Abstract: The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.

Abstract: The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.

Abstract: An impact-resistant film for a flat display panel, which is an impact-resistant film to be bonded to a front glass of a flat display panel main body and which comprises a first layer on the front glass side of the flat display panel, made of a transparent thermosetting resin, and a second layer on the viewer's side of the first layer, made of a transparent synthetic resin having a shear modulus larger than the first layer.

Abstract: An impact-resistance film which is bondable to a front glass of a flat display panel main body that includes a first layer on the front glass side of the flat display panel that is made of a transparent synthetic resin having a shear modulus of from 1×103 Pa to 1×106 Pa. The film includes a second layer on the viewer's side of the first layer that is made of a transparent synthetic resin having a shear modulus of at least 1×108 Pa and includes a third layer on the viewer's side of the second layer that is made of a transparent synthetic resin having a shear modulus of at least 1×106 Pa and less than 1×108 Pa.

Abstract: A process for producing an electromagnetic wave shielding filter, which comprises bonding a substrate (A) having an electrically conductive mesh layer on one side and a functional film layer (c) at the mesh layer (a) side by means of an adhesive layer (b), wherein the laminate disposed in the order of (a)/(b)/(c) is subjected to a fluid pressure treatment.

Abstract: An impact-resistance film for a flat display panel which is to prevent breakage and scattering of glass of the panel when panel receives an impact and which at the same time makes the weight reduction and thickness reduction possible, is presented. An impact-resistant film 30 for a flat display panel, which is an impact-resistant film to be bonded to a front glass 22 of a flat display panel main body 21 and which comprises a first layer 23 on the front glass side of the flat display panel, made of a transparent synthetic resin having a shear modulus of from 1×103 Pa to 1×106 Pa, a second layer 24 on the viewer's side of the first layer, made of a transparent synthetic resin having a shear modulus of at least 1×108 Pa, and a third layer 25 on the viewer's side of the second layer, made of a transparent synthetic resin having a shear modulus of at least 1×106 Pa and less than 1×108 Pa.

Abstract: A memory access method is employed in a multiprocessor system which includes a plurality of system modules coupled via a crossbar module, where each of the system modules includes a buffer which holds data and a plurality of processors having a cache memory which temporarily holds data. The memory access method includes a step, responsive to a read request from a processor within an arbitrary system module, holding data preread from a system module other than the arbitrary system module in a buffer within the crossbar module.

Abstract: A flat display panel comprising a flat display panel main body, and a front protective plate which comprises an antireflection layer, a translucent electrically conductive layer, containing a metal having an electromagnetic wave shielding property and a near infrared ray shielding property, a highly rigid transparent substrate made of a tempered glass or a semi-tempered glass and an adhesive layer laminated in this order, bonded to the viewer's side surface of the flat display panel main body by means of the adhesive layer.

Abstract: A flat display panel comprising a flat display panel main body, and a front protective plate which comprises an antireflection layer, a translucent electrically conductive layer, containing a metal having an electromagnetic wave shielding property and a near infrared ray shielding property, a highly rigid transparent substrate made of a tempered glass or a semi-tempered glass and an adhesive layer laminated in this order, bonded to the viewer's side surface of the flat display panel main body by means of the adhesive layer.

Abstract: An impact-resistant film for a flat display panel, which is an impact-resistant film to be bonded to a front glass of a flat display panel main body and which comprises a first layer on the front glass side of the flat display panel, made of a transparent thermosetting resin, and a second layer on the viewer's side of the first layer, made of a transparent synthetic resin having a shear modulus larger than the first layer.

Abstract: A process for producing an electromagnetic wave shielding filter, which comprises bonding a substrate (A) having an electrically conductive mesh layer on one side and a functional film layer (c) at the mesh layer (a) side by means of an adhesive layer (b), wherein the laminate disposed in the order of (a)/(b)/(c) is subjected to a fluid pressure treatment.

Abstract: A flat display panel comprising a flat display panel main body, and a front protective plate which comprises an antireflection layer, a translucent electrically conductive layer, containing a metal having an electromagnetic wave shielding property and a near infrared ray shielding property, a highly rigid transparent substrate made of a tempered glass or a semi-tempered glass and an adhesive layer laminated in this order, bonded to the viewer's side surface of the flat display panel main body by means of the adhesive layer.

Abstract: A plating method by means of an electroless gold solution under air supply in the form of air bubbles from air dispersing bodies placed on the bottom of a plating tan, whereby more uniform plating can be achieved and the life of the plating solution can be prolonged. Air bubbles are uniformly supplied over the entire region in the plating tank which corresponds to a plating region of a substance to be plated and placed in the plating tank, and the air supply is adjusted depending on the liquid temperature of the plating solution.

Abstract: The present invention provides an electroless gold plating solution which does not precipitate gold at high concentrations of thallium or lead compound, while retaining its effects such as increased deposition rate and larger crystallite sizes in the deposited layer. The electroless gold plating solution according to the invention contains 0.1-10 g/l of a chelating agent, such as diethylenetriaminepentaacetic acid (DTPA), ethylenediaminetetraacetic acid or nitrilotriacetic acid, DTPA being a preferable agent.

Abstract: The present invention provides an electroless gold plating solution which does not precipitate gold at high concentrations of thallium or lead compound, while retaining its effects such as increased deposition rate and larger crystallite sizes in the deposited layer. The electroless gold plating solution according to the invention contains 0.1-10 g/l of a chelating agent, such as diethylenetriaminetetraacetic acid (DTPA), ethylenediaminetetraacetic acid or nitrilotriacetic acid, DTPA being a preferable agent.

Abstract: The present invention provides an electroless gold plating solution which offers deposition layers exactly onto predetermined areas on the surface of the workpiece, without undesirable spread of plated areas. The electroless gold plating solution according to the invention contains 5-500 mg/l, or preferably 10-100 mg/l, or sodium nitrobenzenesulfonate and/or p-nitrobenzoic acid as a reduction inhibitor.

Abstract: The present invention provides an electroless gold plating solution which offers deposition layers exactly onto predetermined areas on the surface of the workpiece, without undesirable spread of prated areas. The electroless gold plating solution according to the invention contains 2-20 g/l of dimethylamine as amine group.

Abstract: A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.

Abstract: A vulcanizable fluororubber composition which comprises:(a) a fluorine-containing elastomeric copolymer of vinylidene fluoride with at least one other ethylenically unsaturated monomer copolymerizable therewith;(b) an organic peroxide;(c) a polyfunctional compound;(d) at least one member selected from the group consisting of bivalent metal hydroxides and bivalent metal oxides; and(e) an organic base.

Abstract: An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof.