Patents by Inventor Hiroshi Toi

Hiroshi Toi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5347712
    Abstract: A multilayer wiring board and a method for manufacturing the same are disclosed. The wiring board comprises an insulating substrate having a first and second conductor layers formed on major surfaces of the insulating substrate, a blind hole formed through the first conductor layer and the insulating substrate to expose the second conductor layer at the bottom of the blind hole, and a connecting conductor provided to cover the exposed surface of the second conductor layer wall portion of the blind hole and the first conductor layer. Since the connecting conductor and the second conductor are made in surface contact, connection reliability is very much improved. The blind hole is made by blasting a fine abrasive powder beam to selectively remove the insulating substrate. The end of selective removal can be easily controlled by the difference of working speed against the insulating substrate and the conductor layer to successfully expose the second conductor layer at the bottom of the blind hole.
    Type: Grant
    Filed: June 14, 1993
    Date of Patent: September 20, 1994
    Assignee: Sony Corporation
    Inventors: Nobuyuki Yasuda, Toshio Tamura, Hiroshi Toi, Akio Mishima
  • Patent number: 5086556
    Abstract: An electronic component mounting apparatus wherein any unflatness value such as skew at each of predetermined points on the surface of a substrate supported at a component mounting position is measured by a non-contact type measuring instrument. Such unflatness value and a predetermined height of each electronic component to be mounted are calculated, and the descent stroke of each suction nozzle is adjusted in accordance with the result of such calculation in such a manner that the bottom face of the component is set exactly at the predetermined position on the substrate surface, thereby ensuring accurate mounting of the component on the substrate surface without causing any impact thereto to consequently attain proper attachment.
    Type: Grant
    Filed: June 10, 1991
    Date of Patent: February 11, 1992
    Assignee: Sony Corporation
    Inventor: Hiroshi Toi
  • Patent number: 4815056
    Abstract: In a diskfile device wherein a large amount of information transmitted by documents, images, sounds, etc.
    Type: Grant
    Filed: February 4, 1986
    Date of Patent: March 21, 1989
    Assignee: Sony Corporation
    Inventors: Hiroshi Toi, Shinichi Fujita, Makoto Uragaki
  • Patent number: 4114252
    Abstract: A manufacturing apparatus for a tape cassette includes: a rotary table having at least one pair of hub chucks for demountably holding a pair of hubs supplied to the rotary table; a mechanism for clamping an initial end of a supplied tape to one of the hubs held by the hub chucks; a tape winding member for winding a predetermined length of the supplied tape onto the one hub; a cutting member for cutting the trailing side of the wound tape on the one hub; another mechanism for clamping the terminal end of the cut tape to the other of the hubs; and an assembling mechanism for transporting the hubs to which the ends of the tape are clamped and on which the tape is wound, to a position adjacent to a mounted cassette half, demounting the hubs from the hub chucks and assembling the hubs into the mounted cassette half.
    Type: Grant
    Filed: May 26, 1977
    Date of Patent: September 19, 1978
    Assignee: Sony Corporation
    Inventors: Tsuneyoshi Kon, Hiroshi Toi, Tamiaki Matsuura, Kiyohiko Akanuma, Toru Takamiya, Motosuke Usui