Abstract: A resin composition including a main agent containing an epoxy compound, a curing agent, and inorganic particles, the curing agent includes an aromatic compound in which a ratio of the number of carbon atoms constituting an aromatic ring to a total number of carbon atoms in one molecule is 85% or more, a content of the inorganic particles is 40 to 75 vol % based on a total amount of components other than a solvent, the inorganic particles include boron nitride particles and particles different from the boron nitride particles, and a content of the boron nitride particles is 3 to 35 vol % based on a total amount of components other than a solvent.

Abstract: A resin composition includes an epoxy compound, a first triphenylbenzene compound, and a second triphenylbenzene compound. A ratio M (mol %) expressed by M (mol %)=(M1/M2)×100 is from 0.2 mol % to 16.3 mol %, where M1 is the number of moles (mol) of an alkoxy group contained in the second triphenylbenzene compound, and M2 is sum of the number of moles (mol) of a hydroxyl group contained in the first triphenylbenzene compound, the number of moles (mol) of the hydroxyl group contained in the second triphenylbenzene compound, and the number of moles (mol) of the alkoxy group contained in the second triphenylbenzene compound.

Abstract: A resin composition includes an epoxy compound, a first triphenylbenzene compound, and a second triphenylbenzene compound. A ratio M (mol %) expressed by M (mol %)=(M1/M2)×100 is from 0.2 mol % to 16.3 mol %, where M1 is the number of moles (mol) of an alkoxy group contained in the second triphenylbenzene compound, and M2 is sum of the number of moles (mol) of a hydroxyl group contained in the first triphenylbenzene compound, the number of moles (mol) of the hydroxyl group contained in the second triphenylbenzene compound, and the number of moles (mol) of the alkoxy group contained in the second triphenylbenzene compound.

Abstract: An inorganic filler-containing epoxy resin cured product contains a magnesium oxide powder and has a maximum thermogravimetric mass loss rate ?Rmax of ?0.20 mass percent/° C. or more within a temperature range of 300° C. to 500° C. The filling factor of the magnesium oxide powder in the inorganic filler-containing epoxy resin cured product is 45% to 63% by volume.

Abstract: An inorganic filler-containing epoxy resin cured product contains a magnesium oxide powder and has a maximum thermogravimetric mass loss rate ?Rmax of ?0.20 mass percent/° C. or more within a temperature range of 300° C. to 500° C. The filling factor of the magnesium oxide powder in the inorganic filler-containing epoxy resin cured product is 45% to 63% by volume.

Abstract: The present invention provides a resin composition having a suitable melting temperature for molding, a resin sheet containing the resin composition, a cured resin product excellent in thermal conductivity and heat resistance, and a substrate. They are prepared in the way that in the resin composition containing epoxy compounds and curing agent selected from 1,3,5-tris(4-aminophenyl)benzene and 1,3,5-tris(4-hydroxyphenyl)benzene, the content of 1,3,5-triphenylbenzene that is the main skeleton of the curing agent is 15 mass % or more and 50 mass % or less of the total organic substances in the resin composition.