Abstract: A chemical amplifying type positive photoresist composition, excellent in various properties such as film retention ratio, applicability, heat resistance, sensitivity, resolution, profile and time delay resistance, and not easily affected by environment, which comprises (A) a resin which is converted to alkali-soluble by the action of an acid, (B) an acid generator and (C) a tertiary amine compound having an ether bond; and a fine photoresist pattern can be formed in high precision using the photoresist composition.

Abstract: A positive photo resist composition of chemical amplifying type, which is excellent in various properties such as sensitivity resolution, heat resistance, film retention ratio, applicability and profile and also excellent in time delay effect resistance, and which comprises(A) a resin which is converted to alkali-soluble from alkali-insoluble or alkali-slightly soluble by the action of an acid,(B) an acid generator and(C) a tertiary amine compound having an aliphatic hydroxyl group.

Abstract: A positive photo resist composition of chemical amplifying type, which is excellent in various properties such as sensitivity, resolution, heat resistance, film retention ratio, applicability and profile and also excellent in time delay effect resistance, and which comprises(A) a resin which is converted to alkali-soluble from alkali-insoluble or alkali-slightly soluble by the action of an acid,(B) an acid generator and(C) a dipyridyl compound represented by the following formula (I): ##STR1## wherein, Z represents an organic bonding group having least one hetero atom, and R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 each independently represent hydrogen or an alkyl group having 1 to 4 carbon atoms.

Abstract: This invention provides a process for producing a resist composition in which the content of relatively large undissolved particles is low just after production of the composition and the content of relatively large undissolved particles increases only to a small extent even if the composition is stored for a long period of time. Thus, this invention provides a process for producing a resist composition which comprises filtering a mixture of an alkali-soluble resin, a radiation-sensitive compound and a solvent by the use of a filter of which pore diameter is 0.1 .mu.m or below and of which particle-removing performance is 99% or above. Further, this invention provides also a resist composition comprising an alkali-soluble resin, a radiation-sensitive compound and an organic solvent not simultaneously having both acetoxy group and alkoxy group in its molecule, said composition containing undissolved particles having a particle diameter of 0.25 .mu.

Abstract: This invention provides a process for producing a resist composition in which the content of relatively large undissolved particles is low just after production of the composition and the content of relatively large undissolved particles increases only to a small extent even if the composition is stored for a long period of time. Thus, this invention provides a process for producing a resist composition which comprises filtering a mixture of an alkali-soluble resin, a radiation-sensitive compound and a solvent by the use of a filter of which pore diameter is 0.1 .mu.m or below and of which particle-removing performance is 99% or above. Further, this invention provides also a resist composition comprising an alkali-soluble resin, a radiation-sensitive compound and an organic solvent not simultaneously having both acetoxy group and alkoxy group in its molecule, said composition containing undissolved particles having a particle diameter of 0.25 .mu.

Abstract: A radiation sensitive compound prepared by reacting a phenol compound with a quinone diazide sulfonyl halide in a mixture of a solvent having a relative dielectric constant of not larger than 10 and a solvent having a relative dielectric constant of at least 15, which compound is less colored and gives a positive resist composition having a good resolution.

Abstract: A resist composition comprising an alkali-soluble resin, a 1,2-quinone diazide compound and a compound of the general formula (I): ##STR1## wherein Z is an oxygen or sulfur atom or a group of the formula: >N--R.sub.4 in which R.sub.4 is a hydrogen atom or an alkyl group; R.sub.1, R.sub.2 and R.sub.3 are the same or different and independently a hydrogen atom, a substituted or unsubstituted alkyl group, a halogen atom, a hydroxyl group, a cyano group or a group of the formula: --OCOR" in which R" is a substituted or unsubstituted alkyl group; and X and Y are independently a cyano group or a group of the formula: ##STR2## --COOR or --CONHR' in R is an alkyl group and R' is a hydrogen atom or an aryl group, which is suitable for the formation of very fine patterns on a substrate having a high reflectance.