Patents by Inventor Hiroshi Tajima
Hiroshi Tajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240172405Abstract: An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A1) including one or more island-shaped metal layer fragments. Each opening (A1) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).Type: ApplicationFiled: March 29, 2022Publication date: May 23, 2024Inventors: Takahiko KATSUKI, Hiroshi TAJIMA, Sirou YAMAUCHI
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Publication number: 20240158676Abstract: Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X?Y?100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region.Type: ApplicationFiled: January 19, 2024Publication date: May 16, 2024Inventors: Yuusuke HARUNA, Kenji AOKI, Hiroshi TAJIMA, Sougo ISHIOKA
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Publication number: 20240150638Abstract: It is an object of the present invention to provide a thermally conductive sheet that is excellent in thermally conductive property, has insulation property, has a low permittivity, and is excellent in designability. The thermally conductive sheet 1 comprises a binder component 11, titanium oxide, titanium nitride, and a thermally conductive filler 12 other than these, and a ratio of the titanium oxide to the total of the titanium oxide and the titanium nitride is 20 to 90% by mass. An L* value of a surface of the thermally conductive sheet 1 in the L*a*b* color system is preferably 41 or less. The total content of the titanium oxide and the titanium nitride is preferably 0.3 to 10.0 parts by mass based on the total amount 100 parts by mass of the thermally conductive filler 12.Type: ApplicationFiled: March 11, 2022Publication date: May 9, 2024Inventors: Yuusuke HARUNA, Hiroshi TAJIMA, Shigekazu UMEMURA, Kanoe KOMATSU, Yuu IIHARA, Junichi KINOSHITA, Kiyoshi IWAI
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Patent number: 11964084Abstract: The present invention relates to a phosphate adsorbing agent for blood processing comprising a porous formed article comprising an organic polymer resin and an inorganic ion adsorbent and having the most frequent pore size of 0.08 to 0.70 ?m measured with a mercury porosimeter. The present invention also relates to a blood processing system and a blood processing method involving the phosphate adsorbing agent for blood processing.Type: GrantFiled: August 16, 2022Date of Patent: April 23, 2024Assignee: ASAHI KASEI MEDICAL CO., LTD.Inventors: Naoki Morita, Hiroshi Tajima, Ryou Sasaki, Hirokazu Nagai, Akihiro Omori
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Patent number: 11878101Abstract: A blood purification device includes a porous molded body containing an inorganic ion-adsorbing material and is characterized by the following: the concentrations of Mg, Al, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Ga, Rb, Sr, Y, Zr, Mo, Ru, Ag, Cd, Sn, Cs, La, Pr, Sm, Gd, Tb, Ta, Au, Tl, Co, In, and Bi are each 0.1 ppb or less and the concentrations of Ba, Nd, Pb, And Ce are each 1 ppb or less in a physiological saline solution for injection both three months and six months after said physiological saline solution for injection is sealed in the blood purification device; and the number of fine particles having a size of 10 ?m or more is 25 or less and the number of fine particles having a size of 25 ?m or more is 3 or less in 1 mL of the physiological saline solution for injection.Type: GrantFiled: March 29, 2019Date of Patent: January 23, 2024Assignee: ASAHI KASEI MEDICAL CO., LTD.Inventors: Teruhiko Oishi, Makoto Ozeki, Keitaro Matsuyama, Naoki Morita, Hiroshi Tajima, Toshinori Koizumi
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Patent number: 11806461Abstract: Provided is a blood purification device including a porous molded body that has a high phosphorus adsorption capacity and that can be used safely. A blood purification device includes a porous molded body containing an inorganic ion-adsorbing material and is characterized by the following: said blood purification device satisfies the relationship B=?0.02 A+2.175±0.185 (74?A?94) when the moisture content of the porous molded body is denoted by A and the bulk density is denoted by B; and the number of fine particles having a size of 10 ?m or more is 25 or less and the number of fine particles having a size of 25 ?m or more is 3 or less in 1 mL of a physiological saline solution for injection both three months and six months after said physiological saline solution for injection is sealed in the blood purification device.Type: GrantFiled: March 29, 2019Date of Patent: November 7, 2023Assignee: ASAHI KASEI MEDICAL CO., LTD.Inventors: Teruhiko Oishi, Naoki Morita, Keitaro Matsuyama, Hiroshi Tajima, Toshinori Koizumi
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Publication number: 20230337408Abstract: An electromagnetic wave shielding film that can be thinned, and has high peel strength, electroconductivity, shielding properties, and flex resistance and conformability to a step is provided.Type: ApplicationFiled: September 22, 2021Publication date: October 19, 2023Inventors: Yoshiharu YANAGI, Hiroshi TAJIMA
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Patent number: 11758705Abstract: Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.Type: GrantFiled: February 25, 2021Date of Patent: September 12, 2023Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTDInventors: Takahiko Katsuki, Hiroshi Tajima, Yuusuke Haruna
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Publication number: 20230086849Abstract: Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.Type: ApplicationFiled: February 25, 2021Publication date: March 23, 2023Inventors: Takahiko KATSUKI, Hiroshi TAJIMA, Yuusuke HARUNA
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Publication number: 20220387682Abstract: The present invention relates to a phosphate adsorbing agent for blood processing comprising a porous formed article comprising an organic polymer resin and an inorganic ion adsorbent and having the most frequent pore size of 0.08 to 0.70 ?m measured with a mercury porosimeter. The present invention also relates to a blood processing system and a blood processing method involving the phosphate adsorbing agent for blood processing.Type: ApplicationFiled: August 16, 2022Publication date: December 8, 2022Applicant: ASAHI KASEI MEDICAL CO., LTD.Inventors: Naoki MORITA, Hiroshi TAJIMA, Ryou SASAKI, Hirokazu NAGAI, Akihiro OMORI
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Patent number: 11457527Abstract: Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.Type: GrantFiled: December 12, 2019Date of Patent: September 27, 2022Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Yuusuke Haruna, Shirou Yamauchi, Hiroshi Tajima, Sougo Ishioka
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Publication number: 20220220346Abstract: Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X?Y?100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region.Type: ApplicationFiled: May 20, 2020Publication date: July 14, 2022Inventors: Yuusuke HARUNA, Kenji AOKI, Hiroshi TAJIMA, Sougo ISHIOKA
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Publication number: 20220030699Abstract: Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.Type: ApplicationFiled: December 12, 2019Publication date: January 27, 2022Inventors: Yuusuke HARUNA, Shirou YAMAUCHI, Hiroshi TAJIMA, Sougo ISHIOKA
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Patent number: 11224871Abstract: The present invention provides a phosphate adsorbing agent for blood processing comprising a porous formed article comprising an organic polymer resin and an inorganic ion adsorbent and having a most frequent pore size of 0.08 to 0.70 ?m measured with a mercury porosimeter, the phosphate adsorbing agent for blood processing having a biocompatible polymer in the surface of the porous formed article.Type: GrantFiled: May 17, 2018Date of Patent: January 18, 2022Assignee: ASAHI KASEI MEDICAL CO., LTD.Inventors: Naoki Morita, Hiroshi Tajima, Masashi Kogawa
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Publication number: 20210410272Abstract: Provided is a method of producing a shielded printed wiring board capable of sufficiently adhering to each other a printed wiring board, an adhesive layer of an electromagnetic wave shielding film on one face of the printed wiring board, and an adhesive layer of an electromagnetic wave shielding film on the other face of the printed wiring board.Type: ApplicationFiled: December 10, 2019Publication date: December 30, 2021Inventors: Sirou YAMAUCHI, Hiroshi TAJIMA, Yuusuke HARUNA, Takahiko KATSUKI
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Publication number: 20210353845Abstract: Provided is a blood purification device including a porous molded body that has a high phosphorus adsorption capacity and that can be used safely. A blood purification device includes a porous molded body containing an inorganic ion-adsorbing material and is characterized by the following: said blood purification device satisfies the relationship B=?0.02 A+2.175±0.185 (74?A?94) when the moisture content of the porous molded body is denoted by A and the bulk density is denoted by B; and the number of fine particles having a size of 10 ?m or more is 25 or less and the number of fine particles having a size of 25 ?m or more is 3 or less in 1 mL of a physiological saline solution for injection both three months and six months after said physiological saline solution for injection is sealed in the blood purification device.Type: ApplicationFiled: March 29, 2019Publication date: November 18, 2021Applicant: ASAHI KASEI MEDICAL CO., LTD.Inventors: Teruhiko OISHI, Naoki MORITA, Keitaro MATSUYAMA, Hiroshi TAJIMA, Toshinori KOIZUMI
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Publication number: 20210084751Abstract: Embodiments of a printed wiring board configured to inhibit increases in electrical resistance between a ground circuit and a reinforcement member are disclosed. The printed wiring board has a substrate film with a base film and a printed circuit, which printed circuit includes a ground circuit; an adhesive layer formed on the substrate film; and a conductive reinforcement member formed on the adhesive layer. The adhesive layer includes conductive particles. One or more layers of low-melting-point metal is or are provided between the adhesive layer and the substrate film; between the adhesive layer and the reinforcement member; and/or around the conductive particles.Type: ApplicationFiled: November 30, 2020Publication date: March 18, 2021Inventors: Yuusuke HARUNA, Takahiko KATSUKI, Tsuyoshi HASEGAWA, Hiroshi TAJIMA
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Publication number: 20210059042Abstract: It is an object of the present invention to provide an electromagnetic shielding film having excellent high frequency signal transmission characteristics and excellent shielding characteristics against electromagnetic waves in a high frequency region and a shielded printed wiring board including the same. An electromagnetic shielding film 1 includes a shielding layer that is formed by a first metal layer mainly comprised of nickel and a second metal layer mainly comprised of copper, an adhesive layer formed on the second metal layer side of the shielding layer, and a protective layer formed on the first metal layer side of the shielding layer which is the opposite side of the shielding layer from the second metal layer side. The first metal layer has a thickness T1 of 2 ?m or more and 10 ?m or less, and the second metal layer has a thickness T2 of 2 ?m or more and 10 ?m or less.Type: ApplicationFiled: July 10, 2017Publication date: February 25, 2021Inventors: Sirou YAMAUCHI, Masahiro WATANABE, Hiroshi TAJIMA
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Publication number: 20210008270Abstract: A blood purification device includes a porous molded body containing an inorganic ion-adsorbing material and is characterized by the following: the concentrations of Mg, Al, Ti, V, Cr, Mn, Fe, Ni, Cu, Zn, Ga, Rb, Sr, Y, Zr, Mo, Ru, Ag, Cd, Sn, Cs, La, Pr, Sm, Gd, Tb, Ta, Au, Tl, Co, In, and Bi are each 0.1 ppb or less and the concentrations of Ba, Nd, Pb, And Ce are each 1 ppb or less in a physiological saline solution for injection both three months and six months after said physiological saline solution for injection is sealed in the blood purification device; and the number of fine particles having a size of 10 ?m or more is 25 or less and the number of fine particles having a size of 25 ?m or more is 3 or less in 1 mL of the physiological saline solution for injection.Type: ApplicationFiled: March 29, 2019Publication date: January 14, 2021Applicant: ASAHI KASEI MEDICAL CO., LTD.Inventors: Teruhiko OISHI, Makoto OZEKI, Keitaro MATSUYAMA, Naoki MORITA, Hiroshi TAJIMA, Toshinori KOIZUMI
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Publication number: 20200171479Abstract: The present invention provides a phosphate adsorbing agent for blood processing comprising a porous formed article comprising an organic polymer resin and an inorganic ion adsorbent and having a most frequent pore size of 0.08 to 0.70 ?m measured with a mercury porosimeter, the phosphate adsorbing agent for blood processing having a biocompatible polymer in the surface of the porous formed article.Type: ApplicationFiled: May 17, 2018Publication date: June 4, 2020Applicant: ASAHI KASEI MEDICAL CO., LTD.Inventors: Naoki MORITA, Hiroshi TAJIMA, Masashi KOGAWA