node between the other end of the low pass filter and one end of the filter and the other end of the filter is connected to the input/output terminal.

Abstract: A semiconductor device includes a semiconductor substrate having first and second main surfaces that oppose each other in a thickness direction, and a circuit layer disposed on the first main surface. The circuit layer includes a first electrode layer on a side of the semiconductor substrate, a second electrode layer that faces the first electrode layer, a dielectric layer disposed between the electrode layers, and a first outer electrode electrically connected to the first electrode layer through an opening in the dielectric layer. An end portion of the dielectric layer on a side of the first region is in contact with the first electrode layer, and in the dielectric layer, a size of the end portion in the thickness direction is smaller than a size of an inter-electrode portion between the first and second electrode layers in the thickness direction.

Abstract: A semiconductor device having a semiconductor substrate with first and second main surfaces that face one another in a thickness direction, and a circuit layer disposed on the first main surface. The circuit layer has a first electrode layer on the semiconductor substrate, a dielectric layer on the first electrode layer, a second electrode layer on the dielectric layer, and first and second outer electrodes electrically connected to the first and second electrode layers, respectively. The semiconductor substrate has a first end-portion region in which the circuit layer is not provided on the semiconductor substrate and on the side of the first end surface. In the first end-portion region, a first exposed portion is provided that is exposed between the first main surface and the first end surface.