Patents by Inventor Hiroshi Ohtani
Hiroshi Ohtani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133974Abstract: A battery monitoring system includes measurement devices and a battery monitoring device. Each measurement device measures a cell state of a corresponding cell constituting a battery. The battery monitoring device sequentially communicates, by using wireless communication, with the measurement devices during a communication period; and acquires state information indicating the cell state from each measurement device. In a case where transmitting a measurement instruction of the cell state to each of the measurement devices, the battery monitoring device transmits, to each of the plurality of measurement devices, a corresponding stand-by time interval such that measurement timings of the measurement devices synchronize, the stand-by time interval being a time interval from reception of the measurement instruction until the measurement timing.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Applicants: DENSO TEN Limited, DENSO CORPORATIONInventors: Hiroshi OHTANI, Shogo SHIGEMORI
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Publication number: 20180116187Abstract: It is intended to build a mechanism similar to that of the efficient purification system of rivers. By a pump unit, water circulation corresponding to the natural water circulation generated by water evaporation and rainfall is produced to generate a water flow in a biological filtration layer including a useful purification bacterial group. Thus, an extremely-high-efficient purification device as compared to a typical system and an aquarium integrally incorporating the device are provided. A purification device of the present invention includes a low-water-permeable biological filtration layer configured to purify water, and a pump unit configured to generate a water flow in the biological filtration layer. The biological filtration layer includes a useful purification bacterial group having grown bacteria for performing purification. The useful purification bacterial group is fixed in a bulk state.Type: ApplicationFiled: April 9, 2016Publication date: May 3, 2018Inventor: Hiroshi OHTANI
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Relay server, method of controlling operation of same, and program for controlling operation of same
Patent number: 8364783Abstract: Security is maintained in a data communication system while minimizing the frequency with which communication is carried out. A data transmitting server and a relay server communicate based upon https utilizing port 443 of a firewall. When query data is transmitted from the data transmitting server to the relay server, the relay server determines whether there is a data request from a mobile telephone within a fixed period of time. If there is a data request from the mobile telephone within the fixed period of time, the requested data is transmitted from the data transmitting server to the relay server in response to this data request. This requested data is transferred from the relay server to the mobile telephone.Type: GrantFiled: May 3, 2011Date of Patent: January 29, 2013Assignee: Fujifilm CorporationInventors: Shunichiro Nonaka, Hiroshi Ohtani -
RELAY SERVER, METHOD OF CONTROLLING OPERATION OF SAME, AND PROGRAM FOR CONTROLLING OPERATION OF SAME
Publication number: 20110276660Abstract: Security is maintained in a data communication system while minimizing the frequency with which communication is carried out. A data transmitting server and a relay server communicate based upon https utilizing port 443 of a firewall. When query data is transmitted from the data transmitting server to the relay server, the relay server determines whether there is a data request from a mobile telephone within a fixed period of time. If there is a data request from the mobile telephone within the fixed period of time, the requested data is transmitted from the data transmitting server to the relay server in response to this data request. This requested data is transferred from the relay server to the mobile telephone.Type: ApplicationFiled: May 3, 2011Publication date: November 10, 2011Applicant: Fujifilm CorporationInventors: Shunichiro NONAKA, Hiroshi Ohtani -
Publication number: 20110161317Abstract: A document retrieval system includes a document server and mobile phones. A user may enter search criteria on a search criteria input screen of the mobile phone and transmit them to the document server through a certain network, e.g. the Internet. The document server retrieves documents according to the search criteria and refers to a search record database to determine whether the retrieved documents have ever been searched for and flagged with marks. The document server weights the respective documents on the basis of the marks tagged to the document or those elements that match the search criteria, and metadata included in the marks. Depending on the weight, the documents are listed in the order from the most relevant to or useful for the user when sent back as a search result to the mobile phone.Type: ApplicationFiled: December 7, 2010Publication date: June 30, 2011Applicant: FUJIFILM CorporationInventor: Hiroshi Ohtani
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Publication number: 20110078784Abstract: A VPN management server transmits a seed to a client computer and VPN server. The client computer generates a VPN password from the seed using a prescribed algorithm and transmits the generated VPN password to the VPN server. The VPN server generates a password from the seed using an algorithm identical with the prescribed algorithm in the client computer. If the VPN password transmitted from the client computer and the VPN password generated in the VPN server match, the VPN server allows utilization of the VPN by reason of the fact that the client computer has been authenticated. Even if leakage of the seed occurs, the VPN password will not be generated unless the algorithm is analyzed. The result is enhanced security.Type: ApplicationFiled: September 29, 2010Publication date: March 31, 2011Applicant: FUJIFILM CorporationInventor: Hiroshi OHTANI
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Patent number: 7223339Abstract: This invention provides an inexpensive hollow-fiber membrane module that can prevent diaphragms from peeling or coming off from the cylindrical casing. The invention includes a hollow-fiber membrane module, comprising a cylindrical casing having an inlet port for the treating liquid at one end and an outlet port for the treating liquid at the other end, a hollow-fiber membrane bundle contained in the cylindrical casing, potting layers for fixing the hollow-fiber membrane bundle to the inner wall of the cylindrical casing at both the ends of the hollow-fiber membrane bundle, a header having an outlet port for the liquid undergoing treatment provided at one end of the cylindrical casing, and a header having an inlet port for the liquid undergoing treatment provided at the other end of the cylindrical casing, wherein baffle cylinders having slits extending in the direction at an angle to the axis of the cylindrical casing are fitted in the potting layers.Type: GrantFiled: October 9, 2003Date of Patent: May 29, 2007Assignee: Toray Industries, Inc.Inventors: Osamu Nakamatsu, Hiroshi Ohtani, Ichirou Kumo
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Patent number: 6743392Abstract: An apparatus and method for producing a spread fiber bundle using a fiber-spreading device composed of a group of rollers and a base body reciprocated to be repetitively brought into contact with and kept away from a running fiber bundle, and a method for producing a prepreg. Fiber bundle can be stably and efficiently spread even in the case where the fiber bundle to be spread are filaments having a high elastic modulus such as carbon filaments or where the carbon fiber bundle conveying speed is higher.Type: GrantFiled: October 12, 2001Date of Patent: June 1, 2004Assignee: Toray Industries, Inc.Inventors: Kiyotsugu Tanaka, Hiroshi Ohtani, Hidetaka Matsumae, Seiji Tsuji, Daisaku Akase
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Publication number: 20040074833Abstract: This invention provides an inexpensive hollow-fiber membrane module that can prevent diaphragms from peeling or coming off from the cylindrical casing. The invention includes a hollow-fiber membrane module, comprising a cylindrical casing having an inlet port for the treating liquid at one end and an outlet port for the treating liquid at the other end, a hollow-fiber membrane bundle contained in the cylindrical casing, potting layers for fixing the hollow-fiber membrane bundle to the inner wall of the cylindrical casing at both the ends of the hollow-fiber membrane bundle, a header having an outlet port for the liquid undergoing treatment provided at one end of the cylindrical casing, and a header having an inlet port for the liquid undergoing treatment provided at the other end of the cylindrical casing, wherein baffle cylinders having slits extending in the direction at an angle to the axis of the cylindrical casing are fitted in the potting layers.Type: ApplicationFiled: October 9, 2003Publication date: April 22, 2004Applicant: Toray Industries, Inc., a corporation of JapanInventors: Osamu Nakamatsu, Hiroshi Ohtani, Ichirou Kumo
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Publication number: 20030057585Abstract: An apparatus and method for producing a spread fiber bundle using a fiber-spreading device composed of a group of rollers and a base body reciprocated to be repetitively brought into contact with and kept away from a running fiber bundle, and a method for producing a prepreg. Fiber bundle can be stably and efficiently spread even in the case where the fiber bundle to be spread are filaments having a high elastic modulus such as carbon filaments or where the carbon fiber bundle conveying speed is higher.Type: ApplicationFiled: October 12, 2001Publication date: March 27, 2003Inventors: Kiyotsugu Tanaka, Hiroshi Ohtani, Hidetaka Matsumae, Seiji Tsuji, Daisaku Akase
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Patent number: 6514885Abstract: To reduce dislocations produced in the formation of shallow trench isolation regions in a semiconductor substrate, the semiconductor substrate is annealed in N2 ambient pressure with an O2 partial pressure of less than about 10−4 at a temperature between about 950 C.° and about 1055 C.°. In addition, a method to reduce crystalline defects in semiconductor manufacturing in which a metal is deposited on an insulator to form metal silicide is provided. The method provides for etching the insulator to create an overhang by an amount equal to at least one half of the thickness of the metal, thereby creating a void between the surface of the semiconductor substrate and the insulator. The metal is deposited on the first insulator and on the surface of the semiconductor substrate and the semiconductor substrate is heated thereby forming metal silicide on the surface of the substrate.Type: GrantFiled: May 3, 2000Date of Patent: February 4, 2003Assignees: Kabushiki Kaisha Toshiba, Board of Trustees of Leland Stanford Jr. Univ., TheInventors: Sinji Onga, Robert W. Dutton, Kyeongjae Cho, Hideki Takada, Takako K. Okada, Hiroshi Ohtani, Yoshinori Asahi
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Patent number: 6284174Abstract: A melt spinning pack, including a pack case, a spinneret having many spinning holes positioned at the bottom of the case, a pack cap having a polymer introducing hole at the center positioned at the top of the case, and a flow arranging plate having many flow arranging holes with restricted portions reduced in cross sectional area compared to the inlets of the holes positioned between the spinneret and the pack cap, satisfying the requirement that the contraction percentage R be 50% or less, respectively contained in the case.Type: GrantFiled: December 6, 1999Date of Patent: September 4, 2001Assignee: Toray Industries, Inc.Inventors: Kunihiko Ueda, Toshio Nishitani, Hiroki Furuta, Teruaki Saijo, Kanji Saito, Hiroshi Kato, Hiroshi Ohtani, Shinji Shimizu, Koji Hashimoto
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Patent number: 6253362Abstract: Wiring of a non-uniform density is laid out on a chip. Then, the chip is virtually divided into a plurality of sub chips. The wiring density of each sub chip is obtained to obtain the density distribution function of wiring. After that, an index indicative of variations in the density of wiring is obtained on the basis of the density distribution function, thereby determining whether or not the index falls within an allowable range. If the index is out of the allowable range, the density distribution function is repeatedly updated until the index falls within the allowable range. Dummy wiring is provided on a region obtained by subtracting a region corresponding to the initial density distribution function from a region corresponding to the last density distribution function.Type: GrantFiled: October 20, 1998Date of Patent: June 26, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Minakshisundaran Balasubramanian Anand, Hiroshi Ohtani
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Patent number: 6127718Abstract: The semiconductor device and method of manufacturing the same according to the present invention has an object of reducing hem-pulling at a side wall of an isolation trench caused at an open space of a device isolation region having a well boundary at its bottom portion thereby to prevent structurally occurrence of punch-through. In an insulator filled device isolation method, an isolation trench for device isolation is formed by dry etching. If a second isolation trench intersects an intermediate portion of a first isolation like a T-shape, one side of the first isolation trench has an open space. In this case, the inclination angle of the side wall of the first isolation trench, opposed to the open space, is loosened and the side wall forms a shape whose hem is pulled out on the bottom portion. In this case if a well boundary exists along the lengthwise direction at the bottom of the first isolation trench, the structure tends to cause punch-through easily.Type: GrantFiled: September 3, 1998Date of Patent: October 3, 2000Assignee: Kabushiki Kaisha ToshibaInventors: Yasunori Okayama, Hiroshi Ohtani
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Patent number: 5725340Abstract: In order to prevent an electrode tip 8 from being burred during dressing process, thereby attaining high quality and stability of the electrode tip, a tip dresser features a screw-threaded circumference 5 formed around the rotatable cutter holder 1 for securing a one- or two-piece formed cutter element 2, for permitting the holder 1 to be rotated in one direction A manually or by a suitable driver. Frusto-conical recesses are symmetrically formed in both sides of the holder 1 for receiving the electrode tips, allowing the cutter element 2 to be mounted so as to slightly extend by a predetermined amount beyond the conically recessed surface.Type: GrantFiled: November 21, 1995Date of Patent: March 10, 1998Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Toshiharu Nakajima, Tadashi Goto, Satoru Machimura, Shinji Hoshino, Hiroshi Ohtani
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Patent number: 5545872Abstract: An improved tip dressing process is provided wherein the pressure between the electrode tip of a resistance welder and the cutter of a tip dresser is varied during the tip dressing process. A pressure controller is also provided for controlling the pressure between the electrode tip and cutter during the tip dressing process. The pressure controller may be applied to independently control the tip dressing process of several resistance welders simultaneously.Type: GrantFiled: October 31, 1994Date of Patent: August 13, 1996Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Toshiharu Nakajima, Satoru Machimura, Tadashi Goto, Toshitaka Mochizuki, Shinji Hoshino, Hiroshi Ohtani
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Patent number: 4472333Abstract: A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge formed at the boundary of a second face portion opposite said first face portion for increasing impact resistance to chipping and cracking of the ceramic substrate. A method of manufacturing the ceramic substrate includes adding the ceramic powder to a first mold member, pressing a force applying member into the first mold member, forming on the ceramic substrate a first and second stepped crest, sintering the ceramic substrate and grinding at least one of the first and second stepped crests so as to round the at least one of the stepped crests.Type: GrantFiled: September 30, 1981Date of Patent: September 18, 1984Assignee: Narumi China CorporationInventor: Hiroshi Ohtani
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Patent number: 4456641Abstract: A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge formed at the boundary of a second face portion opposite said first face portion for increasing impact resistance to chipping and cracking of the ceramic substrate.Type: GrantFiled: June 14, 1982Date of Patent: June 26, 1984Assignee: Narumi China CorporationInventor: Hiroshi Ohtani