Patents by Inventor Hiroshi Miyagawa
Hiroshi Miyagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110074171Abstract: An object grasping control method, in which an object grasping control apparatus grasps a plurality of graspable members using a grasping unit, includes recognizing at least one of a shape, position, and attitude of each of the plurality of graspable members, setting, based on at least of one of the shape, position, and attitude of each of the plurality of graspable members, an attitude range as a graspable attitude range in which each of the plurality of graspable members and the grasping unit do not interfere with each other for each of the plurality of graspable members, and setting, as a grasping target to be grasped by the grasping unit, a graspable member, among the plurality of graspable members, the set graspable attitude range of which is greater than a predetermined threshold value.Type: ApplicationFiled: September 28, 2010Publication date: March 31, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Keisuke Maehara, Hiroshi Miyagawa
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Patent number: 7487683Abstract: An endurance testing apparatus, which is for performing an endurance test of a contacting/separating portion in which a first member and a second member repeats contacting with and separating from each other, has a contact load generator and a testing medium fluid supply means. The contact load generator reciprocates the second member relative to the first member to generate a contact load acting between the first member and the second member repeatedly. The testing medium fluid supply means supplies a testing medium fluid to the contacting/separating portion to expose the first member and the second member to the testing medium fluid.Type: GrantFiled: March 30, 2006Date of Patent: February 10, 2009Assignees: Denso Corporation, Toyota Tsusho CorporationInventors: Masaaki Kato, Maiko Futamura, Hiroshi Miyagawa
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Patent number: 7453141Abstract: A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an opening portion of the board and electrically connected to the corresponding plane; at least one bonding pattern which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion; and a second external connection portion which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane, respectively, through a through-hole conductor portion formed in the board.Type: GrantFiled: February 15, 2006Date of Patent: November 18, 2008Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hiroshi Miyagawa, Mitsuhiro Otagiri
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Publication number: 20080116079Abstract: When a wiring pattern is formed on a wiring board utilizing electroplating, an unnecessary portion is removed by proceeding as follows. First electroless plating layers are formed on both sides of an insulating substrate, which are covered with metallic foils in advance. On the first electroplating layers, wiring patterns are formed by etching so as not to extend to the end edge of the substrate. Then, a plating resist pattern is formed so that only a predetermined portion of the wiring patterns is exposed and a second electroplating layer is formed on the predetermined portion of the wiring patterns by supplying electric power from second electroless plating layers. Finally, the plating resist pattern and the second electroless plating layers are removed, and a solder resist is formed so that predetermined portions of the wiring patterns are exposed.Type: ApplicationFiled: December 28, 2007Publication date: May 22, 2008Applicant: Shinko Electric Industries Co., Ltd.Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
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Patent number: 7347949Abstract: A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern.Type: GrantFiled: June 7, 2005Date of Patent: March 25, 2008Assignee: Shinko Electric Industries, Co., Ltd.Inventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
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Publication number: 20060219024Abstract: An endurance testing apparatus, which is for performing an endurance test of a contacting/separating portion in which a first member and a second member repeats contacting with and separating from each other, has a contact load generator and a testing medium fluid supply means. The contact load generator reciprocates the second member relative to the first member to generate a contact load acting between the first member and the second member repeatedly. The testing medium fluid supply means supplies a testing medium fluid to the contacting/separating portion to expose the first member and the second member to the testing medium fluid.Type: ApplicationFiled: March 30, 2006Publication date: October 5, 2006Applicants: Denso Corporation, Toyota Tsusho CorporationInventors: Masaaki Kato, Maiko Futamura, Hiroshi Miyagawa
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Publication number: 20060189178Abstract: A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an opening portion of the board and electrically connected to the corresponding plane; at least one bonding pattern which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion; and a second external connection portion which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane, respectively, through a through-hole conductor portion formed in the board.Type: ApplicationFiled: February 15, 2006Publication date: August 24, 2006Applicant: Shinko Electric Industries Co., Ltd.Inventors: Hiroshi Miyagawa, Mitsuhiro Otagiri
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Publication number: 20060016779Abstract: A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern.Type: ApplicationFiled: June 7, 2005Publication date: January 26, 2006Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTDInventors: Hiroshi Miyagawa, Takaaki Karasawa, Hideyuki Wakabayashi
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Publication number: 20030121366Abstract: A process comprises a separating process to mechanically separate refuse secondary batteries and to separate them into a separated cathode material and a separated anode material, and a process to recover valent metals from the separated anode and the separated cathode material separated in the separating process is disclosed.Type: ApplicationFiled: September 11, 2002Publication date: July 3, 2003Inventors: Hironori Tateiwa, Minoru Kahata, Hiroshi Miyagawa, Ryoichi Shirai
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Patent number: 6502187Abstract: The present invention provides a pipelined computer which processes variable-length data without using branch instructions for speedy execution of a variable-length data-handling software instruction. Upon receiving a variable-length data-handling instruction from an instruction supply unit 1, an instruction division unit 2 divides the instruction into a plurality of derived micro instructions that handle fixed-length data. A reservation station 5 sends the derived micro instructions to an execution unit 6 and a redundant instruction detection unit 9 in a sequence in which the derived micro instructions were generated during the division. The redundant instruction detection unit 9 monitors the remaining derived micro instructions. An instruction deletion control unit 8 deletes redundant micro instructions in the reservation station 5. An instruction end operation unit 7 sets the state of the redundant derived micro instructions in the reorder buffer 4 to “execution completed state”.Type: GrantFiled: November 15, 1999Date of Patent: December 31, 2002Assignee: NEC CorporationInventor: Hiroshi Miyagawa
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Publication number: 20020124691Abstract: A process comprises a separating process to mechanically separate refuse secondary batteries and to separate them into a separated cathode material and a separated anode material, and a process to recover valent metals from the separated anode and the separated cathode material separated in the separating process is disclosed.Type: ApplicationFiled: March 4, 2002Publication date: September 12, 2002Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Hironori Tateiwa, Minoru Kahata, Hiroshi Miyagawa, Ryoichi Shirai
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Patent number: 6110755Abstract: A method for producing semiconductor devices by mounting semiconductor chips 12 on a substrate 20 and resin-encapsulated the same is provided, wherein a plurality of semiconductor devices having a high reliability are simultaneously and efficiently obtained from a single large-sized substrate, comprising the steps of mounting a plurality of semiconductor chips 12 on the large-sized substrate 20 in correspondence to a plurality of unit substrates 20a formed thereon; resin-encapsulating the semiconductor chips 12 by filling a encapsulating resin 16 in the inside of the outer peripheral edge of the large-sized substrate 20; and cutting the large-sized substrate 20 thus resin-encapsulated together with the encapsulating resin 16 into individual unit substrates to obtain a plurality of resin-encapsulated semiconductor devices.Type: GrantFiled: December 2, 1998Date of Patent: August 29, 2000Assignee: Shinko Electric Industries Co., Ltd.Inventors: Shigetsugu Muramatsu, Hiroshi Miyagawa
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Patent number: 5795673Abstract: A method of recovering useful materials from spent secondary batteries for electric vehicles according to the present invention involves a step of cutting a spent secondary battery for electric vehicles into a cover portion and a housing portion, a step of taking out and separating electrode plates from the housing portion, and a step of crushing the electrode plates and dividing the crushed materials into negative electrode substrate, positive electrode plates including a nickel compound and active materials, and separators through the use of pneumatically separating and sieving.Type: GrantFiled: September 16, 1996Date of Patent: August 18, 1998Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Hiroshi Miyagawa, Ryouichi Shirai
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Patent number: 5789095Abstract: The method of recovering useful materials from spent secondary batteries for electric vehicles comprises a step of separating spent secondary batteries for electric vehicles into a cover portion and a housing portion, a step of taking out electrode plates to separate them from the housing portion, a step of disassembling electrode plates into positive electrode plates and negative electrode plates, and a step of cutting the pole section so that the positive electrode plates can be separated from the negative electrode plates.Type: GrantFiled: September 16, 1996Date of Patent: August 4, 1998Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Hiroshi Miyagawa, Ryouichi Shirai
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Patent number: 4911298Abstract: A cassette storage container for covering a tape cassette, the container having a case body formed by a plastic resin sheet of transparent or semi-transparent material which comprises a multiplicity of projections in the form of ribs or verrucae formed on the inner face of the case body for providing a rough surface and an opaque layer formed on the outer surface of the case body, the area of the opaque layer being at most covering the entire surface area of the outer surface of the container except for at least the portion corresponding to a label of the tape cassette put in its stored position in the container so as to define a display window for displaying the label of the tape cassette.Type: GrantFiled: March 31, 1989Date of Patent: March 27, 1990Assignee: Hitachi Maxell, Ltd.Inventors: Hiroshi Miyagawa, Isamu Arai
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Patent number: 4585578Abstract: Described is an electrically conductive plastic complex material composed of a starting or synthetic base resin material with addition and mixture thereto of electrically conductive carbon black and inorganic filler. According to the invention, the inorganic filler is a graphite or preferably doped graphite.Type: GrantFiled: November 15, 1983Date of Patent: April 29, 1986Assignee: Kabushiki Kaisha MeidenshaInventors: Kunio Yonahara, Hiroshi Miyagawa, Shingo Aimoto
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Patent number: 4482790Abstract: A vacuum interrupter (10) has a metallic member (11, 13) for a vacuum envelope and an insulating member (12a, 12b) for the vacuum envelope, made of unglazed insulating ceramics. A pair of separable stationary and movable contacts (24, 29) contained in the vacuum envelope. A movable lead rod (16) is rigidly secured to a movable disc-shaped electrode (30) which has the movable contact (29), extending outwardly of the vacuum envelope. Bellows secured in a vacuum-tight manner to the rod (16) and to the vacuum envelope. An impervious insulating film is coated adhesively on atmospheric-side surfaces of the insulating member (12a, 12b) and of the vacuum-tightly connected portion and vicinity thereof between the insulating member (12a, 12b) and metallic member (11, 13) for the vacuum envelope.Type: GrantFiled: December 10, 1982Date of Patent: November 13, 1984Assignee: Kabushiki Kaisha MeidenshaInventors: Hiroshi Miyagawa, Masayuki Kano
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Patent number: 4465991Abstract: An operating device for effecting opening and closing operation of a vacuum interrupter with an electromagnet incorporated therein comprises a supporting resin block (4) for supporting a vacuum interrupter, a first pair of poles (47a) and a second pair of poles (47b), both extending along the outer circumferential surface of the supporting resin block (4), the length of the first pair being longer than that of the second pair. The operating device further comprises a mounting plate (49) of magnetic material directly connected to the first pair and connected to the second pair through connecting rod means, and an electromagnet (52, 56) fastened to the mounting plate (49), supported by the first and second pairs and connecting rod means (57). Thus, the supporting arrangement for supporting a vacuum interrupter not only serves as a mechanically supporting member, but also does a magnetic path defining member.Type: GrantFiled: April 8, 1983Date of Patent: August 14, 1984Assignee: Kabushiki Kaisha MeidenshaInventors: Shinzo Sakuma, Hifumi Yanagisawa, Kazuo Tokuhata, Hiroshi Miyagawa
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Patent number: 4434331Abstract: A vacuum vessel 17 comprises a bell shaped metallic casing 20, and an insulating circular end plate 21 hermetically brazed to the opening end of the metallic casing 20. A vacuum interrupter 2 is constituted by aligning a stationary contact rod 27 with a movable contact rod 25, each having an electrical contact 18, 19 within the vessel so that the latter is in contact with the former or away therefrom. A vacuum power interrupting device comprises an insulating block 4 mounted on the vacuum interrupter so that the outer surface of the insulating end plate 21 attached to the opening end of the vacuum interrupter is pressed onto the insulating block through a sealing member 11.Type: GrantFiled: January 30, 1981Date of Patent: February 28, 1984Assignees: Kabushiki Kaisha Meidensha, Kabushiki Kaisha GEMV ACInventors: Shinzo Sakuma, Hifumi Yanagisawa, Kazuo Tokuhata, Hiroshi Miyagawa
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Patent number: 4429197Abstract: A vacuum vessel 7 comprises a bell shaped metal casing 5, and an insulating circular end plate 6 hermetically brazed to the opening end of the metal casing. A vacuum interrupter 3 is constituted by aligning a stationary contact rod 20 with a movable contact rod 17, each having an electrical contact 8,9, within the vacuum vessel so that the latter is in contact with the former or away therefrom. A vacuum power interrupting device comprises a disk-shaped resin supporting block 4 in which the vacuum interrupter is molded. A stationary electrode 23 is connected to a stationary contact rod 20 disposed within the vacuum interrupter. A tubular insulating barrier is integrally formed with the supporting block so as to surround the stationary electrode.Type: GrantFiled: December 12, 1980Date of Patent: January 31, 1984Assignees: Kabushiki Kaisha Meidensha, Kabushiki Kaisha GemvacInventors: Shinzo Sakuma, Hifumi Yanagisawa, Kazuo Tokuhata, Hiroshi Miyagawa