Abstract: Provided is an electrolytic solution that includes: an electrolyte containing lithium salt; and a nonaqueous solvent containing cyclic alkylene carbonate and methyl propionate, the electrolyte contains lithium salt other than LiPF6 in an amount of not less than 30 mol % with respect to a total amount of the lithium salt, and the nonaqueous solvent contains 75 volume % or more of the methyl propionate.

Abstract: A rectifier that is installed on a vehicle which includes a front shield at a front of a vehicle compartment, a hood in front of the front shield, a cowl between a back edge of the hood and a lower end of the front shield, and a fender on an outside of the hood and the cowl in a vehicle width direction, the rectifier including a rectifier member that is installed at a region on a side surface of the fender and adjacent to the back edge of the hood, and has a negative pressure generation part which causes an airflow created when the vehicle travels to generate a negative pressure backward. The front shield is shaped like a curved surface that projects toward a front of the vehicle. At least a part of the negative pressure generation part is disposed in front of a shield extension virtual curve.

Abstract: The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability and exhibits an excellent foaming property in a wide temperature range from low temperatures to high temperatures. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing acrylic monomer and an amide group-containing acrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing acrylic monomer and an ester group-containing acrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, and a weight ratio of the monomer A and the monomer B being 5:5 to 9:1.

Abstract: A vehicle such as an automobile includes: a vehicle body having an opening; an opening-closing member that closes the opening; a drive member that drives the opening-closing member so as to open and/or close the opening; a controller that controls the drive member to control the opening-closing member between a fully open position and a fully closed position; and an elastic member provided at a mating portion of the closed opening-closing member and the vehicle body and inserted between the closed opening-closing member and the vehicle body. The controller controls the drive member in a stopping state of the vehicle and opens the opening-closing member from the fully closed position so as to reduce a pressure acting upon the elastic member.

Abstract: A rectifier that is installed on a vehicle which includes a front shield at a front of a vehicle compartment, a hood in front of the front shield, a cowl between a back edge of the hood and a lower end of the front shield, and a fender on an outside of the hood and the cowl in a vehicle width direction, the rectifier including a rectifier member that is installed at a region on a side surface of the fender and adjacent to the back edge of the hood, and has a negative pressure generation part which causes an airflow created when the vehicle travels to generate a negative pressure backward. The front shield is shaped like a curved surface that projects toward a front of the vehicle. At least a part of the negative pressure generation part is disposed in front of a shield extension virtual curve.

Abstract: The present invention provides a thermally expandable microcapsule that maintains a high expansion ratio and hardly bursts and shrinks even at a high temperature, a foamable thermoplastic resin masterbatch and a foam molded product that are produced using the thermally expandable microcapsule, and a method for producing the thermally expandable microcapsule. The thermally expandable microcapsule comprises a volatile expansion agent included in a shell as a core agent and the shell formed of a polymer, the shell containing a thermosetting resin and a polymer obtainable by polymerization of a monomer composition containing a nitrile-type monomer and a monomer having a carboxyl group, and the thermosetting resin having no radical-polymerizable double bond and at least two functional groups reactive with a carboxyl group per molecule.

Abstract: A vehicle such as an automobile includes: a vehicle body having an opening; an opening-closing member that closes the opening; a drive member that drives the opening-closing member so as to open and/or close the opening; a controller that controls the drive member to control the opening-closing member between a fully open position and a fully closed position; and an elastic member provided at a mating portion of the closed opening-closing member and the vehicle body and inserted between the closed opening-closing member and the vehicle body. The controller controls the drive member in a stopping state of the vehicle and opens the opening-closing member from the fully closed position so as to reduce a pressure acting upon the elastic member.

Abstract: The present invention is a conductive particle having a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more. It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.

Abstract: The present invention provides a resin composition for foam molding which can achieve high expansion ratio and can significantly improve tactile impression and vibration damping properties of the foam molding to be obtained. The present invention relates to a resin composition for foam molding comprising: a thermally expandable microcapsule that includes a shell containing an epoxy resin and a core agent that is a volatile expansion agent encapsulated by the shell; a thermoplastic resin; and a curable compound having two or more functional groups each selected from the group consisting of a carboxy group, a hydroxy group, an amino group, an amido group, and an acid anhydride group in each molecule.

Abstract: The present invention provides a conductive fine particle capable of suppressing a blackening phenomenon during storage and thus providing high connection reliability; an anisotropic conductive material containing the conductive fine particle; and a connection structure. The conductive particle which has a base fine particle, and a conductive layer and a low-melting point metal layer that are formed in the stated order on the surface of the base fine particle, wherein the low-melting point metal layer has an arithmetic mean surface roughness of 50 nm or lower.

Abstract: The present invention aims to provide a foamable resin composition which enables foam molding at high expansion ratios and reduction of open cells. The present invention also aims to provide a foam molded body produced from the foamable resin composition. The present invention is a foamable resin composition including a thermoplastic resin, thermal expansion microcapsules, and a chemical foaming agent, wherein Ts is not lower than 120° C., Tmax is not lower than 190° C., and Ts-Tc is not lower than ?30° C. and not higher than 6° C., where Ts denotes a foaming starting temperature of the thermal expansion microcapsules, Tmax denotes a maximum foaming temperature of the thermal expansion microcapsules, and Tc denotes a decomposition temperature of the chemical foaming agent.

Abstract: The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability.

Abstract: The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability and exhibits an excellent foaming property in a wide temperature range from low temperatures to high temperatures. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing acrylic monomer and an amide group-containing acrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing acrylic monomer and an ester group-containing acrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, and a weight ratio of the monomer A and the monomer B being 5:5 to 9:1.

Abstract: The present invention provides a thermally expandable microcapsule that maintains a high expansion ratio and hardly bursts and shrinks even at a high temperature, a foamable thermoplastic resin masterbatch and a foam molded product that are produced using the thermally expandable microcapsule, and a method for producing the thermally expandable microcapsule. The thermally expandable microcapsule comprises a volatile expansion agent included in a shell as a core agent and the shell formed of a polymer, the shell containing a thermosetting resin and a polymer obtainable by polymerization of a monomer composition containing a nitrile-type monomer and a monomer having a carboxyl group, and the thermosetting resin having no radical-polymerizable double bond and at least two functional groups reactive with a carboxyl group per molecule.

Abstract: The present invention provides a conductive fine particle capable of suppressing a blackening phenomenon during storage and thus providing high connection reliability; an anisotropic conductive material containing the conductive fine particle; and a connection structure. The conductive particle which has a base fine particle, and a conductive layer and a low-melting point metal layer that are formed in the stated order on the surface of the base fine particle, wherein the low-melting point metal layer has an arithmetic mean surface roughness of 50 nm or lower.

Abstract: It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period. The present invention is a conductive particle comprising a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more.