Abstract: A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which electrically connects at least one of the plurality of electrodes and one of the plurality of bonding portions, a housing which packages the semiconductor element having the plurality of electrodes, the plurality of bonding portions of the lead frame, and the current path material, wherein the plate-like current path material is arranged to be directly bonded to one of the plurality of electrodes and one of the plurality of bonding portions, and the middle portion of the current path material is formed apart from the surface of the semiconductor element. A method of manufacturing the same is also provided.

Abstract: A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which electrically connects at least one of the plurality of electrodes and one of the plurality of bonding portions, a housing which packages the semiconductor element having the plurality of electrodes, the plurality of bonding portions of the lead frame, and the current path material, wherein the plate-like current path material is arranged to be directly bonded to one of the plurality of electrodes and one of the plurality of bonding portions, and the middle portion of the current path material is formed apart from the surface of the semiconductor element. A method of manufacturing the same is also provided.

Abstract: A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which electrically connects at least one of the plurality of electrodes and one of the plurality of bonding portions, a housing which packages the semiconductor element having the plurality of electrodes, the plurality of bonding portions of the lead frame, and the current path material, wherein the plate-like current path material is arranged to be directly bonded to one of the plurality of electrodes and one of the plurality of bonding portions, and the middle portion of the current path material is formed apart from the surface of the semiconductor element. A method of manufacturing the same is also provided.

Abstract: In a semiconductor chip having electrodes formed on the top surface, and electrodes or an insulation layer formed on the back surface, the top-surface electrodes are loop-connected with the back-surface electrodes by wire bonding, or, the top-surface electrodes are connected with the back-surface electrodes or an insulation layer by conductive clip, or by deposited conductive materials. The semiconductor chips thus produced are stacked, and wires, conductive clips, or conductive materials are connected and fixed to each other to produce a stacked semiconductor device in which semiconductor chips of the same size are densely packaged. Thus, a semiconductor device is provided which enables high-density packaging of semiconductor chips even of the same size.

Abstract: A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which electrically connects at least one of the plurality of electrodes and one of the plurality of bonding portions, a housing which packages the semiconductor element having the plurality of electrodes, the plurality of bonding portions of the lead frame, and the current path material, wherein the plate-like current path material is arranged to be directly bonded to one of the plurality of electrodes and one of the plurality of bonding portions, and the middle portion of the current path material is formed apart from the surface of the semiconductor element. A method of manufacturing the same is also provided.

Abstract: A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which electrically connects at least one of the plurality of electrodes and one of the plurality of bonding portions, a housing which packages the semiconductor element having the plurality of electrodes, the plurality of bonding portions of the lead frame, and the current path material, wherein the plate-like current path material is arranged to be directly bonded to one of the plurality of electrodes and one of the plurality of bonding portions, and the middle portion of the current path material is formed apart from the surface of the semiconductor element. A method of manufacturing the same is also provided.

Abstract: A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which electrically connects at least one of the plurality of electrodes and one of the plurality of bonding portions, a housing which packages the semiconductor element having the plurality of electrodes, the plurality of bonding portions of the lead frame, and the current path material, wherein the plate-like current path material is arranged to be directly bonded to one of the plurality of electrodes and one of the plurality of bonding portions, and the middle portion of the current path material is formed apart from the surface of the semiconductor element. A method of manufacturing the same is also provided.

Abstract: According to the present invention, soybean curd lees are effectively utilized, which are discharged in large quantity in the process-to produce soybean-related food products such as soybean curd (tofu), soybean milk, etc. known as superb food products containing vegetable proteins. The soybean milk (functional soybean curd lees milk) and soybean curd (functional soybean curd) both having good taste and high functions can be produced without discharging waste product and with high economic feasibility.

Abstract: In the present invention, a heat spreader, circuit boards for power semiconductor elements, and a circuit board for a control circuit are fixed on a metal plate. The heat spreader is made of an IMS. The IMS has a metal base made of Cu or Cu clad plate, and a high heat radiating insulating layer made of a resin-based material, and the metal plate and the heat spreader are adhered by the high heat radiating insulation layer and electrically insulated from each other. Only a power semiconductor element is soldered onto the heat spreader. A wiring pattern for guiding each terminal of the power semiconductor element to the outside is formed on a power circuit board. A control circuit for controlling the power semiconductor element is formed on the circuit board for the control circuit.

Abstract: A semiconductor device mounted on a substrate. Outer leads, partially resin-molded, have a greater height above the mounting surface than that of a conventional device. Specifically, each lead projecting from the molded resin has a bent portion which is convex in the direction opposite to the mounting surface, and the length of the lead beyond the bent portion is greater than the distance from the lead portion adjacent to the resin portion of the lead to the mounting surface. The long leads improve reliability during, e.g., heat cycle, tests. In another embodiment, outer leads, partially resin-molded, have reverse J-shaped bent portions, each with a distal end positioned away from the resin. When the bent portions serve as soldering portions, the soldering condition can be easily checked.

Abstract: This invention relates to an automatic focusing camera having an optical viewfinder, an optical distance measuring system and an optical photographic taking lens system arranged separate from one another. A slidable protector is provided which covers the optical openings of the taking lens system and the distance measuring system in one position, and uncovers the optical openings in a second position.

Abstract: A camera is provided with a series of interchangeable lenses each provided with a source of information preferably in the form of a variable resistor, which is indicative of the type of lens. The camera body is provided with a source of power and an information processing unit. The variable resistor in each lens is connected to the camera body through an electrical contact and provides information to the camera not only of the type of lens attached, through a stepped range of voltages, but secondary information variable according to focal length, etc. in increments smaller than the individual steps in the voltage range.

Abstract: A microwave oscillator including a GaAs field effect transistor having a gate electrode, a drain electrode and a source electrode and disposed on a planar substrate. An elongated gate transmission line is connected to the gate electrode of the field effect transistor and disposed on the substrate and terminated by a matching impedance. An elongated drain transmission line is connected to the drain electrode of the field effect transistor and disposed on the substrate at a predetermined angle to the gate transmission line while an elongated source transmission line is connected to the source electrode and disposed on the substrate for providing the oscillating output. A dielectric resonator is disposed within an angle formed between the gate transmission line and the drain transmission line.

Abstract: A camera including a photoelectric focus detecting device, the focused condition judgement level of which can be changed in accordance with the range of depth of focus or field of a photographing lens, with the change in an aperture value or value of an iris diaphragm, with the change or difference in the focal length of the lens, or with the difference in the wide-open F-number of an interchangeable lens.

Abstract: According to the invention, a helicoid mechanism is provided at each side of a supporting member of the lens barrel fixed by a tripod seat or the like, the front one being intended for effecting the displacement of the lens while the rear one being intended for displacing the camera, whereby a larger stroke of the lens displacement which is materially twice the conventional one is obtained with machining precision of conventional helicoid means.Means are provided for representing accurately the photo-taking distance, irrespective of whether either one of the front and rear helicoid mechanisms is solely adjusted, both of these helicoid mechanisms are individually adjusted or both of them are simultaneously operated, so as to render the operation of these helicoids free and to ensure an easier and more exact reading of the photo-taking distance.