Abstract: An information processing apparatus includes a registration unit, an acquisition unit, an authentication control unit, and a gate control unit. The registration unit registers first appearance information for registration in association with face information for registration for each registration target person, and updates the first appearance information. The acquisition unit acquires captured image data obtained by imaging an authentication target person. The authentication control unit performs personal authentication of the authentication target person based on a first and a second determination result. The first determination result indicates whether or not face information based on the captured image data corresponds to the face information for registration. The second determination result indicates whether or not first appearance information based on the captured image data corresponds to the first appearance information for registration.

Abstract: A method executed by a computer according to one embodiment includes: extracting a duration time of one or more physical states of a posture or a motion that a person assumes or performs during a performing of a task by analyzing a process of the task of the person; acquiring a load on a body of the person regarding the one or more physical states; and predicting at least one of a fatigue level or a residual physical strength of the person in the task based on the extracted duration time of the one or more physical states and the acquired load.

Abstract: A method executed by a computer according to one embodiment includes: extracting a duration time of one or more physical states of a posture or a motion that a person assumes or performs during a performing of a first task by analyzing a process of the first task of the person; acquiring a load on a body of the person regarding the one or more physical states; predicting at least one of the fatigue level or the residual physical strength of the person when the first task is ended based on the duration time of the one or more physical states that has been extracted and the acquired load; and predicting at least one of a degree of a decrease in the fatigue level or a degree of an increase in the residual physical strength from the predicted value after the first task is ended.

Abstract: A reflector driving device includes: a reflector-retaining member configured to retain a reflector that refracts light; a first support member configured to support the reflector-retaining member so as to be swingable about a first axis; a second support member configured to support the first support member so as to be swingable about a second axis having an axis-line direction perpendicular to an axis-line direction of the first axis; a first driving mechanism configured to swing the reflector-retaining member about the first axis; a second driving mechanism configured to swing the first support member about the second axis; a first biasing member configured to bias the reflector-retaining member toward the first support member; and a second biasing member configured to bias the first support member toward the second support member.

Abstract: The present invention controls against size increase of an optical module drive device. An optical module drive device has: a first swing member configured to hold an optical module; a second swing member connected to the first swing member such that the first swing member is swingable about a first swing axis that intersects the optical axis direction; a fixed member connected to the second swing member such that the second swing member is swingable about a second swing axis that intersects the optical axis direction and is perpendicular to the axial direction of the first swing axis; and a drive part configured to make the first swing member swing relative to the fixed member such that the optical axis tilts. The drive part includes a plurality of shape memory alloy wires provided between movable members including the first swing member and the second swing member, and the fixed member.

Abstract: A lens driving device includes a movable part, a plate spring that movably supports the movable part, a coil provided on the movable part, and magnets facing the coil. An outer portion of the movable part includes protrusion opposing parts where first restricting protrusion and second restricting protrusions face each other in an optical axis direction and non-opposing parts where the first restricting protrusion and the second restricting protrusions do not face each other in the optical axis direction, the coil is formed by winding a conductor wire around the outer portion in a circumferential direction and includes first coil portions positioned in the protrusion opposing parts and second coil portions positioned in at least some of the non-opposing parts, and the width of the second coil portions in the optical axis direction is greater than the width of the first coil portions in the optical axis direction.

Abstract: A thermal conductive stress relaxation structure is interposed between a high-temperature substance and a low-temperature substance to conduct heat in a heat-transfer direction from the high-temperature substance to the low-temperature substance. The structure includes an assembly configured such that a thermal conductive material gathers in a non-bonded state having stress relaxation effect. Such an assembly is a rolled-up body configured such that a carbon-based sheet material and a metal-based sheet material are alternately rolled up, for example. This structure has one or more interfaces at which adjacent parts can slide, thereby dividing a deformable region to relax the thermal stress. It has a low rigidity and can thus deform to release the thermal stress. The structure can suppress the thermal stresses and the shape changes that would be generated in the high-temperature substance and the low-temperature substance, and each physical body located there between.

Abstract: A lens driving device includes a movable part, a plate spring that movably supports the movable part, a coil provided on the movable part, and magnets facing the coil. An outer portion of the movable part includes protrusion opposing parts where first restricting protrusion and second restricting protrusions face each other in an optical axis direction and non-opposing parts where the first restricting protrusion and the second restricting protrusions do not face each other in the optical axis direction, the coil is formed by winding a conductor wire around the outer portion in a circumferential direction and includes first coil portions positioned in the protrusion opposing parts and second coil portions positioned in at least some of the non-opposing parts, and the width of the second coil portions in the optical axis direction is greater than the width of the first coil portions in the optical axis direction.

Abstract: A cooling type switching element module includes an outer conductor pipe, an inner conductor pipe that transmits electric power in conjunction with the outer conductor pipe, and first and second switching elements. The first switching elements are provided on outer surfaces of the outer conductor pipe, and the second switching elements are provided on outer surfaces of a projecting portion of the inner conductor pipe. A coolant flows within the inner conductor pipe, and outside the outer conductor pipe. The first and second switching elements are cooled from both sides by the coolant flowing within the inner conductor pipe, and by the coolant flowing outside the outer conductor pipe. By employing the above-described structure, it is possible to provide a switching element module having a cooling function, in which improved cooling performance, improved electrical performance, and downsizing are achieved.

Abstract: A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.

Abstract: A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a heat radiating portion is provided in close proximity to an insulating layer. The Peltier element has one end connected to a branch line branched from a power line, and has the other end electrically connected to an electrode plate. Further, the Peltier element receives from the branch line a portion of electric power supplied to a power transistor, and outputs it to the electrode plate. In other words, the Peltier element uses the portion of the electric power supplied to the power transistor, to absorb heat generated by the power transistor and radiate it toward a heat radiating plate.

Abstract: A cooling type switching element module includes an outer conductor pipe, an inner conductor pipe that transmits electric power in conjunction with the outer conductor pipe, and first and second switching elements. The first switching elements are provided on outer surfaces of the outer conductor pipe, and the second switching elements are provided on outer surfaces of a projecting portion of the inner conductor pipe. A coolant flows within the inner conductor pipe, and outside the outer conductor pipe. The first and second switching elements are cooled from both sides by the coolant flowing within the inner conductor pipe, and by the coolant flowing outside the outer conductor pipe. By employing the above-described structure, it is possible to provide a switching element module having a cooling function, in which improved cooling performance, improved electrical performance, and downsizing are achieved.

Abstract: A thermal conductive stress relaxation structure is interposed between a high-temperature substance and a low-temperature substance to conduct heat in a heat-transfer direction from the high-temperature substance to the low-temperature substance. The structure includes an assembly configured such that a thermal conductive material gathers in a non-bonded state having stress relaxation effect. Such an assembly is a rolled-up body configured such that a carbon-based sheet material and a metal-based sheet material are alternately rolled up, for example. This structure has one or more interfaces at which adjacent parts can slide, thereby dividing a deformable region to relax the thermal stress. It has a low rigidity and can thus deform to release the thermal stress. The structure can suppress the thermal stresses and the shape changes that would be generated in the high-temperature substance and the low-temperature substance, and each physical body located there between.

Abstract: A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device.

Abstract: A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first main surface 30B and a second main surface 30C configured to be located on the opposite side of the first main surface 30B. Semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2 are arranged in the first main surface 30B and the second main surface 30C in a zigzag pattern in cross-sectional view; and the semiconductor modules 20 are mounted onto some or all of the semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2.

Abstract: A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 ?m or more but 20 ?m or less is provided between the joining surfaces and the three-dimensional web structure.

Abstract: There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.

Abstract: A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.

Abstract: A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

Abstract: A heat pipe comprises a housing that has a heating section that is made of metal and is contacted by a heating element, a cooling section that is made of metal and is cooled by a cooling element, and a plurality of refrigerant flow channels formed inside the housing from the heating section to the cooling section; refrigerant that is enclosed inside the plurality of refrigerant flow channels; and heat-insulating layers that are disposed between the plurality of refrigerant flow channels located at least at the heating section in the housing.