Patents by Inventor Hiroshi Tamagawa
Hiroshi Tamagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240065267Abstract: Provided is a plant disease control composition having a broad spectrum against various plant pathogens, and shows excellent controlling effects (synergistic controlling effects) which cannot be expected from a single component alone. The plant disease control composition includes (Group a) at least one quinoline compound represented by the formula: (wherein R1, R2: an alkyl which may be substituted, an aryl which may be substituted, etc.; R3, R4: H, an alkyl which may be substituted, etc.; X: halogen, an alkyl which may be substituted, etc.; Y: halogen, alkyl, etc.; n: 0 to 4; m: 0 to 6) or a salt thereof, and at least one of fungicidal compounds selected from the group consisting of a Strobilurin series compound, a triazole series compound, etc., as effective ingredients.Type: ApplicationFiled: September 22, 2023Publication date: February 29, 2024Applicant: Mitsui Chemicals Crop & Life Solutions, Inc.Inventors: Yasushi TAMAGAWA, Hiroshi ISHIMOTO, Mayumi TAKAGI, Toshiaki OHARA, Harukazu TANAKA
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Patent number: 10833145Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: GrantFiled: January 17, 2019Date of Patent: November 10, 2020Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
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Patent number: 10763016Abstract: A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.Type: GrantFiled: December 24, 2018Date of Patent: September 1, 2020Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Hiroki Yamamoto, Katsuya Matsuura, Yasuhiro Kondo
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Patent number: 10681815Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.Type: GrantFiled: February 26, 2019Date of Patent: June 9, 2020Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Koichi Niino, Eiji Nukaga, Keishi Watanabe
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Patent number: 10593480Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.Type: GrantFiled: July 10, 2018Date of Patent: March 17, 2020Assignee: ROHM CO., LTD.Inventors: Hiroki Yamamoto, Keishi Watanabe, Hiroshi Tamagawa
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Patent number: 10446302Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.Type: GrantFiled: November 15, 2016Date of Patent: October 15, 2019Assignee: ROHM CO., LTD.Inventors: Eiji Nukaga, Hiroshi Tamagawa, Yasuhiro Kondo, Katsuya Matsuura
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Patent number: 10410772Abstract: A chip resistor has a substrate, a first connection electrode and a second connection electrode that are formed on the substrate, and a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and the other one of which is connected to the second connection electrode. The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line that is provided along inner wall surfaces of trenches. The resistive element film line extending along the inner wall surfaces of the trenches is long and has a high resistivity as a unit resistive element.Type: GrantFiled: March 9, 2017Date of Patent: September 10, 2019Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo
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Patent number: 10361182Abstract: The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.Type: GrantFiled: December 23, 2014Date of Patent: July 23, 2019Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Hiroki Yamamoto
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Patent number: 10342138Abstract: A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.Type: GrantFiled: August 7, 2017Date of Patent: July 2, 2019Assignee: ROHM CO., LTD.Inventors: Yasuhiro Kondo, Katsuya Matsuura, Hiroshi Tamagawa
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Publication number: 20190200458Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.Type: ApplicationFiled: February 26, 2019Publication date: June 27, 2019Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Koichi NIINO, Eiji NUKAGA, Keishi WATANABE
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Patent number: 10321570Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.Type: GrantFiled: March 27, 2014Date of Patent: June 11, 2019Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Koichi Niino, Eiji Nukaga, Keishi Watanabe
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Publication number: 20190148480Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: ApplicationFiled: January 17, 2019Publication date: May 16, 2019Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Yasuhiro KONDO, Yasuhiro FUWA, Hiroyuki OKADA, Eiji NUKAGA, Katsuya MATSUURA
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Publication number: 20190148040Abstract: A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.Type: ApplicationFiled: December 24, 2018Publication date: May 16, 2019Applicant: ROHM CO., LTD.Inventors: Hiroshi TAMAGAWA, Hiroki YAMAMOTO, Katsuya MATSUURA, Yasuhiro KONDO
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Patent number: 10224391Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.Type: GrantFiled: July 12, 2017Date of Patent: March 5, 2019Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
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Patent number: 10210971Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.Type: GrantFiled: April 18, 2017Date of Patent: February 19, 2019Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Hiroki Yamamoto, Katsuya Matsuura, Yasuhiro Kondo
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Patent number: 10178768Abstract: A mounting substrate includes a substrate, a connection electrode, which is formed on a front surface of the substrate and on which an electronic component is mounted via a conductive bonding material, a resist film, formed on the front surface of the substrate so as to cover a peripheral edge portion of the connection electrode, and a receiving portion, formed in the resist film so as to expose a portion of the peripheral edge portion of the connection electrode and arranged to receive an excess portion of the conductive bonding material.Type: GrantFiled: November 23, 2016Date of Patent: January 8, 2019Assignee: ROHM CO., LTD.Inventors: Katsuya Matsuura, Hiroshi Tamagawa
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Patent number: 10128163Abstract: A chip part includes a substrate that has an upper surface, a lower surface positioned on an opposite side of the upper surface, and a sidewall by which the upper surface and the lower surface are connected together and that has a plurality of concavo-convex portions formed on the sidewall from a side of the upper surface toward a side of the lower surface, a functional element formed at the side of the upper surface of the substrate, a first external electrode and a second external electrode that are arranged at the upper surface of the substrate so as to be electrically connected to the functional element, and a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film.Type: GrantFiled: December 19, 2016Date of Patent: November 13, 2018Assignee: ROHM CO., LTD.Inventors: Hiroshi Tamagawa, Yasuhiro Kondo
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Publication number: 20180323011Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.Type: ApplicationFiled: July 10, 2018Publication date: November 8, 2018Applicant: ROHM CO., LTD.Inventors: Hiroki YAMAMOTO, Keishi WATANABE, Hiroshi TAMAGAWA
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Patent number: 10026557Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.Type: GrantFiled: May 16, 2017Date of Patent: July 17, 2018Assignee: ROHM CO., LTD.Inventors: Hiroki Yamamoto, Keishi Watanabe, Hiroshi Tamagawa
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Patent number: 9972427Abstract: A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.Type: GrantFiled: September 21, 2016Date of Patent: May 15, 2018Assignee: ROHM CO., LTD.Inventors: Yasuhiro Kondo, Hiroshi Tamagawa, Hiroki Yamamoto