Patents by Inventor Hiroshi Moriuma

Hiroshi Moriuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5429904
    Abstract: A positive resist composition comprising a quinonediazide compound and an alkali-soluble resin containing resin (A) obtainable through a condensation reaction of at least one compound represented by the general formula (I): ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 independently of one another each represent a hydrogen atom or an alkyl or alkoxy group having 1-4 carbon atoms and k represents 1 or 2, at least one polyphenol compound represented by the general formula ( II ): ##STR2## wherein R.sub.4 ' to R.sub.6 ' each represent a hydrogen atom or an alkyl or alkoxy group and n represents 1 or 2, with an aldehyde compound. This positive resist composition is excellent in properties such as profile, resolution, heat resistance, etc.
    Type: Grant
    Filed: May 27, 1993
    Date of Patent: July 4, 1995
    Assignee: Sumitomo Chemical Company, Ltd.
    Inventors: Kyoko Nagase, Haruyoshi Osaki, Kazuhiko Hashimoto, Hiroshi Moriuma
  • Patent number: 5424167
    Abstract: A positive type resist composition comprising an alkali-soluble novolac resin, a quinonediazide compound and a compound represented by general formula (I): ##STR1## wherein Y.sub.1 to Y.sub.10 each represent a hydrogen atom, a hydroxyl group or an alkyl group, provided that at least one of Y.sub.1 to Y.sub.10 is a hydroxyl group, and X represents one of the groups represented by the following formulas: ##STR2## wherein R.sub.1 to R.sub.3 independently of one another each represent a hydrogen atom or an alkyl group, provided that, as measured by GPC, the pattern area of the component having a molecular weight, converted to polystyrene, 1,000 or below in the alkali-soluble novolac resin is 25% or less based on the total pattern area of the novolac resin from which the pattern area of the unreacted phenol compound is excepted. This positive type resist composition is excellent in the balance between performances such as sensitivity, resolution, heat resistance and adhesive property.
    Type: Grant
    Filed: February 25, 1993
    Date of Patent: June 13, 1995
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Yasunori Uetani, Hiroshi Moriuma
  • Patent number: 5407780
    Abstract: A positive resist composition containing a 1,2-quinone diazide compound and an alkali-soluble resin which constitutes a resin (I) obtainable through a condensation reaction of a phenol mixture containing m-cresol and 2-tert.-butyl-5-methylphenol with an aldehyde., which has well balanced sensitivity, resolution and heat resistance properties.
    Type: Grant
    Filed: May 11, 1994
    Date of Patent: April 18, 1995
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Takeshi Hioki, Seiko Kurio, Yasunori Uetani, Yasunori Doi, Hiroshi Moriuma
  • Patent number: 5326665
    Abstract: A positive type resist composition comprising an alkali-soluble resin and a quinonediazide compound, wherein the alkali-soluble resin containing resin (A) is obtainable through a condensation reaction with at least one phenol compound represented by the following general formula (I): ##STR1## wherein R.sub.1 to R.sub.3 independently of one another each represent a hydrogen atom or an alkyl or alkoxy group having 1-4 carbon atoms and k represents 1 or 2, at least one compound represented by the following general formula (II): ##STR2## wherein R.sub.4 represents a hydrogen atom, an alkyl group having 1-4 carbon atoms or a phenyl group, R.sub.5 to R.sub.7 independently of one another each represent a hydrogen atom or an alkyl or alkoxy group having 1-4 carbon atoms and n represents 1 or 2, and an aldehyde compound. This composition is excellent in the balance between performances such as sensitivity, heat resistance and profile, and is free from scum.
    Type: Grant
    Filed: March 1, 1993
    Date of Patent: July 5, 1994
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Haruyoshi Osaki, Hiroshi Moriuma, Yasunori Uetani
  • Patent number: 5275910
    Abstract: A positive radiation-sensitive resist composition comprising an alkali-soluble resin, a radiation-sensitive ingredient and a phenol compound represented by the general formula (I): ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 independently of one another each represent a hydrogen atom, an alkyl group or an alkoxy group and n represents 1, 2 or 3.
    Type: Grant
    Filed: October 14, 1992
    Date of Patent: January 4, 1994
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroshi Moriuma, Hirotoshi Nakanishi, Yasunori Uetani
  • Patent number: 5188920
    Abstract: A positive resist composition comprising a radiation-sensitive component and an alkali-soluble resin and a phenol compound of the formula: ##STR1## wherein R is a hydrogen atom, a lower alkyl group or a phenyl group, R' is an alkyl group or an alkoxy group, and n is a number of 0 to 3, which has well balanced good properties such as sensitivity, resolution, heat resistance and adhesiveness.
    Type: Grant
    Filed: June 10, 1991
    Date of Patent: February 23, 1993
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroshi Moriuma, Haruyoshi Osaki, Takeshi Hioki, Yasunori Uetani