Abstract: A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of the bottom plate, the container body housing an electronic component inside a cavity defined by the bottom plate and the polygonal side wall; and an input-output terminal that penetrates through the polygonal side wall and is attached to two sides of the polygonal side wall, wherein a first side of the polygonal side wall is adjacent to a second side of the polygonal side wall, wherein the input-output terminal includes an insulator and a conductor, and wherein the conductor penetrates through the insulator and provides electrical continuity between an interior portion of the polygonal side wall and an exterior portion of the polygonal side wall.

Abstract: A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of the bottom plate, the container body housing an electronic component inside a cavity defined by the bottom plate and the polygonal side wall; and an input-output terminal that penetrates through the polygonal side wall and is attached to two sides of the polygonal side wall, wherein a first side of the polygonal side wall is adjacent to a second side of the polygonal side wall, wherein the input-output terminal includes an insulator and a conductor, and wherein the conductor penetrates through the insulator and provides electrical continuity between an interior portion of the polygonal side wall and an exterior portion of the polygonal side wall.

Abstract: A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of the bottom plate, the container body housing an electronic component inside a cavity defined by the bottom plate and the polygonal side wall; and an input-output terminal that penetrates through the polygonal side wall and is attached to two sides of the polygonal side wall, wherein a first side of the polygonal side wall is adjacent to a second side of the polygonal side wall, wherein the input-output terminal includes an insulator and a conductor, and wherein the conductor penetrates through the insulator and provides electrical continuity between an interior portion of the polygonal side wall and an exterior portion of the polygonal side wall.

Abstract: A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of the bottom plate, the container body housing an electronic component inside a cavity defined by the bottom plate and the polygonal side wall; and an input-output terminal that penetrates through the polygonal side wall and is attached to two sides of the polygonal side wall, wherein a first side of the polygonal side wall is adjacent to a second side of the polygonal side wall, wherein the input-output terminal includes an insulator and a conductor, and wherein the conductor penetrates through the insulator and provides electrical continuity between an interior portion of the polygonal side wall and an exterior portion of the polygonal side wall.

Abstract: Provided is a package for housing an optical semiconductor element including: a metal-made base body; a metal-made lid body; a light-transmitting member; and an input/output terminal joined to the upper principal surface of the base body so as to cover a through bore. The input/output terminal includes: a dielectric-made first plate portion; a line conductor extending from one base body-side edge to another edge opposite thereto; a dielectric-made second plate portion stacked with its one base body-side end face made flush with the first plate portion; a metal plate made higher than the first plate portion and stacked with its one base body-side end face made flush with the first plate portion; and a lead terminal attached to the lower surface of the input/output terminal lying inside the through bore and electrically connected to the line conductor.

Abstract: Provided is a package for housing an optical semiconductor element including: a metal-made base body; a metal-made lid body; a light-transmitting member; and an input/output terminal joined to the upper principal surface of the base body so as to cover a through bore. The input/output terminal includes: a dielectric-made first plate portion; a line conductor extending from one base body-side edge to another edge opposite thereto; a dielectric-made second plate portion stacked with its one base body-side end face made flush with the first plate portion; a metal plate made higher than the first plate portion and stacked with its one base body-side end face made flush with the first plate portion; and a lead terminal attached to the lower surface of the input/output terminal lying inside the through bore and electrically connected to the line conductor.

Abstract: A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 ?m.

Abstract: This invention relates to a method of controlling the temperature of a heating furnace which has at least one furnace zone capable of being controlled by heating means and which conveys materials to be heated, that are introduced thereinto, by conveyor means such as a walking beam or a pusher so that the materials are heated to a predetermined temperature until they are withdrawn from the discharge side.More specifically, the present invention relates to a method of controlling set furnace zone temperature of the heating furnace when the materials to be heated, that are introduced into the heating furnace, have different temperature elevation patterns. The method of the invention is specifically characterized in that the predetermined set temperatures of each zone is used when the temperature elevation patterns of slabs are different with each other.