Patents by Inventor Hiroshi Umetani

Hiroshi Umetani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11941011
    Abstract: A provision method provides plurality of pieces of advice pertaining to household appliances of a user on a tablet 103. A priority of each piece of advice is changed by determining whether an advice-specific standard for the user the reference that piece of advice is met by an auto-log or overall user information. The pieces of advice are displayed in accordance with determination results. The format of display according to determination results is a list of advice sorted by priority.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: March 26, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Hiroshi Yoshitake, Hideo Umetani, Kentaro Nakai, Keigo Aso, Shunsuke Kuhara
  • Patent number: 11781052
    Abstract: The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are exhibited, and provides a molded body of the thermally conductive composition. A thermally conductive composition, in which a thermally conductive filler is contained in a polymer matrix, includes a methyl phenyl silicone, characterized in that the thermally conductive filler has an average particle size of 10 to 100 ?m, the content of the thermally conductive filler in the thermally conductive composition is 70% to 90% by volume, and 30% to 80% by volume of the thermally conductive filler has a particle size of 40 ?m or more. A thermally conductive molded body is formed of a cured body of the thermally conductive composition.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: October 10, 2023
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventor: Hiroshi Umetani
  • Publication number: 20230173793
    Abstract: The method for producing a thermally conductive sheet according to the present invention comprises: a step (1) of obtaining a liquid composition comprising a curable silicone composition including an alkenyl group-containing organopolysiloxane and a hydrogen organopolysiloxane, a thermally conductive filler, and a volatile compound; a step (2) of sandwiching the liquid composition between two resin sheets at least one of which is a gas-permeable film and pressurizing these to obtain a sheet-shaped formed product; and a step (3) of heating the sheet-shaped formed product to volatilize at least a part of the volatile compound. According to the present invention, it is possible to provide a method for producing a thermally conductive sheet having a good sheet condition and a low thermal resistance value.
    Type: Application
    Filed: May 27, 2021
    Publication date: June 8, 2023
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventors: Hiroshi UMETANI, Hiroki KUDOH
  • Publication number: 20200317979
    Abstract: The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are exhibited, and provides a molded body of the thermally conductive composition. A thermally conductive composition, in which a thermally conductive filler is contained in a polymer matrix, includes a methyl phenyl silicone, characterized in that the thermally conductive filler has an average particle size of 10 to 100 ?m, the content of the thermally conductive filler in the thermally conductive composition is 70% to 90% by volume, and 30% to 80% by volume of the thermally conductive filler has a particle size of 40 ?m or more. A thermally conductive molded body is formed of a cured body of the thermally conductive composition.
    Type: Application
    Filed: January 16, 2019
    Publication date: October 8, 2020
    Applicant: SEKISUI POLYMATECH CO., LTD.
    Inventor: Hiroshi Umetani
  • Patent number: 10159942
    Abstract: The present invention provides a separation membrane and a separation membrane element capable of exhibiting a good water production performance even at a high temperature and also excellent handleability and quality. The separation membrane of the present invention includes a separation membrane main body having a feed-side face and a permeate-side face; and a permeate-side channel member fixed onto the permeate-side face of the separation membrane main body, and the permeate-side channel member includes polypropylene as a main component and satisfies the following requirements (a) to (c): (a) a softening point temperature is 60° C. or higher; (b) a tensile elongation in a standard state is 10% or more; and (c) a yield point stress under a wet condition at 50° C. is 2 MPa or more.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: December 25, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yoshie Marutani, Hiroyuki Yamada, Hiroho Hirozawa, Kentaro Takagi, Yoshiki Okamoto, Shunsuke Tabayashi, Hiroshi Umetani, Akira Katayama, Takao Sasaki, Masahiro Kimura
  • Patent number: 9764291
    Abstract: A spiral separation membrane element including a plurality of separation membrane pairs wound around the outer peripheral surface of a water collection pipe, wherein the plurality of separation membranes include at least two sets of separation membrane pairs in which two adjacent separation membranes are stacked such that the water supply sides of the separation membranes form opposing surfaces, and the water supply-side surfaces at the ends of separation membranes close to the water collection pipe and parallel to the lengthwise direction of the water collection pipe are sealed by a sealing material.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: September 19, 2017
    Assignee: Toray Industries, Inc.
    Inventors: Hiroho Hirozawa, Hiroshi Umetani, Masakazu Koiwa, Kentarou Takagi, Masahiro Kimura
  • Publication number: 20170001154
    Abstract: The present invention provides a separation membrane and a separation membrane element capable of exhibiting a good water production performance even at a high temperature and also excellent handleability and quality. The separation membrane of the present invention includes a separation membrane main body having a feed-side face and a permeate-side face; and a permeate-side channel member fixed onto the permeate-side face of the separation membrane main body, and the permeate-side channel member includes polypropylene as a main component and satisfies the following requirements (a) to (c): (a) a softening point temperature is 60° C. or higher; (b) a tensile elongation in a standard state is 10% or more; and (c) a yield point stress under a wet condition at 50° C. is 2 MPa or more.
    Type: Application
    Filed: January 29, 2015
    Publication date: January 5, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yoshie MARUTANI, Hiroyuki YAMADA, Hiroho HIROZAWA, Kentaro TAKAGI, Yoshiki OKAMOTO, Shunsuke TABAYASHI, Hiroshi UMETANI, Akira KATAYAMA, Takao SASAKI, Masahiro KIMURA
  • Publication number: 20140014569
    Abstract: A spiral separation membrane element including a plurality of separation membrane pairs wound around the outer peripheral surface of a water collection pipe, wherein the plurality of separation membranes include at least two sets of separation membrane pairs in which two adjacent separation membranes are stacked such that the water supply sides of the separation membranes form opposing surfaces, and the water supply-side surfaces at the ends of separation membranes close to the water collection pipe and parallel to the lengthwise direction of the water collection pipe are sealed by a sealing material.
    Type: Application
    Filed: March 23, 2012
    Publication date: January 16, 2014
    Applicant: Toray Industries, Inc.
    Inventors: Hiroho Hirozawa, Hiroshi Umetani, Masakazu Koiwa, Kentarou Takagi, Masahiro Kimura