Patents by Inventor Hiroshi Nagasawa

Hiroshi Nagasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070141251
    Abstract: A solution containing a metal component of composite ultrafine metal particles each having a core substantially made of metal component and a covering layer made of an organic compound chemically bonded to the core having an average diameter ranging from 1 to 10 nm, uniformly dispersed in a solvent, forms a thin metal film on the surface of a transfer sheet, after which the transfer sheet is thermally decomposed to transfer the thin metal film to a substrate.
    Type: Application
    Filed: February 16, 2007
    Publication date: June 21, 2007
    Applicant: EBARA CORPORATION
    Inventors: Akira Fukunaga, Hiroshi Nagasawa, Takao Kato
  • Publication number: 20070132761
    Abstract: It is possible to easily set the operation of a spectrum analyzer. The spectrum analyzer receives a signal to be measured. The spectrum analyzer includes a display device (28) having a display screen for displaying the signal to be measured with a vertical axis representing a measurement value (power) of the signal to be measured and a horizontal axis representing frequency. Furthermore, a touch panel is provided on the display screen of the display device (28). When a user of the spectrum analyzer touches a point 32a (f0, P0) on the display screen, peak search is performed to detect a maximal value of the measurement value of the signal to be measured in a range of the vicinity of the touched point (frequency f1 to f2, power P1 to P2) (wherein f1=f0??f, f2=f0+?f, P1=P0??P, P2=P0+?P). Thus, it is possible to easily set the range for performing the peak search.
    Type: Application
    Filed: May 12, 2004
    Publication date: June 14, 2007
    Applicant: ADVANTEST CORPORATION
    Inventors: Yoshihide Maruyama, Hiroshi Nagasawa, Tsutomu Kumazawa, Hiroaki Takaoku
  • Publication number: 20070135476
    Abstract: The present invention provides processes for producing a compound (5) based on the following reaction scheme.
    Type: Application
    Filed: November 12, 2004
    Publication date: June 14, 2007
    Applicant: Daiichi Pharmaceutical Co., Ltd.
    Inventors: Hiroshi Nagasawa, Koji Sato, Tsutomu Yagi, Yasuo Kitani
  • Patent number: 7179503
    Abstract: A solution containing a metal component of composite ultrafine metal particles each having a core substantially made of metal component and a covering layer made of an organic compound chemically bonded to the core having an average diameter ranging from 1 to 10 nm, uniformly dispersed in a solvent, forms a thin metal film on the surface of a transfer sheet, after which the transfer sheet, after which the transfer sheet is thermally decomposed to transfer the thin metal film to a substrate.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: February 20, 2007
    Assignee: Ebara Corporation
    Inventors: Akira Fukunaga, Hiroshi Nagasawa, Takao Kato
  • Patent number: 7130742
    Abstract: Tour guide contents utilized by a user at a travel destination consist of guide information including POI information, map data and the like, and user information including memoranda written by the user. The user can access a contents server from a user terminal, and is able to customize at the contents server the tour guide contents to be utilized at a travel destination. Customized tour guide contents are stored into a memory medium at a business terminal, and the memory medium is installed in an electronic guide apparatus, such as at an airport counter. The user receives the electronic guide apparatus and a GPS on a rental basis at the airport counter, and takes them to the travel destination. Then, the user is able to utilize the tour guide contents customized for the user at the travel destination.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: October 31, 2006
    Assignee: Sony Corporation
    Inventors: Naoshi Kobuya, Toru Masano, Motoya Itako, Hiroshi Nagasawa, Atsushi Noda
  • Publication number: 20060130316
    Abstract: The present invention provides an improved magnetic disk drive manufacturing method that is to be employed during an interval between magnetic disk drive assembly completion and shipment. In one embodiment, a magnetic disk drive has an interface connector. The magnetic disk drive is retained by a shock absorber so that the interface connector is exposed. A testing side connector mounted on a base plate is connected to the interface connector of the magnetic disk drive that is retained by the shock absorber. A host apparatus transfers a test/adjustment program to the magnetic disk drive via the testing side connector. The magnetic disk drive executes the test/adjustment program.
    Type: Application
    Filed: December 19, 2005
    Publication date: June 22, 2006
    Applicant: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Makoto Takase, Keiichiroh Kai, Shigemi Suganuma, Hiroshi Nagasawa
  • Patent number: 7016303
    Abstract: In a network of an IEEE 1394 system or the like, a data transmission rate can be properly controlled by an apparatus to receive the transmitted data. An apparatus for transmitting data is set as a first apparatus and each of one or more apparatus for receiving the transmitted data from the first apparatus is set as an external apparatus. The number of the external apparatuses to which the data are to be transmitted is indicated. A transmission speed is varied upon receipt of a control command from one of the external apparatuses to which a control right is given. The control right is returned when the control command is not given from the external apparatuses to which the data are transmitted for a predetermined period of time. The control right is returned to the first apparatus if there are a plurality of apparatuses to receive the data from the first apparatus.
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: March 21, 2006
    Assignee: Sony Corporation
    Inventors: Ichiro Sakamoto, Hiraku Inoue, Hiroshi Nagasawa
  • Patent number: 6972256
    Abstract: The present invention relates to a method of and an apparatus for forming a thin metal film of copper, silver, or the like on a surface of a semiconductor or another substrate. A method of forming a thin metal film, comprises preparing a dispersed liquid having a metal-containing organic compound dispersed in a predetermined solvent, coating the dispersed liquid on a surface of a substrate and evaporating the solvent to form a coating layer, and applying an energy beam to the coating layer to decompose away an organic substance contained in the coating layer in an area irradiated with the energy beam and bond metal contained in the coating layer.According to the present invention, it is possible to form a thin metal film of good quality efficiently and stably. The thin metal film used as metal interconnects in highly integrated semiconductor circuits contributes to the progress of a process of fabricating semiconductor devices.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: December 6, 2005
    Assignee: Ebara Corporation
    Inventors: Akira Fukunaga, Kuniaki Horie, Naoaki Ogure, Takao Kato, Hiroshi Nagasawa, Shinji Kajita, Makoto Kubota
  • Publication number: 20050222765
    Abstract: Tour guide contents utilized by a user at a travel destination consist of guide information including POI information, map data and the like, and user information including memoranda written by the user. The user can access a contents server from a user terminal, and is able to customize at the contents server the tour guide contents to be utilized at a travel destination. Customized tour guide contents are stored into a memory medium at a business terminal, and the memory medium is installed in an electronic guide apparatus, such as at an airport counter. The user receives the electronic guide apparatus and a GPS on a rental basis at the airport counter, and takes them to the travel destination. Then, the user is able to utilize the tour guide contents customized for the user at the travel destination.
    Type: Application
    Filed: June 16, 2005
    Publication date: October 6, 2005
    Applicant: Sony Corporation
    Inventors: Naoshi Kobuya, Toru Masano, Motoya Itako, Hiroshi Nagasawa, Atsushi Noda
  • Publication number: 20050191699
    Abstract: A reaction probe chip which is prepared by loading a reactive probe on fine pieces of carrier such as particles, tile-like plates and then arraying and immobilizing the reactive probe-loaded carrier on a base material. The carrier fine pieces such as particles, tile-like plates and the like are porous or have a reactive surface, and the base material is preferably a thin inorganic plate or a thin organic plate is disclosed. The inorganic base material is preferably a glass slide or silicon wafer, and the organic base material is preferably a polyester film or polyethylene film. In case the porous carrier pieces are used, the reactivity of the inner surfaces of the porous carrier pores should be maintained during array or immobilization process of the reactive probe-loaded carrier.
    Type: Application
    Filed: May 2, 2005
    Publication date: September 1, 2005
    Applicant: Ebara Corporation
    Inventors: Hiroshi Nagasawa, Akira Fukunaga, Masayoshi Hirose
  • Patent number: 6897021
    Abstract: A reaction probe chip which is prepared by loading a reactive probe on fine pieces of carrier such as particles, tile-like plates and then arraying and immobilizing the reactive probe-loaded carrier on a base material. The carrier fine pieces such as particles, tile-like plates and the like are porous or have a reactive surface, and the base material is preferably a thin inorganic plate or a thin organic plate is disclosed. The inorganic base material is preferably a glass slide or silicon wafer, and the organic base material is preferably a polyester film or polyethylene film. In case the porous carrier pieces are used, the reactivity of the inner surfaces of the porous carrier pores should be maintained during array or immobilization process of the reactive probe-loaded carrier.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: May 24, 2005
    Assignee: Ebara Corporation
    Inventors: Hiroshi Nagasawa, Akira Fukunaga, Masayoshi Hirose
  • Patent number: 6871773
    Abstract: The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: March 29, 2005
    Assignee: Ebara Corp.
    Inventors: Akira Fukunaga, Hiroshi Nagasawa, Kaori Kagoshima, Makiko Emoto
  • Patent number: 6874045
    Abstract: A digital signal processor receives 1-bit audio signals acquired by sigma modulation and sent over a predetermined transmission line and makes a changeover between the audio signal and a mute pattern includes an IEEE 1394 interface. The IEEE 1394 interface receives an isochronous packet sent over an IEEE 1394-formatted transmission line, extracts music data from the packet, supplies the music data to a DRAM, monitors the amount of data stored in the DRAM, reads a 1-bit digital signal or generates a mute pattern such as a 9-6 pattern, and makes a changeover between the 1-bit digital signal read from the DRAM and mute pattern while fading them. The digital signal processor further includes a D-A converter to convert the 1-bit digital signal supplied from the IEEE 1394 interface into an analog signal.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: March 29, 2005
    Assignee: Sony Corporation
    Inventors: Hiroshi Nagasawa, Kenji Shiba, Tetsuya Aoki
  • Publication number: 20050003275
    Abstract: The present invention relates to an ionic conductor and a method of producing the ionic conductor, and more particularly to an ionic conductor for use in an ionics element such as a diaphragm and an ionics instrument such as an electrolysis apparatus, and a method of producing such an ionic conductor. The ionic conductor according to the present invention includes a porous body 1 which has a plurality of continuous pores 1a passing through the porous body 1, and ionizable functional groups 2 attached to surfaces of the continuous pores 1a. The porous body 1 comprises a porous ceramics such as a porous glass, a porous alumina, or a porous mullite.
    Type: Application
    Filed: February 2, 2004
    Publication date: January 6, 2005
    Applicant: EBARA CORPORATION
    Inventor: Hiroshi Nagasawa
  • Publication number: 20050003556
    Abstract: The present invention discloses affinity reaction probe beads having a structure comprising probe molecules immobilized on porous bead carriers provided with one or more individual identification signals among individual identification signals including optical signals such as digital signals using optical graphics, for example, bar codes or dot matrix bar codes, and color signals based on color information; and radio or electronic signals which issue individual information, such as IC tags, or tuning circuits or oscillation circuits for radio waves or electricity, a method for producing the affinity reaction probe beads, and an analyte detection system using the affinity reaction probe beads. By using the affinity reaction probe beads, the invention provides a reaction detection system which can be utilized for various physiological function diagnoses such as a diagnosis of single-nucleotide polymorphism (SNPs).
    Type: Application
    Filed: October 31, 2002
    Publication date: January 6, 2005
    Inventors: Hiroshi Nagasawa, Masayoshi Hirose, Akira Fukunaga
  • Publication number: 20040245648
    Abstract: There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high-temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.
    Type: Application
    Filed: July 30, 2004
    Publication date: December 9, 2004
    Inventors: Hiroshi Nagasawa, Kaori Kagoshima, Naoaki Ogure, Masayoshi Hirose, Yusuke Chikamori
  • Publication number: 20040197787
    Abstract: Affinity reaction probe detection/analysis chips each comprising a retainer ring that is marked with individual identifying signals and which has a through-hole filled with or retaining a carrier having probe molecules fixed thereto. The carrier having probe molecules fixed thereto is preferably a porous membrane or nonwoven fabric stretched across the carrier to close the hole. The individual identifying signals may be written according to either a barcode system or an electronic recognition system.
    Type: Application
    Filed: May 19, 2004
    Publication date: October 7, 2004
    Inventor: Hiroshi Nagasawa
  • Patent number: 6800188
    Abstract: A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this copper plating bath are disclosed. A copper plating bath capable of providing highly reliable copper plating on a substrate such as a silicone wafer semiconductor substrate or printed board having minute circuit patterns and small holes such as blind via-holes, through-holes, and the like, and a method of copper plating using the copper plating bath can be provided.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: October 5, 2004
    Assignees: Ebara-Udylite Co., Ltd., Ebara Corporation
    Inventors: Hideki Hagiwara, Ryoichi Kimizuka, Yoshitaka Terashima, Megumi Maruyama, Takashi Miyake, Hiroshi Nagasawa, Tsuyoshi Sahoda, Seiji Iimura
  • Publication number: 20040173666
    Abstract: The present invention relates to composite metallic ultrafine particles which have excellent dispersion stability and can be produced on an industrial scale, and a process for producing the same, and a method and an apparatus for forming an interconnection with use of the same. A surface of a core metal produced from a metallic salt, a metallic oxide, or a metallic hydroxide and having a particle diameter of 1 to 100 nm is covered with an organic compound including a functional group having chemisorption capability onto the surface of the core metal.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 9, 2004
    Applicant: EBARA CORPORATION
    Inventors: Akira Fukunaga, Hiroshi Nagasawa, Kaori Kagoshima, Makiko Emoto
  • Publication number: 20040163948
    Abstract: A plating apparatus comprises a plating unit having a plating bath for holding a plating liquid therein, and a plating liquid monitoring unit having a liquid chromatography device and an arithmetical unit. The liquid chromatography device serves to separate and quantify an additive in a sample of the plating liquid. The arithmetical unit serves to compare a quantified value of the additive with a given concentration predetermined for the additive and to produce an output signal representing the compared result. The plating apparatus further comprises an additive replenishing unit for adding a solution including the additive from an additive tank to the plating liquid in the plating bath based on the output signal from the arithmetical unit in the plating liquid monitoring unit.
    Type: Application
    Filed: February 24, 2004
    Publication date: August 26, 2004
    Inventors: Akira Fukunaga, Hiroshi Nagasawa