Abstract: The present invention provides a method for producing a resin-encapsulated electronic component, capable of simply and efficiently producing a resin-encapsulated electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method includes a resin-encapsulation step of encapsulating at least one electronic component in a resin. A produced resin-encapsulated electronic component includes: a substrate; the at least one electronic component; the resin; a plate-like member; and at least one bump. A wiring pattern is formed on the substrate. In the resin-encapsulation step, between a bump-formed surface in a bump-formed plate-like member obtained by forming the at least one bump in the plate-like member and a wiring pattern-formed surface in the substrate, the at least one electronic component is encapsulated in the resin, and the at least one bump is caused to be in contact with the wiring pattern.

Abstract: The present invention provides a method for producing an electronic component, capable of simply and efficiently producing an electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method is a method for producing an electronic component. The electronic component includes: a substrate 21, a chip(s) 31, a resin 41, a plate-like member 11 having a surface(s), a bump(s) 12 that includes a deformable portion 12A, and a wiring pattern 22. The method includes: disposing the chip(s) 31 on the surface(s); and encapsulating the bump(s) 31 in the resin 41. The encapsulating includes: encapsulating the chip(s) 31 in the resin 41 between a bump 12-formed surface of the plate-like member 11 on which the bump(s) 12 is formed and a wiring pattern 22-formed surface of the substrate 21 on which the wiring pattern is formed; and causing the bump(s) 12 to be in contact with the wiring pattern 22.

Abstract: The present invention provides a method for producing an electronic component, capable of simply and efficiently producing an electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method is a method for producing an electronic component. The electronic component includes: a substrate 21, a chip(s) 31, a resin 41, a plate-like member 11 having a surface(s), a bump(s) 12 that includes a deformable portion 12A, and a wiring pattern 22. The method includes: disposing the chip(s) 31 on the surface(s); and encapsulating the bump(s) 31 in the resin 41. The encapsulating includes: encapsulating the chip(s) 31 in the resin 41 between a bump 12-formed surface of the plate-like member 11 on which the bump(s) 12 is formed and a wiring pattern 22-formed surface of the substrate 21 on which the wiring pattern is formed; and causing the bump(s) 12 to be in contact with the wiring pattern 22.

Abstract: The present invention provides a method for producing a resin-encapsulated electronic component, capable of simply and efficiently producing a resin-encapsulated electronic component having both of a via electrode(s) (bump(s)) and a plate-like member. The method includes a resin-encapsulation step of encapsulating at least one electronic component in a resin. A produced resin-encapsulated electronic component includes: a substrate; the at least one electronic component; the resin; a plate-like member; and at least one bump. A wiring pattern is formed on the substrate. In the resin-encapsulation step, between a bump-formed surface in a bump-formed plate-like member obtained by forming the at least one bump in the plate-like member and a wiring pattern-formed surface in the substrate, the at least one electronic component is encapsulated in the resin, and the at least one bump is caused to be in contact with the wiring pattern.

Abstract: The present invention is to provide a method of manufacturing a resin-encapsulated electronic component and an apparatus for manufacturing a resin-encapsulated electronic component that enable the manufacture of a resin-encapsulated electronic component including a plate-like member in a simple manner at low cost. The method of manufacturing a resin-encapsulated electronic component, the resin-encapsulated electronic component including a plate-like member 13, the method includes: placing a resin 15 on the plate-like member 13; transferring the resin 15 to a position of a die cavity 17a of a molding die in a state where the resin 15 is placed on the plate-like member 13; and performing resin-encapsulation of an electronic component by subjecting the resin 15 to compression molding together with the plate-like member 13 and the electronic component in a state where the electronic component is soaked in the resin 15 placed on the plate-like member 13 in the die cavity 17a.

Abstract: The present invention aims at effectively decreasing the installation space of an entire semiconductor chip compression molding apparatus and effectively decreasing the clamping force in dies which are provided in the apparatus. It further aims at performing a clamping, in the case where substrates having a different thickness are used, with an efficient adjustment in accordance with the thicknesses of the substrates. To this end, the semiconductor chip compression molding includes two semiconductor chip compression molding dies (top and bottom dies), and a die opening/closing means for closing the die surfaces of top dies and those of bottom dies in each of the upper and lower dies. The die opening/closing means includes a die opening/closing mechanism having two racks and one pinion, and a thickness adjustment mechanism for adjusting the gaps in accordance with the thicknesses of the substrates supplied to each of the upper and lower dies.

Abstract: Resin molding apparatus includes in unit, press unit and out unit. The in unit transfers not only pre-molding substrate but also resin material. The press unit includes multiple mold assemblies. The out unit transfers molded substrate having been resin-sealed within the mold assemblies. Further, the resin sealing/molding apparatus includes not only carrier rail but also demounting means and supply means traveling along the carrier rail. Furthermore, multiple press units in the state of being linked with each other are disposed between the in unit and the out unit.

Abstract: First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.

Abstract: First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.