Patents by Inventor Hiroshi Miyashiro

Hiroshi Miyashiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11225990
    Abstract: A welding method includes overlapping a thin metal plate with a base material, and setting an annular welding schedule line on a welding schedule portion of the thin metal plate; forming a welding line such that a continuous irradiation with a laser light from a fiber laser is performed while moving the laser light along the welding schedule line, and while vibrating the laser light across the welding schedule line; and setting a length of the welding line such that an entire inside of the welding schedule line is welded.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: January 18, 2022
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Patent number: 10744591
    Abstract: An ultrasonic bonding jig includes: a base; and a protrusion portion which has a protrusion portion end surface approximately parallel to the base and which has a pair of first walls, the pair of first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusion portion end surface. A bonding structure includes a bonding portion of a metal plate and a base material. The bonding portion has a recessed portion with a closed bottom on a surface of the metal plate, and the recessed portion has a pair of walls approximately perpendicular to the surface of the metal plate.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: August 18, 2020
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Publication number: 20200072266
    Abstract: In an exemplary welding method for joining at least a first member and a second member made of metals by fiber laser welding, the fiber laser welding forms welding lines 16, 19 by sequentially irradiating a laser light L while moving along annular scheduled welding lines 13, 18 and vibrating across the scheduled welding lines 13, 18, whereby the resultant metal joining structure secures a welding area of the metal members and has high strength and durability.
    Type: Application
    Filed: May 14, 2018
    Publication date: March 5, 2020
    Inventors: Hiroshi MIYASHIRO, Norimitsu AKIYOSHI, Makoto MITSUYASU
  • Patent number: 10391584
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; and a planar portion among protrusions formed among base ends of the protrusions. The protrusions have side surfaces of tapered surfaces, the side surfaces being positioned in a vibration direction. At the tapered surfaces, an inclination of a tangent at distal ends of the protrusions, with respect to the vibration direction, is larger than an inclination of a tangent at the base ends of the protrusions, with respect to the vibration direction.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 27, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Patent number: 10232464
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: March 19, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Publication number: 20190054562
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
    Type: Application
    Filed: March 27, 2018
    Publication date: February 21, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
  • Publication number: 20190047079
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; and a planar portion among protrusions formed among base ends of the protrusions. The protrusions have side surfaces of tapered surfaces, the side surfaces being positioned in a vibration direction. At the tapered surfaces, an inclination of a tangent at distal ends of the protrusions, with respect to the vibration direction, is larger than an inclination of a tangent at the base ends of the protrusions, with respect to the vibration direction.
    Type: Application
    Filed: March 23, 2018
    Publication date: February 14, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
  • Publication number: 20190009357
    Abstract: An ultrasonic bonding jig includes: a base; and a protrusion portion which has a protrusion portion end surface approximately parallel to the base and which has a pair of first walls, the pair of first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusion portion end surface. A bonding structure includes a bonding portion of a metal plate and a base material. The bonding portion has a recessed portion with a closed bottom on a surface of the metal plate, and the recessed portion has a pair of walls approximately perpendicular to the surface of the metal plate.
    Type: Application
    Filed: March 16, 2018
    Publication date: January 10, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
  • Publication number: 20180369953
    Abstract: An ultrasonic bonding method includes: stacking a metal plate and a base material; pressing the metal plate to the base material by an ultrasonic bonding jig; forming a plurality of recessed portions, a flat portion among recessed portions, and an annular flat portion on the metal plate by the ultrasonic bonding jig, the flat portion among recessed portions being disposed among the plurality of recessed portions, the annular flat portion surrounding the plurality of recessed portions; and vibrating the ultrasonic bonding jig while the ultrasonic bonding jig presses the metal plate.
    Type: Application
    Filed: March 16, 2018
    Publication date: December 27, 2018
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Shuhei KOYANO, Yoichi SURUGA
  • Publication number: 20180335060
    Abstract: A welding method includes overlapping a thin metal plate with a base material, and setting an annular welding schedule line on a welding schedule portion of the thin metal plate; forming a welding line such that a continuous irradiation with a laser light from a fiber laser is performed while moving the laser light along the welding schedule line, and while vibrating the laser light across the welding schedule line; and setting a length of the welding line such that an entire inside of the welding schedule line is welded.
    Type: Application
    Filed: January 22, 2018
    Publication date: November 22, 2018
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
  • Patent number: 4066298
    Abstract: A capsule having a cylindrical shell for containing goods to be transported, and a cover member adaped to be fitted over one end of the shell. The cover member is made from a flexible material and is provided on the leading end of the shell. The provision of the cover member of a flexible material avoids damage to or deformation of the capsule which would otherwise be caused by collision against the preceding or the next following capsule, and reduces the resistance offered to the movement of the capsule by the tubular passageway through which the capsule is moved.
    Type: Grant
    Filed: August 13, 1976
    Date of Patent: January 3, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Masakatsu Sakamoto, Syosaku Watanabe, Takafumi Karino, Junichi Yazu, Kouichi Takashima, Hiroshi Miyashiro, Takeo Takagi, Takao Konno